Patents by Inventor Qi Deng
Qi Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240097434Abstract: A method for detecting abnormal direct current voltage measurement in a modular multilevel converter high voltage direct current transmission system is provided. In the method, a valve group voltage at a detection pole is obtained, voltages at voltage measurement points at the detection pole are collected, and comparison and determination are performed based on the actual arrangement of the voltage measurement points, and then whether an abnormal measurement occurs at each of the voltage measurement points is determined.Type: ApplicationFiled: May 18, 2022Publication date: March 21, 2024Applicant: ELECTRIC POWER RESEARCH INSTITUTE. CHINA SOUTHERN POWER GRIDInventors: Qinlei CHEN, Shuyong LI, Qi GUO, Libin HUANG, Xuehua LIN, Zhijiang LIU, Deyang CHEN, Chao LUO, Guanming ZENG, Mengjun LIAO, Lijun DENG, Liu CUI, Zhida HUANG, Haiping GUO, Tianyu GUO
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Publication number: 20240067546Abstract: A device and method for enhancing nitrogen and phosphorus removal based on a multistage AO partial denitrification coupled with Anammox process in combination with a sludge hydrolytic acidification mixture belong to the technical field of active sludge method wastewater treatment. A system includes a water tank, a water pump, a biochemical reaction zone, a hydrolytic acidification tank and other devices.Type: ApplicationFiled: July 21, 2021Publication date: February 29, 2024Inventors: Yongzhen Peng, Qi Zhao, Ruitao Gao, Jianwei Li, Liyan Deng
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Publication number: 20240061887Abstract: The present disclosure provides an information search method and apparatus, a computer device and a storage medium. The method includes: receiving search information; acquiring multiple pieces of topic content corresponding to a keyword in the search information and first book information included in each piece of topic content; and displaying a topic card on a search result page, wherein the topic card includes the multiple pieces of topic content and the first book information. In this way, book information related to the search information can be found by searching for the topic content without limiting the search information input by a user. Therefore, this search method can adapt to various search information input by the user, and the search efficiency of the user is thus improved.Type: ApplicationFiled: November 2, 2023Publication date: February 22, 2024Inventors: Jinghua LI, Guibo Pan, Yiyong Li, Dongling Gao, Qi Deng
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Patent number: 11845466Abstract: A normal distributions transform (NDT) method for LiDAR point cloud localization in unmanned driving is provided. The method proposes a non-recursive, memory-efficient data structure occupation-aware-voxel-structure (OAVS), which speeds up each search operation. Compared with a tree-based structure, the proposed data structure OAVS is easy to parallelize and consumes only about 1/10 of memory. Based on the data structure OAVS, the method proposes a semantic-assisted OAVS-based (SEO)-NDT algorithm, which significantly reduces the number of search operations, redefines a parameter affecting the number of search operations, and removes a redundant search operation. In addition, the method proposes a streaming field-programmable gate array (FPGA) accelerator architecture, which further improves the real-time and energy-saving performance of the SEO-NDT algorithm. The method meets the real-time and high-precision requirements of smart vehicles for three-dimensional (3D) lidar localization.Type: GrantFiled: September 22, 2021Date of Patent: December 19, 2023Assignee: SHANGHAITECH UNIVERSITYInventors: Qi Deng, Hao Sun, Yajun Ha, Hui Wang
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Publication number: 20230306186Abstract: Provided are text content presentation method and apparatus, computing device and storage medium. The method comprises: acquiring a text to be presented that comprises multiple pieces of text contents, and a target reading auxiliary text corresponding to at least one piece of target text content among the multiple pieces of text content; and in response to presenting the target text content on a reading page, presenting, in a first area of the reading page, the target reading auxiliary text corresponding to the target text content, wherein the position of the first area in the reading page is related to the position of the target text content in the reading page.Type: ApplicationFiled: May 31, 2023Publication date: September 28, 2023Inventors: Qi DENG, Yifan TAN
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Patent number: 11749647Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.Type: GrantFiled: December 30, 2020Date of Patent: September 5, 2023Assignee: Western Digital Technologies, Inc.Inventors: Xiaofeng Di, Junrong Yan, CheeKeong Chin, Weili Wang, Xin Lu, Qi Deng, Chaur Yang Ng, Cong Zhang, Chenlin Yang, Chin-Tien Chiu
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Publication number: 20230192123Abstract: A normal distributions transform (NDT) method for LiDAR point cloud localization in unmanned driving is provided. The method proposes a non-recursive, memory-efficient data structure occupation-aware-voxel-structure (OAVS), which speeds up each search operation. Compared with a tree-based structure, the proposed data structure OAVS is easy to parallelize and consumes only about 1/10 of memory. Based on the data structure OAVS, the method proposes a semantic-assisted OAVS-based (SEO)-NDT algorithm, which significantly reduces the number of search operations, redefines a parameter affecting the number of search operations, and removes a redundant search operation. In addition, the method proposes a streaming field-programmable gate array (FPGA) accelerator architecture, which further improves the real-time and energy-saving performance of the SEO-NDT algorithm. The method meets the real-time and high-precision requirements of smart vehicles for three-dimensional (3D) lidar localization.Type: ApplicationFiled: September 22, 2021Publication date: June 22, 2023Applicant: SHANGHAITECH UNIVERSITYInventors: Qi DENG, Hao SUN, Yajun HA, Hui WANG
