Patents by Inventor Qi Ql

Qi Ql has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955075
    Abstract: An array substrate has a display area and a non-display area including a first bonding region. The array substrate includes: a plurality of pixel columns disposed in the display area, each of the plurality of pixel columns including a plurality of light-emitting units that are arranged in a second direction, the second direction being perpendicular to a direction in which an edge of the display area proximate to the first bonding region extends; and at least three first power supply input terminals disposed in the first bonding region, each first power supply input terminal being connected to at least one pixel column of the plurality of pixel columns, so as to provide a first power supply signal to the at least one pixel column.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: April 9, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Dongni Liu, Qi Ql, Feng Qu, Minghua Xuan, Haoliang Zheng, Jiao Zhao
  • Publication number: 20230178016
    Abstract: An array substrate has a display area and a non-display area including a first bonding region. The array substrate includes: a plurality of pixel columns disposed in the display area, each of the plurality of pixel columns including a plurality of light-emitting units that are arranged in a second direction, the second direction being perpendicular to a direction in which an edge of the display area proximate to the first bonding region extends; and at least three first power supply input terminals disposed in the first bonding region, each first power supply input terminal being connected to at least one pixel column of the plurality of pixel columns, so as to provide a first power supply signal to the at least one pixel column.
    Type: Application
    Filed: January 15, 2021
    Publication date: June 8, 2023
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Dongni LIU, Qi Ql, Feng QU, Minghua XUAN, Haoliang ZHENG, Jiao ZHAO
  • Patent number: 9354404
    Abstract: Embodiments include a high bandwidth optical connection system suitable for interconnecting servers, for example within a rack of a datacenter. An edge mount optical connector assembly includes an edge-mount housing providing topside socket contacts proximate to a first end of the housing and a port at a second end to receive an optical plug connector. A socket latch cantilevered from an anchor point on the housing includes a latching face to contact a keeper face disposed on the housing and a spring load application surface between the anchor point and the latching face to apply a spring force against the electrical contacts for retention of a removable optical transceiver module. An optical plug connector includes a front housing joined to a rear housing with a plug lens spring loaded within the housing and with alignment features comprising two flat alignment surfaces orthogonally oriented relative to each other.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: May 31, 2016
    Assignee: Intel Corporation
    Inventors: Qi Ql, Jamyuen Ko, Chun Chit Lam