Abstract: The disclosure provides an illumination device including a light-emitting element array, a lens array, an infrared light-emitting element array, at least one light sensing element, and a control unit. The light-emitting element array includes a plurality of micro light-emitting diodes arranged in an array. The lens array includes a plurality of lenses. The infrared light-emitting element array includes a plurality of infrared micro light-emitting diodes arranged in an array form, and the infrared micro light-emitting diodes are respectively configured in the light-emitting element array. Each infrared micro light-emitting diode and the at least one light sensing element are configured to provide a plurality of ranging data. The control unit controls each micro light-emitting diode to generate a plurality of light beams according to the ranging data so as to form a plurality of illumination light beams, and the illumination light beams illuminate a target in a pixelated form.

Abstract: A light-emitting device including a substrate, plural light-emitting units, and a sealing member is disclosed. The substrate includes plural electrode pads. The light-emitting units are disposed on the substrate and each include an LED chip. The LED chips are electrically connected with the electrode pads. The sealing member is disposed on the substrate, covers a side surface of each of the light-emitting units, and includes a surrounding portion surrounding the light-emitting units and a separating portion disposed between the light-emitting units. An LED package structure including the aforementioned substrate, light-emitting units, and sealing member is also disclosed. The light-emitting units can generate light of different colors or color temperatures and allow adjustment of the colors or color temperatures.

Abstract: A light-emitting device including a substrate, plural light-emitting units, and a sealing member is disclosed. The substrate includes plural electrode pads. The light-emitting units are disposed on the substrate and each include an LED chip. The LED chips are electrically connected with the electrode pads. The sealing member is disposed on the substrate, covers a side surface of each of the light-emitting units, and includes a surrounding portion surrounding the light-emitting units and a separating portion disposed between the light-emitting units. An LED package structure including the aforementioned substrate, light-emitting units, and sealing member is also disclosed. The light-emitting units can generate light of different colors or color temperatures and allow adjustment of the colors or color temperatures.