Patents by Inventor Pyo KWAK

Pyo KWAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10939549
    Abstract: A self-transforming flexible electronic device, according to an embodiment of the present invention, comprises: a substrate having flexible properties and a flexible electronic device attached thereon; shape memory alloys provided on one lateral side of the substrate; and photoresists for fixing the shape memory alloys to the substrate, wherein the shape memory alloys are arranged on the substrate in the form of a plurality of lines, the photoresists are disposed in plurality along the extension direction of each shape memory alloy, and the shape memory alloys can be fixed inside the photoresists and at a predetermined distance away from the substrate.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: March 2, 2021
    Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jongho Lee, Pyo Kwak
  • Publication number: 20180332703
    Abstract: A self-transforming flexible film, according to an embodiment of the present invention, comprises: a substrate having flexible properties and a flexible electronic device attached thereon; shape memory alloys provided on one lateral side of the substrate; and photosensitizers for fixing the shape memory alloys to the substrate, wherein the shape memory alloys are arranged on the substrate in the form of a plurality of lines, the photosensitizers are disposed in plurality along the extension direction of each shape memory alloy, and the shape memory alloys can be fixed inside the photosensitizers and at a predetermined distance away from the substrate.
    Type: Application
    Filed: October 28, 2016
    Publication date: November 15, 2018
    Applicant: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jongho LEE, Pyo KWAK
  • Patent number: 9316526
    Abstract: Embodiments of the invention are directed towards a sliding liquid level sensor which is mounted in a fuel tank of a vehicle for detecting a remaining amount of a liquid fuel in the tank. The liquid level sensor has a float, a plurality of electrodes, and a sliding contact point configured to slide on the electrodes in accordance with a displacement of the float. The electrodes preferably contain 100 parts by weight of a silver-palladium alloy and preferably 3-20 parts by weight of glass. The silver-palladium alloy preferably contains 20-60% by weight of silver and preferably 80-40% by weight of palladium. The sliding contact point is made from a palladium-nickel alloy that preferably contains 70-90% by weight of palladium and preferably 30-10% by weight of nickel.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: April 19, 2016
    Assignees: AISAN KOGYO KABUSHIKI KAISHA, HYUNDAM IND. CO., LTD
    Inventors: Kunio Takagi, Jin Wook Jang, Hoon Pyo Kwak
  • Publication number: 20130239677
    Abstract: Embodiments of the invention are directed towards a sliding liquid level sensor which is mounted in a fuel tank of a vehicle for detecting a remaining amount of a liquid fuel in the tank. The liquid level sensor has a float, a plurality of electrodes, and a sliding contact point configured to slide on the electrodes in accordance with a displacement of the float. The electrodes preferably contain 100 parts by weight of a silver-palladium alloy and preferably 3-20 parts by weight of glass. The silver-palladium alloy preferably contains 20-60% by weight of silver and preferably 80-40% by weight of palladium. The sliding contact point is made from a palladium-nickel alloy that preferably contains 70-90% by weight of palladium and preferably 30-10% by weight of nickel.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 19, 2013
    Applicants: HYUNDAM IND. CO., LTD, AISAN KOGYO KABUSHIKI KAISHA
    Inventors: Kunio TAKAGI, Jin Wook JANG, Hoon Pyo KWAK
  • Publication number: 20100193940
    Abstract: The present invention relates to a wafer level package and a method of manufacturing the same. The wafer level package includes a first substrate including a first region and second regions with grooves around the first region; a semiconductor device positioned in the first region; first sealing members positioned in the grooves; a second substrate including projection units corresponding to the second regions in order to form a cavity corresponding to the first region; and second sealing members which are positioned above the projection units and laminate the first and second substrates to each other by being bonded to the first sealing members, and can prevent the sealing members from flowing to any region except for the sealing regions.
    Type: Application
    Filed: March 26, 2009
    Publication date: August 5, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hyun Kim, Tae Hoon Kim, Yun Pyo Kwak, Sung Keun Park, Jong Yeol Jeon