Abstract: Embodiments of a microelectronic assembly include: a first integrated circuit (IC) die having a first memory circuit and a second memory circuit; a second IC die; a third IC die; and a package substrate. The second IC die is between the first IC die and the package substrate. The first IC die includes: a first portion comprising a first active region and a first backend region in contact with the first active region; and a second portion comprising a second active region and a second backend region in contact with the second active region. The first memory circuit is in the first portion, the second memory circuit is in the second portion, the first active region comprises transistors that are larger than transistors in the second active region, and the first backend region comprises conductive traces that have a larger pitch than conductive traces in the second backend region.

Abstract: Embodiments of a microelectronic assembly include: a first integrated circuit (IC) die having a first memory circuit and a second memory circuit, a second IC die; a third IC die; and a package substrate. The first IC die comprises: a first portion comprising a first active region and a first backend region in contact with the first active region; and a second portion comprising a second active region and a second backend region in contact with the second active region. The second portion is surrounded by the first portion in plan view, the first memory circuit is in the first portion, the second memory circuit is in the second portion, the first active region comprises transistors that are larger than transistors in the second active region, and the first backend region comprises conductive traces that have a larger pitch than conductive traces in the second backend region.

Abstract: Embodiments of a microelectronic assembly include: a first integrated circuit (IC) die having a first memory circuit and a second memory circuit; a second IC die; a third IC die; and a package substrate. The first IC die is between the second IC die and the package substrate. The first IC die comprises: a first portion comprising a first active region and a first backend region in contact with the first active region; and a second portion comprising a second active region and a second backend region in contact with the second active region. The first memory circuit is in the first portion, the second memory circuit is in the second portion, the first active region comprises transistors that are larger than transistors in the second active region, and the first backend region comprises conductive traces that have a larger pitch than conductive traces in the second backend region.

Abstract: An example IC device formed using trim patterning as described herein may include a support structure, a first elongated structure (e.g., a first fin or nanoribbon) and a second elongated structure (e.g., a second fin or nanoribbon), proximate to an end of the first elongated structure. An angle between a projection of the first elongated structure on the support structure and an edge of the support structure may be between about 5 and 45 degrees, while an angle between a projection of the second elongated structure on the support structure and the edge of the support structure may be less than about 15 degrees.

Abstract: IC devices with angled interconnects are disclosed herein. An interconnect, specifically a trench or line interconnect, is referred to as an “angled interconnect” if the interconnect is neither perpendicular nor parallel to any edges of front or back faces of the support structure, or if the interconnect is not parallel or perpendicular to interconnect in another region of an interconnect layer. Angled interconnects may be used to decrease the area of pitch transition regions. Angled interconnects may also be used to decrease the area of pitch offset regions.

Abstract: Hybrid manufacturing of access transistors for memory, presented herein, explores how IC components fabricated by different manufacturers may be combined in an IC device to achieve advantages in terms of, e.g., performance, density, number of active memory layers, fabrication approaches, and so on. In one aspect, an IC device may include a support, a first circuit over a first portion of the support, a second circuit over a second portion of the support, a scribe line between the first circuit and the second circuit, and one or more electrical traces extending over the scribe line. In another aspect, an IC device may include a support, a memory array, comprising a first circuit over a first portion of the support and one or more layers of capacitors over the first circuit, and a second circuit over a second portion of the support.

Abstract: Described herein are full wafer devices that include passive devices formed in one or more interconnect layers. Interconnect layers are formed over a front side of the full wafer device. A passive device is formed using an additive process that results in a seam running through the passive device. The seam may be, for example, an air gap, a change in material structure, or a region with a different chemical makeup from the surrounding passive device. In some embodiments, the passive devices are formed in global interconnect layers coupling multiple does of the full wafer device.

