Patents by Inventor Pyoung Gug Kim
Pyoung Gug Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210091273Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting devType: ApplicationFiled: November 17, 2020Publication date: March 25, 2021Applicant: LUMENS CO., LTD.Inventors: Seung Hyun OH, Jung Hyun PARK, Byeong Geon KIM, Pyoung Gug KIM, Sung Sik JO, Jae Yoon LIM, Ho Joong LIM
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Patent number: 10879432Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting devType: GrantFiled: February 11, 2019Date of Patent: December 29, 2020Assignee: LUMENS CO., LTD.Inventors: Seung Hyun Oh, Jung Hyun Park, Byeong Geon Kim, Pyoung Gug Kim, Sung Sik Jo, Jae Yoon Lim, Ho Joong Lim
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Publication number: 20190296196Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting devType: ApplicationFiled: February 11, 2019Publication date: September 26, 2019Applicant: LUMENS CO., LTD.Inventors: Seung Hyun OH, Jung Hyun PARK, Byeong Geon KIM, Pyoung Gug KIM, Sung Sik JO, Jae Yoon LIM, Ho Joong LIM
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Patent number: 9748459Abstract: There are provided a chip-on-board type light emitting device package capable of improving structural reliability and heat-dissipating efficiency and reducing a manufacturing cost, and a method for manufacturing the same. The chip-on-board type light emitting device package includes: a dual frame including a base frame on which a plurality of light emitting devices are mounted and an electrode frame positioned above the base frame so as to be spaced apart from the base frame and including two electrodes separated from each other; and a molding part coupled to the dual frame so that the base frame and the electrode frame are spaced apart from each other and having an opening through which light generated in the plurality of light emitting devices is to be emitted, wherein the base frame has a through-hole through which the electrode frame is exposed.Type: GrantFiled: August 12, 2014Date of Patent: August 29, 2017Assignee: LUMENS CO., LTD.Inventors: Seung-Hyun Oh, Pyoung-Gug Kim, Yun-Geon Cho, Chun-Ki Min, Chul-Yeun Choi, Dae-Gil Jung
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Patent number: 9690030Abstract: A light emitting device capable of bonding a lens at a preset accurate position, and a backlight unit comprising the same are provided. The light emitting device includes a molded material having an opening through which light generated from a light emitting element disposed in the molded material is emitted, a projecting support disposed along at least part of a circumference of the opening of the molded material, and a lens having an inner surface that defines an internal surface on which light emitted from the light emitting element is incident, an outer surface that defines an external surface from which the incident light is emitted to the outside, and a bottom surface that connects the inner surface and the outer surface, wherein a boundary between the inner surface and the bottom surface, a lower part of the inner surface, or the bottom surface contacts the projecting support.Type: GrantFiled: November 29, 2013Date of Patent: June 27, 2017Assignee: LUMENS CO., LTD.Inventors: Seung Hyun Oh, Pyoung Gug Kim, Seung Hoon Lee
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Publication number: 20160190411Abstract: There are provided a chip-on-board type light emitting device package capable of improving structural reliability and heat-dissipating efficiency and reducing a manufacturing cost, and a method for manufacturing the same. The chip-on-board type light emitting device package includes: a dual frame including a base frame on which a plurality of light emitting devices are mounted and an electrode frame positioned above the base frame so as to be spaced apart from the base frame and including two electrodes separated from each other; and a molding part coupled to the dual frame so that the base frame and the electrode frame are spaced apart from each other and having an opening through which light generated in the plurality of light emitting devices is to be emitted, wherein the base frame has a through-hole through which the electrode frame is exposed.Type: ApplicationFiled: August 12, 2014Publication date: June 30, 2016Applicant: LUMENS CO., LTD.Inventors: Seung-Hyun OH, Pyoung-Gug KIM, Yun-Geon CHO, Chun-Ki MIN, Chul-Yeun CHOI, Dae-Gil JUNG
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Publication number: 20150316700Abstract: A light emitting device capable of bonding a lens at a preset accurate position, and a backlight unit comprising the same are provided. The light emitting device includes a molded material having an opening through which light generated from a light emitting element disposed in the molded material is emitted, a projecting support disposed along at least part of a circumference of the opening of the molded material, and a lens having an inner surface that defines an internal surface on which light emitted from the light emitting element is incident, an outer surface that defines an external surface from which the incident light is emitted to the outside, and a bottom surface that connects the inner surface and the outer surface, wherein a boundary between the inner surface and the bottom surface, a lower part of the inner surface, or the bottom surface contacts the projecting support.Type: ApplicationFiled: November 29, 2013Publication date: November 5, 2015Inventors: Seung Hyun OH, Pyoung Gug KIM, Seung Hoon LEE
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Patent number: 9142747Abstract: Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.Type: GrantFiled: November 16, 2012Date of Patent: September 22, 2015Assignee: LUMENS CO., LTD.Inventors: Seung Hyun Oh, Pyoung Gug Kim, Seung Hoon Lee, Chun Ki Min, Jung A Lim, Jun Hyung Lim, Cheol Hun Jung, Bo Hyun Chung
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Publication number: 20140328083Abstract: Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.Type: ApplicationFiled: November 16, 2012Publication date: November 6, 2014Inventors: Seung Hyun Oh, Pyoung Gug Kim, Seung Hoon Lee, Chun Ki Min, Jung A Lim, Jun Hyung Lim, Cheol Hun Jung, Bo Hyun Chung
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Patent number: RE47444Abstract: Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.Type: GrantFiled: May 5, 2016Date of Patent: June 18, 2019Assignee: LUMENS CO., LTD.Inventors: Seung Hyun Oh, Pyoung Gug Kim, Seung Hoon Lee, Chun Ki Min, Jung A Lim, Jun Hyung Lim, Cheol Hun Jung, Bo Hyun Chung
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Patent number: RE48474Abstract: Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.Type: GrantFiled: October 23, 2018Date of Patent: March 16, 2021Assignee: LUMENS CO., LTD.Inventors: Seung Hyun Oh, Pyoung Gug Kim, Seung Hoon Lee, Chun Ki Min, Jung A Lim, Jun Hyung Lim, Cheol Hun Jung, Bo Hyun Chung