Patents by Inventor Puwei Liu

Puwei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220380645
    Abstract: Disclosed herein are methods of making an adhesive composition, the methods comprising providing a polyurethane acrylate and combining with a vinyl ether and co-curing the combination to form an adhesive composition, wherein after curing the adhesive composition has a modulus at ?20° C. of less than about 10.0 mPa and a creep recovery of greater than about 50%. Also disclosed are the resulting adhesive compositions.
    Type: Application
    Filed: July 27, 2022
    Publication date: December 1, 2022
    Inventors: Puwei Liu, Nicolas Ball Jones, Mark Jason, Zhan Hang Yang
  • Publication number: 20220325151
    Abstract: Two part curable compositions are provided which include a first part comprising a (meth)acrylate component and an amine and a second part comprising a fatty acid peroxide. Further disclosed are methods of preparing a two part adhesive composition using the two part curable compositions and methods of bonding surfaces using the two part curable compositions.
    Type: Application
    Filed: June 20, 2022
    Publication date: October 13, 2022
    Inventors: Puwei Liu, Qinyan Zhu, Kevin J. Welch
  • Patent number: 11174419
    Abstract: Provided herein are high refractive index compositions with excellent light stability, and methods for the use thereof, as well as assemblies and articles prepared using invention formulations and methods.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 16, 2021
    Inventors: Puwei Liu, Jiangbo Ouyang, ChunHua Gu
  • Publication number: 20190218434
    Abstract: Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.
    Type: Application
    Filed: February 27, 2019
    Publication date: July 18, 2019
    Inventors: Puwei Liu, Jiangbo Ouyang, ChunHua Gu
  • Patent number: 10189121
    Abstract: The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: January 29, 2019
    Assignee: Henkel IP & Holding GmbH
    Inventor: Puwei Liu
  • Publication number: 20180127537
    Abstract: In accordance with the present invention, there are provided methods to improve the performance properties of thermoset polymer resins prepared by the activation of one or more reactive monomer(s) which is(are) initiated by way of a first reaction mechanism at a defined temperature (typically a temperature in the range of 40-200° C.). Exemplary performance properties which are improved by the invention methods include enhanced thermal stability, tensile strength (which is maintained in spite of exposure to elevated temperatures over extended periods of time), adhesive properties (which are substantially maintained in spite of exposure to elevated temperatures over extended periods of time), weight loss (which is minimized in spite of exposure to elevated temperatures over extended periods of time), dielectric strength (which is substantially maintained in spite of exposure to elevated temperatures over extended periods of time), and the like.
    Type: Application
    Filed: June 19, 2017
    Publication date: May 10, 2018
    Inventor: Puwei Liu
  • Publication number: 20170259383
    Abstract: The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
    Type: Application
    Filed: May 18, 2017
    Publication date: September 14, 2017
    Inventor: Puwei Liu
  • Patent number: 9682447
    Abstract: The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: June 20, 2017
    Assignee: Henkel IP & Holding GmbH
    Inventor: Puwei Liu
  • Patent number: 9427829
    Abstract: The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: August 30, 2016
    Assignee: Henkel IP & Holding GmbH
    Inventors: Puwei Liu, Barry N. Burns, Matthew J. Holloway, Blake Olsen, Edward Ho, John Killoran
  • Publication number: 20140264165
    Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: Puwei Liu, Donghang Xie, Emilie Barriau, Shengqian Kong
  • Patent number: 8835574
    Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: September 16, 2014
    Assignee: Henkel IP Holding GmbH
    Inventors: My Nguyen, Tadashi Takano, Puwei Liu
  • Publication number: 20140220337
    Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
    Type: Application
    Filed: December 23, 2013
    Publication date: August 7, 2014
    Applicant: Henkel US IP LLC
    Inventors: My Nguyen, Tadashi Takano, Puwei Liu
  • Publication number: 20140209951
    Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.
    Type: Application
    Filed: March 28, 2014
    Publication date: July 31, 2014
    Applicants: HENKEL IP & HOLDING GMBH, HENKEL AG & CO. KGAA
    Inventors: Shengqian Kong, Puwei Liu, Stijn Gillissen, Donghang Xie, Lirong Bao, Daniel J. Duffy, Allison Yue Xiao, Emilie Barriau
  • Publication number: 20140182746
    Abstract: The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
    Type: Application
    Filed: March 6, 2014
    Publication date: July 3, 2014
    Applicant: Henkel IP & Holding GmbH
    Inventors: Puwei Liu, Barry N. Burns, Matthew J. Holloway, Blake Olsen, Edward Ho, John Killoran
  • Patent number: 8698320
    Abstract: This invention relates to thermosetting resin compositions useful for flip chip (“FC”) underfill sealant materials, where a semiconductor chip is mounted directly onto a circuit through solder electrical interconnections. Similarly, the compositions are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: April 15, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: My Nhu Nguyen, Puwei Liu
  • Patent number: 8486498
    Abstract: The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: July 16, 2013
    Assignees: Henkel Corporation, Henkel Ireland Limited
    Inventors: Puwei Liu, Matthew James Holloway, Blake Olsen
  • Patent number: 8338536
    Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: December 25, 2012
    Assignee: Henkel Corporation
    Inventors: My Nguyen, Tadashi Takano, Puwei Liu
  • Patent number: 8278396
    Abstract: A curing agent for epoxy resin has one or more five- or six-membered aromatic rings, and substituted on the one or more five- or six-membered rings at least two functionalities reactive with the epoxy selected from the group consisting of hydroxyl, amine, imidazole, azine, hydrazide, anhydride, and Lewis acid groups. Choice of functionality can provide a mixed polymer network, one with a more densely cross-linked polymer structure having a high Tg, and the other with a more linear polymer structure to contribute to stress reduction.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: October 2, 2012
    Assignee: Henkel Corporation
    Inventors: Pukun Zhu, Puwei Liu
  • Publication number: 20110301291
    Abstract: A curable composition comprising an oxazoline and/or an oxazine and a cationic cure initiator, in the absence of any phenolic compounds, is suitable for use as a molding or coating composition for semiconductor boards and devices.
    Type: Application
    Filed: August 17, 2011
    Publication date: December 8, 2011
    Inventor: Puwei Liu
  • Publication number: 20110265913
    Abstract: The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer.
    Type: Application
    Filed: May 23, 2011
    Publication date: November 3, 2011
    Applicants: Loctite (R&D) Limited, Henkel Corporation
    Inventors: Puwei Liu, Matthew James Holloway, Blake Olsen