Patents by Inventor Pyoung-Ho Lim

Pyoung-Ho Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7398676
    Abstract: A leak sensor and a leak sensing system are provided. The leak sensor preferably includes a fluid sensing member that is capable of sensing and indicating the presence of a fluid leaked from a fluid storage or transport member. The leak sensor further preferably includes at least two wires communicating with the fluid sensing member. The wires are preferably configured to be short-circuited when they contact the fluid leaked from the fluid storage or transport member. An electrical signal corresponding to a leak sensor location can thereby be sent to a control terminal of the leak sensing system. A portion of the wires may be arranged in a cable coated with a protective material such as TeflonĀ®. The control box (or terminal) preferably receives electrical signals from a plurality of leak sensors. The electrical signals can provide information on whether the fluid has leaked and on which leak sensor or sensors have detected the fluid leak.
    Type: Grant
    Filed: May 11, 2006
    Date of Patent: July 15, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Pyoung-Ho Lim, Jong-Kook Song, Sung-Ho Jo, Ki-Hwan Park, Tae-Gun Kim, Woo-Koen Kim
  • Publication number: 20070163627
    Abstract: Provided are a nozzle and a related substrate treatment apparatus. The substrate treatment apparatus includes a process chamber, a supporting member disposed in the process chamber to support substrates, and a nozzle disposed in the process chamber to supply treatment fluid. The nozzle includes an outer tube along which a plurality of spraying holes are formed and which has a first end that is closed and an inner tube inserted into the outer tube through a hole formed on a second end of the outer tube.
    Type: Application
    Filed: January 16, 2007
    Publication date: July 19, 2007
    Inventors: Pyoung-Ho Lim, Jong-Kook Song, Han-Mil Kim
  • Publication number: 20070006638
    Abstract: A leak sensor and a leak sensing system are provided. The leak sensor preferably includes a fluid sensing member that is capable of sensing and indicating the presence of a fluid leaked from a fluid storage or transport member. The leak sensor further preferably includes at least two wires communicating with the fluid sensing member. The wires are preferably configured to be short-circuited when they contact the fluid leaked from the fluid storage or transport member. An electrical signal corresponding to a leak sensor location can thereby be sent to a control terminal of the leak sensing system. A portion of the wires may be arranged in a cable coated with a protective material such as Teflon. The control box (or terminal) preferably receives electrical signals from a plurality of leak sensors. The electrical signals can provide information on whether the fluid has leaked and on which leak sensor or sensors have detected the fluid leak.
    Type: Application
    Filed: May 11, 2006
    Publication date: January 11, 2007
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Pyoung-Ho LIM, Jong-Kook SONG, Sung-Ho JO, Ki-Hwan PARK, Tae-Gun KIM, Woo-Koen KIM
  • Publication number: 20040222191
    Abstract: Provided are exemplary methods and equipment for wet etching processes that utilize etchant solutions at elevated temperatures, particularly for wet etch processes incorporated in the production of semiconductor devices. According to the exemplary methods, the semiconductor wafers to be etched are preheated using one or more of a variety of methods and apparatus prior to immersion in the hot etchant solution. This preheating of the semiconductor wafers reduces or eliminates temperature variation in etchant solution resulting from the insertion of the semiconductor wafers thereby improving the consistency and repeatability of the etch process.
    Type: Application
    Filed: May 7, 2004
    Publication date: November 11, 2004
    Inventors: Tai-Gyun Kim, Jong-Kook Song, Ki-Hwan Park, Pyoung-Ho Lim