Abstract: A surface light source module includes a substrate, a plurality of light-emitting elements mounted on the substrate, a first optical layer disposed on the light-emitting elements to cover the light-emitting elements and configured to disperse light emitted from the light-emitting elements, and a second optical layer disposed on the first optical layer and configured to absorb the light emitted from the light-emitting elements and emit light of a different wavelength band from a wavelength of the absorbed light, wherein a distance from an upper surface of the first optical layer to an upper surface of the second optical layer has a value less than a distance from an upper surface of the substrate to the upper surface of the first optical layer.

Abstract: A surface light source module includes a substrate, a plurality of light-emitting elements mounted on the substrate, a first optical layer disposed on the light-emitting elements to cover the light-emitting elements and configured to disperse light emitted from the light-emitting elements, and a second optical layer disposed on the first optical layer and configured to absorb the light emitted from the light-emitting elements and emit light of a different wavelength band from a wavelength of the absorbed light, wherein a distance from an upper surface of the first optical layer to an upper surface of the second optical layer has a value less than a distance from an upper surface of the substrate to the upper surface of the first optical layer.

Abstract: A light-emitting device package includes a frame including one side on which a first electrode is formed and the other side on which a second electrode is formed, an LED chip including a first conductive connection pad electrically connected to the first electrode and a second conductive connection pad electrically connected to the second electrode, a reflective member disposed on the frame, forming a cavity for accommodating the LED chip therein, and reflecting light emitted from the LED chip, and a wavelength conversion member filled in the cavity to cover the LED chip, wherein the reflective member includes a first side and a second side different from the first side, and a first height of the first side and a second height of the second side are formed to be different from each other.

Abstract: A light-emitting device package includes an LED chip including a substrate having an upper surface, a semiconductor laminate structure formed under the substrate, and a first conductive connection pad and a second conductive connection pad formed under the semiconductor laminate structure, a wavelength conversion member having one surface in contact with the upper surface of the substrate, a light transmitting member covering a side surface of the LED chip and one surface of the wavelength conversion member adjacent to the side surface, and a reflector including at least one first region covering a side surface of the wavelength conversion member and the light transmitting member, and at least one second region covering the light transmitting member and exposing the side surface of the wavelength conversion member.

Abstract: Provided is a method of manufacturing a micro LED panel, the method including preparing a backplane; forming a plurality of micro LED cells in a matrix shape on a bottom portion of a growth substrate; bonding the micro LED cells to the backplane; separating the growth substrate from the micro LED cells; and disposing a partitioning wall structure on top portions of the micro LED cells, wherein the partitioning wall structure includes a light-transmitting member having a first surface facing light-emitting surfaces of the micro LED cells and a second surface facing the first surface, the light-transmitting member includes a plurality of first grooves formed to correspond in between the plurality of micro LED cells on any one of the first surface and the second surface, and the plurality of first grooves are filled with a partitioning wall composition to form partitioning walls.