Abstract: A protein product capable of immobilizing a target and being cleared as required includes a protein (lysozyme, bovine serum albumin (BSA), whey albumin, insulin, ?-lactalbumin, fibrinogen, ribonuclease A, cytochrome c, ?-amylase, horseradish peroxidase (HRP), pepsin, myoglobin, collagen, keratin, or the like), a protein modifier (a strong oxidizing agent or a strong reducing agent), and a matter to be immobilized (a coating, a pesticide, a chemical fertilizer, a cosmetic, a medical drug, or the like). A protein film can be generated through the phase transition of the protein to immobilize the matter to be immobilized on a target surface, thereby improving the utilization rate of the matter to be immobilized and reducing the resource waste and environmental pollution caused by the loss of the matter to be immobilized. In addition, after the protein film is decomposed, the matter to be immobilized will also be effectively cleared.

Abstract: Techniques are disclosed relating to generating authentication information independent of user input. In some embodiments, an authentication application repeatedly performs operations to authenticate a client application to one or more hosts of a server system during an automated tasks. In some such embodiments, an instance of the operations includes receiving, from the client application, a request to generate authentication information. In response to the request, the authentication application may retrieve authentication data for the user and, independent of user input, generate an item of authentication information based on the authentication data. The authentication application may then output the item of authentication information to the client application, where the item of authentication information is usable by the client application to authenticate to at least one of the one or more hosts.

Abstract: Techniques are disclosed relating to generating authentication information independent of user input. In some embodiments, an authentication application repeatedly performs operations to authenticate a client application to one or more hosts of a server system during an automated tasks. In some such embodiments, an instance of the operations includes receiving, from the client application, a request to generate authentication information. In response to the request, the authentication application may retrieve authentication data for the user and, independent of user input, generate an item of authentication information based on the authentication data. The authentication application may then output the item of authentication information to the client application, where the item of authentication information is usable by the client application to authenticate to at least one of the one or more hosts.

Abstract: Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.

Abstract: The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame.

Abstract: A system and method of testing chip-on-glass (COG) bonding quality automatically includes a glass panel comprising two test pads, the test pads electrically interconnected, a display driver comprising an input node and an output node, and an adhesive layer between the glass panel and the display driver, the adhesive layer binding the glass panel with the display driver, the adhesive layer comprising conductive portions across the adhesive layer between the glass panel and the display driver, wherein the input node, the output node, the two test pads, and the conductive portions are electrically connected to form an electrical testing loop, the electrical testing loop configured to measure a voltage drop across the conductive portions.

Abstract: The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. The heat management features include phase changing materials that allow the processing components to be kept at a isothermal state through changes in phase, thereby prolonging the duration of time in which the processing components can operate at high performance levels without the need to throttle the performance.

Abstract: Embodiments are provided for using a molded thermal plastic fin shell as part of a heat sink design for electronic devices. The heat sink design also includes metal components in contact with the electronics components of the device and the thermal plastic fin shell. The thermal plastic fin shell serves both as part of the heat sink design to dissipate heat to the air and as a protective casing or packaging for the device. The heat is transferred from the electronics components or heat sources in the device to the heat sink metal components and hence to the thermal plastic fin shell in contact with the metal. The thermal plastic fin shell dissipates the heat into the surrounding air. The combination of metal and thermal plastic materials in the heat sink design combines both desired properties of high thermal conductivity and ease of manufacture.

Abstract: A method for simulating an effect of surface temperature of an electronic device on skin of a human being when the electronic device is touched by the human being. The method comprises applying heat to a material within a cavity of a body, the body comprising a first end, a second end, an outer surface, and an inner surface that defines the cavity extending between the first end and the second end. The outer surface and the material have heat and thermal conductivity properties similar to human skin. The method comprises sensing a temperature of the material, and sensing a temperature of at least a portion of the outer surface when the portion of the outer surface contacts the electronic device.