Abstract: Embodiments of a microelectronic assembly comprise: a plurality of microelectronic sub-assemblies arranged in an array; and a plurality of photonic integrated circuit (PIC) dies, each PIC die having waveguides. Adjacent microelectronic sub-assemblies are coupled to one of the PIC dies by interconnects such that any one PIC die is coupled to more than two adjacent microelectronic sub-assemblies, and the microelectronic sub-assemblies coupled to each PIC die in the plurality of PIC dies are communicatively coupled by the waveguides in the PIC die. Each microelectronic sub-assembly comprises: an interposer integrated circuit (IC) die comprising one or more electrical controller circuit proximate to at least one edge of the interposer IC die; a first plurality of IC dies coupled to a first surface of the interposer IC die; and a second plurality of IC dies coupled to an opposing second surface of the interposer IC die.

Abstract: Embodiments of a microelectronic assembly comprise: a plurality of microelectronic sub-assemblies arranged in a coplanar array, each microelectronic sub-assembly having a first side and an opposing second side; a first conductive plate coupled to the first sides of the microelectronic sub-assemblies; and a second conductive plate coupled to the second sides of the microelectronic sub-assemblies. The first conductive plate and the second conductive plate comprise sockets corresponding to each of the microelectronic sub-assemblies, and each microelectronic sub-assembly comprises a first plurality of integrated circuit (IC) dies coupled on one end to a first IC die and on an opposing end to a second IC die; and a second plurality of IC dies coupled to the first IC die and to the second IC die.

Abstract: Embodiments of a microelectronic assembly comprise: a first plurality of integrated circuit (IC) dies coupled on one end to a first IC die and on an opposing end to a second IC die, and a second plurality of IC dies coupled to at least the first IC die or the second IC die. Each IC die in the first plurality of IC dies includes a respective substrate and a respective metallization stack attached along a respective first planar interface, each of the first IC die and the second IC die includes a respective substrate and a respective metallization stack attached along a respective second planar interface, each IC die in the second plurality of IC dies includes a respective substrate and a respective metallization stack attached along a respective third planar interface, and the first planar interface is orthogonal to the second planar interface.

Abstract: Memory arrays with backside components and angled transistors, and related assemblies and methods, are disclosed herein. A transistor is referred to as an “angled transistor” if a longitudinal axis of an elongated semiconductor structure of the transistor (e.g., a fin or a nanoribbon) is neither perpendicular nor parallel to any edges of front or back sides of a support structure (e.g., a die) over which the transistor is implemented. A component is referred to as a “backside component” if it is provided on the side of a semiconductor substrate that is opposite to the side over which the transistors of the memory arrays are provided. Memory arrays with backside components and angled transistors provide a promising way to increasing densities of memory cells on the limited real estate of semiconductor chips and/or decreasing adverse effects associated with continuous scaling of IC components.

Abstract: Embodiments of an integrated circuit (IC) die comprise: a first region having a first surface and a second surface, the first surface being orthogonal to the second surface; and a second region attached to the first region along a planar interface that is orthogonal to the first surface and parallel to the second surface, the second region having a third surface coplanar with the first surface. The first region comprises: a dielectric material; layers of conductive traces in the dielectric material, each layer of the conductive traces being parallel to the second surface such that the conductive traces are orthogonal to the first surface; conductive vias through the dielectric material; and bond-pads on the first surface, the bond-pads comprising portions of the conductive traces exposed on the first surface, and the second region comprises a material different from the dielectric material.

Abstract: Embodiments of an integrated circuit (IC) die comprise a first region having a first surface and a second surface, the first surface being orthogonal to the second surface; a second region comprising a semiconductor material, the second region attached to the first region along a first planar interface that is orthogonal to the first surface and parallel to the second surface; and a third region comprising optical structures of a photonic IC, the third region attached to the second region along a second planar interface that is parallel to the first planar interface. The first region comprises: a plurality of layers of conductive traces in a dielectric material, each layer of the conductive traces being parallel to the second surface such that the conductive traces are orthogonal to the first surface; and bond-pads on the first surface, the bond-pads comprising portions of respective conductive traces exposed on the first surface.

Abstract: Embodiments of an integrated circuit (IC) die comprise: a first IC die coupled to at least two second IC dies by interconnects on a first surface of the first IC die and second surfaces of the second IC dies such that the first surface is in contact with the second surfaces. The second surfaces are coplanar, the interconnects comprise dielectric-dielectric bonds and metal-metal bonds, the metal-metal bonds include first bond-pads in the first IC die and second bond-pads in the second IC dies, the first IC die comprises a substrate attached to a metallization stack along a planar interface that is orthogonal to the first surface, the metallization stack comprises a plurality of layers of conductive traces in a dielectric material, and the first bond-pads comprise portions of the conductive traces exposed on the first surface.