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Patent number: 11456279Abstract: A substrate-less integrated electronic element module for a semiconductor package, comprising: at least two electronic elements, each of the at least two electronic elements having first electrical connectors; and a first molding compound encapsulating the at least two electronic elements, the first molding compound comprising a first planar surface and an opposing second planar surface of the integrated electronic element module, wherein each of the first electrical connectors is directly exposed on the first planar surface of the integrated electronic element module. Further, a semiconductor package including the integrated electronic element module and the method of fabricating the same is provided.Type: GrantFiled: May 29, 2020Date of Patent: September 27, 2022Assignee: Western Digital Technologies, Inc.Inventors: Cong Zhang, Chin-Tien Chiu, Xuyi Yang, Qi Deng
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Publication number: 20210366875Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.Type: ApplicationFiled: December 30, 2020Publication date: November 25, 2021Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.Inventors: Xiaofeng Di, Junrong Yan, CheeKeong Chin, Weili Wang, Xin Lu, Qi Deng, Chaur Yang Ng, Cong Zhang, Chenlin Yang, Chin-Tien Chiu
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Publication number: 20210043602Abstract: A substrate-less integrated electronic element module for a semiconductor package, comprising: at least two electronic elements, each of the at least two electronic elements having first electrical connectors; and a first molding compound encapsulating the at least two electronic elements, the first molding compound comprising a first planar surface and an opposing second planar surface of the integrated electronic element module, wherein each of the first electrical connectors is directly exposed on the first planar surface of the integrated electronic element module. Further, a semiconductor package including the integrated electronic element module and the method of fabricating the same is provided.Type: ApplicationFiled: May 29, 2020Publication date: February 11, 2021Applicant: Western Digital Technologies, Inc.Inventors: Cong Zhang, Chin-Tien Chiu, Xuyi Yang, Qi Deng
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Patent number: 9759867Abstract: An optical apparatus includes a first beam combining device arranged to receive a first optical beam having a first wavelength at a first location and a second optical beam output having a second wavelength at a second location. The second optical beam has a polarization that is substantially orthogonal to a polarization of the first optical beam. The first beam combining device configured to output a first combined beam that comprises a combination of the first optical beam and the second optical beam. An optical element is arranged to receive the first combined beam and a second combined beam and to transmit an output beam that includes a combination of the first combined beam and the second combined beam.Type: GrantFiled: February 1, 2016Date of Patent: September 12, 2017Assignee: Futurewei Technologies, Inc.Inventors: Qi Deng, Yaohui Xie, Li Zeng, Xiaolu Song
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Publication number: 20160147018Abstract: An optical apparatus includes a first beam combining device arranged to receive a first optical beam having a first wavelength at a first location and a second optical beam output having a second wavelength at a second location. The second optical beam has a polarization that is substantially orthogonal to a polarization of the first optical beam. The first beam combining device configured to output a first combined beam that comprises a combination of the first optical beam and the second optical beam. An optical element is arranged to receive the first combined beam and a second combined beam and to transmit an output beam that includes a combination of the first combined beam and the second combined beam.Type: ApplicationFiled: February 1, 2016Publication date: May 26, 2016Inventors: Qi Deng, Yaohui Xie, Li Zeng, Xiaolu Song
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Patent number: 9294217Abstract: Embodiments of the present invention relate to the optical communication field and disclose an optical signal multiplexing method and an optical multiplexer. The method provided in the present invention includes: adjusting polarization states of two of four optical signals to be multiplexed, and preferably, mutually orthogonal to, the polarization states of the remaining two optical signals; combining one optical signal in the adjusted polarization state with one optical signal in the unadjusted polarization state into one optical signal through polarization multiplexing; and combining the two optical signals obtained through polarization multiplexing into one optical signal.Type: GrantFiled: January 14, 2014Date of Patent: March 22, 2016Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Xiaolu Song, Wenbin Jiang, Qi Deng, Li Zeng
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Patent number: 9250355Abstract: An optical apparatus includes a first beam combining device arranged to receive a first optical beam having a first wavelength at a first location and a second optical beam output having a second wavelength at a second location. The second optical beam has a polarization that is substantially orthogonal to a polarization of the first optical beam. The first beam combining device configured to output a first combined beam that comprises a combination of the first optical beam and the second optical beam. An optical element is arranged to receive the first combined beam and a second combined beam and to transmit an output beam that includes a combination of the first combined beam and the second combined beam.Type: GrantFiled: April 6, 2011Date of Patent: February 2, 2016Assignee: Futurwei Technologies, Inc.Inventors: Qi Deng, Yaohui Xie, Li Zeng, Xiaolu Song