Abstract: A system and method of testing chip-on-glass (COG) bonding quality automatically includes a glass panel comprising two test pads, the test pads electrically interconnected, a display driver comprising an input node and an output node, and an adhesive layer between the glass panel and the display driver, the adhesive layer binding the glass panel with the display driver, the adhesive layer comprising conductive portions across the adhesive layer between the glass panel and the display driver, wherein the input node, the output node, the two test pads, and the conductive portions are electrically connected to form an electrical testing loop, the electrical testing loop configured to measure a voltage drop across the conductive portions.

Abstract: This invention describes a novel solution to providing heat redistribution and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. Liquid (e.g., coolants) contained in the portion of the heat management features most proximate to the processing components evaporates due to the absorbed heat, and is conducted (via convection) towards the other end of the heat management features, where the temperature is cooler. Once sufficiently cooled, the evaporated coolant condenses back into liquid form and flows back towards the other end of the heat management features.

Abstract: Disclosed are a method and system for establishing a bearer supporting uplink Semi-Persistent Scheduling (SPS) and a User Equipment (UE) thereof, and the method includes: an RRC entity of a UE parses an RRC connection reconfiguration message transmitted from an eNB to obtain logic channel configuration information, EPS bearer activation request information and RBID information, transmits the logic channel configuration information to an MAC entity of the UE and transmits the EPS bearer activation request information and the RBID information to an NAS of the UE; the MAC entity of the UE establishes an LC and an LCG between itself and an RLC entity according to the received logic channel configuration information, and establishes a mapping between the RBID and the LCG; the NAS of the UE establishes an EPS bearer between itself and an NAS of an EPC according to the received EPS bearer activation request information, and establishes correspondences between classifiers and LCs; and parses a QCI and the RBID from t

Abstract: The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. The heat management features include phase changing materials that allow the processing components to be kept at a isothermal state through changes in phase, thereby prolonging the duration of time in which the processing components can operate at high performance levels without the need to throttle the performance.

Abstract: A method for simulating an effect of surface temperature of an electronic device on skin of a human being when the electronic device is touched by the human being. The method comprises applying heat to a material within a cavity of a body, the body comprising a first end, a second end, an outer surface, and an inner surface that defines the cavity extending between the first end and the second end. The outer surface and the material have heat and thermal conductivity properties similar to human skin. The method comprises sensing a temperature of the material, and sensing a temperature of at least a portion of the outer surface when the portion of the outer surface contacts the electronic device.

Abstract: This invention describes a novel solution to providing heat redistribution and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. Liquid (e.g., coolants) contained in the portion of the heat management features most proximate to the processing components evaporates due to the absorbed heat, and is conducted (via convection) towards the other end of the heat management features, where the temperature is cooler. Once sufficiently cooled, the evaporated coolant condenses back into liquid form and flows back towards the other end of the heat management features.

Abstract: Disclosed are a method and system for establishing a bearer supporting uplink Semi-Persistent Scheduling (SPS) and a User Equipment (UE) thereof, and the method includes: an RRC entity of a UE parses an RRC connection reconfiguration message transmitted from an eNB to obtain logic channel configuration information, EPS bearer activation request information and RBID information, transmits the logic channel configuration information to an MAC entity of the UE and transmits the EPS bearer activation request information and the RBID information to an NAS of the UE; the MAC entity of the UE establishes an LC and an LCG between itself and an RLC entity according to the received logic channel configuration information, and establishes a mapping between the RBID and the LCG; the NAS of the UE establishes an EPS bearer between itself and an NAS of an EPC according to the received EPS bearer activation request information, and establishes correspondences between classifiers and LCs; and parses a QCI and the RBID from t

Abstract: Embodiments are provided for using a molded thermal plastic fin shell as part of a heat sink design for electronic devices. The heat sink design also includes metal components in contact with the electronics components of the device and the thermal plastic fin shell. The thermal plastic fin shell serves both as part of the heat sink design to dissipate heat to the air and as a protective casing or packaging for the device. The heat is transferred from the electronics components or heat sources in the device to the heat sink metal components and hence to the thermal plastic fin shell in contact with the metal. The thermal plastic fin shell dissipates the heat into the surrounding air. The combination of metal and thermal plastic materials in the heat sink design combines both desired properties of high thermal conductivity and ease of manufacture.

Abstract: Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.