Abstract: IC devices with logic circuits using vertical transistors with backside source or drain (S/D) regions, and related assemblies and methods, are disclosed herein. An example vertical transistor includes an elongated structure (e.g., a nanoribbon) of one or more semiconductor materials extending between a first side (e.g., a back side) and an opposing second side (e.g., a front side) of a substrate. The first S/D region of the transistor may be provided at the first side of the substrate, while the second S/D region of the transistor may be provided at the second side, with the channel region of the transistor being the portion of the elongated structure between the first and second S/D regions. Implementing various logic circuits using vertical transistors with backside S/D regions may provide a promising way to increasing densities of transistors on the limited real estate of semiconductor chips and/or decreasing short-channel effects associated with continuous scaling of IC components.

Abstract: Embodiments of an integrated circuit (IC) die comprise: a first region having a first surface; a second region attached to the first region along a first planar interface that is orthogonal to the first surface; and a third region attached to the second region along a second planar interface that is parallel to the first planar interface, the third region having a second surface, the second surface being coplanar with the first surface. The first region and the third region comprise a plurality of layers of conductive traces in a dielectric material, the conductive traces being orthogonal to the first and second surfaces; and bond-pads on the first and second surfaces, the bond-pads comprising portions of the respective conductive traces exposed on the first and second surfaces.

Abstract: SRAM devices with angled transistors, and related assemblies and methods, are disclosed herein. A transistor is referred to as “angled” if a longitudinal axis of an elongated semiconductor structure (e.g., a fin or a nanoribbon) based on which the transistor is built is at an angle other than 0 degrees or 90 degrees with respect to the edges of front or back faces of a support structure or a die on/in which the transistor resides, e.g., at an angle between about 10 and 80 degrees with respect to at least one of such edges. Implementing at least some of the transistors of SRAM cells as angled transistors may provide a promising way to increasing densities of SRAM cells on the limited real estate of semiconductor chips.

Abstract: IC devices with angled transistors and angled routing tracks, and related assemblies and methods, are disclosed herein. A transistor is referred to as an “angled transistor” if a longitudinal axis of an elongated semiconductor structure of the transistor (e.g., a fin or a nanoribbon) is neither perpendicular nor parallel to any edges of front or back sides of a support structure (e.g., a die) over which the transistor is implemented. Similarly, a routing track is referred to as an “angled routing track” if the routing track is neither perpendicular nor parallel to any edges of front or back faces of the support structure. Angled transistors and angled routing tracks provide a promising way to increasing densities of transistors on the limited real estate of semiconductor chips and/or decreasing adverse effects associated with continuous scaling of IC components.

Abstract: Embodiments of an integrated circuit (IC) die comprise: a metallization stack including a dielectric material, a plurality of layers of conductive traces in the dielectric material and conductive vias through the dielectric material; and a substrate attached to the metallization stack along a planar interface. The metallization stack comprises bond-pads on a first surface, a second surface, a third surface, a fourth surface, and a fifth surface. The first surface is parallel to the planar interface between the metallization stack and the substrate, the second surface is parallel to the third surface and orthogonal to the first surface, and the fourth surface is parallel to the fifth surface and orthogonal to the first surface and the second surface.

Abstract: IC devices implementing 2T memory cells with source-drain coupling in one transistor, and related assemblies and methods, are disclosed herein. In particular, 2T memory cells presented herein use first and second transistors arranged so that source and drain terminals of the second transistor are coupled to one another. A memory state may be represented by charge indicative of the bit value stored in the second transistor, while the first transistor may serve as a switch to control access to the second transistor. 2T memory cells with source-drain coupling in one transistor provide a promising way to increasing memory cell densities, drive current, and design flexibility in making electrical connections to, or between, various transistor terminals and control lines of memory arrays, thus providing good scalability in the number of 2T memory cells included in memory arrays.