Patents by Inventor Qian-Cheng ZHAO
Qian-Cheng ZHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11896351Abstract: A fiber-optic sensor matt detects movements of a person on the matt that cause microbending of a fiber-optic cable that is arranged into a symmetric pair of radial ring groups within the matt. There are no cross-over points or overlapping of the fiber-optic cable within the symmetric pair of radial ring groups that could cause fiber wear and noisy readings. Microbending of the fiber-optic cable pressed into a mesh modulates the light intensity received, which is analyzed to extract both respiration and heart BallistoCardioGram (BCG) waveforms by convolution with Daubechies dB5 wavelet and scaling functions. The reconstructed level-4 detail waveform is output as the extracted BCG, while the reconstructed level-6 approximation waveform is output as the extracted respiration waveform. Respiration and heart rates and variations can be generated from the extracted waveforms. An integrated Fast Wavelet Transform (FWT) using dB5 wavelet thus generates both respiration rate and heart rate.Type: GrantFiled: October 29, 2020Date of Patent: February 13, 2024Assignee: Hong Kong Applied Science and Technology Research Institute Company LimitedInventors: Qian Cheng Zhao, Tsz Chung Leung, Man Sang Kwok
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Patent number: 11590536Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.Type: GrantFiled: February 13, 2019Date of Patent: February 28, 2023Assignees: PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., LTD.Inventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
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Publication number: 20230014827Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. Rhe ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.Type: ApplicationFiled: September 15, 2022Publication date: January 19, 2023Inventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
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Patent number: 11478822Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. The ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.Type: GrantFiled: February 13, 2019Date of Patent: October 25, 2022Assignees: J-Metrics Technology Co., Ltd., Peking University Shenzhen Graduate SchoolInventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
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Publication number: 20220133154Abstract: A fiber-optic sensor matt detects movements of a person on the matt that cause microbending of a fiber-optic cable that is arranged into a symmetric pair of radial ring groups within the matt. There are no cross-over points or overlapping of the fiber-optic cable within the symmetric pair of radial ring groups that could cause fiber wear and noisy readings. Microbending of the fiber-optic cable pressed into a mesh modulates the light intensity received, which is analyzed to extract both respiration and heart BallistoCardioGram (BCG) waveforms by convolution with Daubechies dB5 wavelet and scaling functions. The reconstructed level-4 detail waveform is output as the extracted BCG, while the reconstructed level-6 approximation waveform is output as the extracted respiration waveform. Respiration and heart rates and variations can be generated from the extracted waveforms. An integrated Fast Wavelet Transform (FWT) using dB5 wavelet thus generates both respiration rate and heart rate.Type: ApplicationFiled: October 29, 2020Publication date: May 5, 2022Inventors: Qian Cheng ZHAO, Tsz Chung LEUNG, Man Sang KWOK
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Patent number: 11075072Abstract: A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.Type: GrantFiled: May 14, 2020Date of Patent: July 27, 2021Assignees: J-Metrics Technology Co., Ltd., Peking University Shenzhen Graduate SchoolInventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
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Publication number: 20210013026Abstract: A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.Type: ApplicationFiled: May 14, 2020Publication date: January 14, 2021Inventors: Yu-Feng JIN, Sheng-Lin MA, Qian-Cheng ZHAO, Yi-Hsiang CHIU, Huan LIU, Hung-Ping LEE, Dan GONG
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Publication number: 20200179979Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.Type: ApplicationFiled: February 13, 2019Publication date: June 11, 2020Inventors: Yu-Feng JIN, Sheng-Lin MA, Qian-Cheng ZHAO, Yi-Hsiang CHIU, Huan LIU, Hung-Ping LEE, Dan GONG
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Publication number: 20200164406Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. Rhe ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.Type: ApplicationFiled: February 13, 2019Publication date: May 28, 2020Inventors: Yu-Feng JIN, Sheng-Lin MA, Qian-Cheng ZHAO, Yi-Hsiang CHIU, Huan LIU, Hung-Ping LEE, Dan GONG
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Patent number: 10657349Abstract: An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.Type: GrantFiled: August 20, 2018Date of Patent: May 19, 2020Assignees: J-METRICS TECHNOLOGY CO., LTD., PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOLInventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Huan Liu, Yi-Hsiang Chiu
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Publication number: 20190080132Abstract: An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.Type: ApplicationFiled: August 20, 2018Publication date: March 14, 2019Inventors: Yu-Feng JIN, Sheng-Lin MA, Qian-Cheng ZHAO, Huan LIU, Yi-Hsiang CHIU