Patents by Inventor Puya Javidmand

Puya Javidmand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210180807
    Abstract: Various embodiments of a heat pump system are disclosed to provide improved and flexible heat pump operation when dehumidification of the conditioned space is required. In one embodiment, a heat pump system includes a heat pump loop comprising a refrigerant circuit that fluidly interconnects (1) a compressor; (2) a source heat exchanger; (3) a source heat exchanger bypass circuit comprising a bypass valve; (4) a space heat exchanger; (5) a reversing valve positioned on the discharge side of the compressor; (6) a reheat circuit comprising a reheat heat exchanger; (7) first and second expansion devices; and (8) first and second expansion device bypass circuits configured to allow refrigerant to bypass the first and second expansion devices, respectively, where the first and second bypass circuits include first and second check valves, respectively; and (9) a 3-way valve configured to selectively direct refrigerant flow to the first expansion device, the reheat circuit, and the second expansion device.
    Type: Application
    Filed: February 28, 2021
    Publication date: June 17, 2021
    Inventors: Michael F. Taras, Puya Javidmand
  • Patent number: 10935260
    Abstract: Various embodiments of a heat pump system are disclosed to provide improved and flexible heat pump operation when dehumidification of the conditioned space is required. In one embodiment, a heat pump system includes a heat pump loop comprising a refrigerant circuit that fluidly interconnects (1) a compressor; (2) a source heat exchanger; (3) a source heat exchanger bypass circuit comprising a bypass valve; (4) a space heat exchanger; (5) a reversing valve positioned on the discharge side of the compressor; (6) a reheat circuit comprising a reheat heat exchanger; (7) first and second expansion devices; and (8) first and second expansion device bypass circuits configured to allow refrigerant to bypass the first and second expansion devices, respectively, where the first and second bypass circuits include first and second check valves, respectively; and (9) a 3-way valve configured to selectively direct refrigerant flow to the first expansion device, the reheat circuit, and the second expansion device.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: March 2, 2021
    Assignee: Climate Master, Inc.
    Inventors: Michael F. Taras, Puya Javidmand
  • Publication number: 20190178509
    Abstract: Various embodiments of a heat pump system are disclosed to provide improved and flexible heat pump operation when dehumidification of the conditioned space is required. In one embodiment, a heat pump system includes a heat pump loop comprising a refrigerant circuit that fluidly interconnects (1) a compressor; (2) a source heat exchanger; (3) a source heat exchanger bypass circuit comprising a bypass valve; (4) a space heat exchanger; (5) a reversing valve positioned on the discharge side of the compressor; (6) a reheat circuit comprising a reheat heat exchanger; (7) first and second expansion devices; and (8) first and second expansion device bypass circuits configured to allow refrigerant to bypass the first and second expansion devices, respectively, where the first and second bypass circuits include first and second check valves, respectively; and (9) a 3-way valve configured to selectively direct refrigerant flow to the first expansion device, the reheat circuit, and the second expansion device.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 13, 2019
    Inventors: Michael F. Taras, Puya Javidmand