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Patent number: 9112091Abstract: An apparatus and method are disclosed for providing monolithic optical packages. An embodiment optical package includes a base made of aluminum-nitride (AlN) that is configured to support an optical component, a plurality of sidewalls made of AlN that are coupled to the base, the sidewalls are configured to surround the optical component, and a feed-through made of AlN that is coupled to one of the sidewalls, wherein the feed-through is configured to feed a plurality of leads through the one sidewall to provide an electrical connection to the optical component, wherein the base, the sidewalls, and the feed-through have a same coefficient of thermal expansion (CTE) for AlN. An embodiment method includes punching and printing AlN tapes to build a base, a plurality of sidewalls joined to the base, and a feed-through coupled to the sidewalls, and attaching a plurality of electrical leads into the feed-through.Type: GrantFiled: October 5, 2012Date of Patent: August 18, 2015Assignee: Futurewei Technologies, Inc.Inventors: Anwar A. Mohammed, Fei Yu, Qi Deng
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Patent number: 9054024Abstract: An integrated circuit package includes a substrate having a recess formed along at least a portion of a perimeter of the substrate, and an optical die having opto-electric circuitry, the optical die coupled to the substrate such that a portion of the optical die with the opto-electric circuitry overhangs the recess. The integrated circuit package also includes an optical unit disposed in the recess such that optical signals emitted by the opto-electric circuitry are reflected away from the substrate and incident optical signals are reflected onto the opto-electric circuitry.Type: GrantFiled: February 13, 2012Date of Patent: June 9, 2015Assignee: Futurewei Technologies, Inc.Inventors: Fei Yu, Qi Deng
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Patent number: 8791682Abstract: An apparatus includes a pass element comprising an input, an output and a control input. The pass element, with a first signal on the control input, passes a voltage from the input to the output and, with a second signal on the control input, blocks the voltage on the input from passing to the output. A differential amplifier includes a non-inverting input coupled to the input, an inverting input coupled to the output, an amplifier output coupled to the control input and a bias current connection. The differential amplifier, with a bias current supplied, supplies the first signal along with a closed feedback loop from the output and supplies the second signal in absence of the bias current. A current source is coupled to the bias current connection and an enable input. The current source supplies the bias current and, in absence of an enable signal, disables the bias current.Type: GrantFiled: May 3, 2011Date of Patent: July 29, 2014Inventor: Qi Deng
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Publication number: 20140126909Abstract: Embodiments of the present invention relate to the optical communication field and disclose an optical signal multiplexing method and an optical multiplexer. The method provided in the present invention includes: adjusting polarization states of two of four optical signals to be multiplexed, and preferably, mutually orthogonal to, the polarization states of the remaining two optical signals; combining one optical signal in the adjusted polarization state with one optical signal in the unadjusted polarization state into one optical signal through polarization multiplexing; and combining the two optical signals obtained through polarization multiplexing into one optical signal.Type: ApplicationFiled: January 14, 2014Publication date: May 8, 2014Applicant: Huawei Technologies Co., Ltd.Inventors: Xiaolu SONG, Wenbin Jiang, Qi Deng, Li Zeng
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Publication number: 20140097333Abstract: An apparatus and method are disclosed for providing monolithic optical packages. An embodiment optical package includes a base made of aluminum-nitride (AlN) that is configured to support an optical component, a plurality of sidewalls made of AlN that are coupled to the base, the sidewalls are configured to surround the optical component, and a feed-through made of AlN that is coupled to one of the sidewalls, wherein the feed-through is configured to feed a plurality of leads through the one sidewall to provide an electrical connection to the optical component, wherein the base, the sidewalls, and the feed-through have a same coefficient of thermal expansion (CTE) for AlN. An embodiment method includes punching and printing AlN tapes to build a base, a plurality of sidewalls joined to the base, and a feed-through coupled to the sidewalls, and attaching a plurality of electrical leads into the feed-through.Type: ApplicationFiled: October 5, 2012Publication date: April 10, 2014Applicant: FutureWei Technologies, Inc.Inventors: Anwar A. Mohammed, Yu Fei, Qi Deng
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Publication number: 20130330033Abstract: One embodiment of the present invention provides a packaged optoelectronic module. The module includes a photonic chip having a top surface and a first substrate that includes a plurality of vias and a reflective surface. The photonic chip is flip-chip bonded to the first substrate with the top surface facing the first substrate. The vias facilitate electrical connections to the top surface, and the reflective surface forms an angle with the top surface, thereby enabling optical coupling between the top surface and an optical fiber placed in a direction that is substantially parallel to the top surface.Type: ApplicationFiled: June 12, 2012Publication date: December 12, 2013Applicant: FUTUREWEI TECHNOLOGIES, INC.Inventors: Fei Yu, Qi Deng