Patents by Inventor Qian-Hua He

Qian-Hua He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7611276
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: November 3, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung, Qian-Hua He
  • Patent number: 7530736
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is telescopically mounted in at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: May 12, 2009
    Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung, Qian-Hua He
  • Publication number: 20070240858
    Abstract: A heat pipe includes a metal casing (100) and a composite capillary wick received in the casing. The metal casing has an evaporating section (400), a condensing section (600) and a central section (500) between the evaporating section and the condensing section. First type of capillary wick (200) is provided on an inner all of the metal casing at all of the condensing, central and evaporating sections, while second type of capillary wick (220) is provided on the first type of capillary wick at the central and evaporating sections only. A capillary pore size of the first type of capillary wick is larger than that of the second type of capillary wick.
    Type: Application
    Filed: August 11, 2006
    Publication date: October 18, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Chuen-Shu Hou, Tay-Jian Liu, Qian-Hua He, Chih-Hsien Sun, Chao-Nien Tung
  • Publication number: 20070240851
    Abstract: A heat pipe includes a hollow metal casing (10). The casing has an evaporating section (120) and a condensing section (160) at respective opposite ends thereof, and an adiabatic section (140) located between the evaporating section and the condensing section. A capillary wick structure (12) is arranged at an inner surface of the hollow metal casing. A sealed heat reservoir (20) is mounted on the evaporating section of the heat pipe to increase heat absorbing area of the heat pipe. The heat reservoir has working fluid and a capillary wick structure (22) therein. Heat generated by a heat source is first absorbed by the heat reservoir and then transferred to the evaporating section of the metal casing.
    Type: Application
    Filed: July 25, 2006
    Publication date: October 18, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU, Ji-Feng Wang, Qian-Hua He
  • Publication number: 20070195854
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Application
    Filed: August 29, 2006
    Publication date: August 23, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung, Qian-Hua He
  • Publication number: 20070165692
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is telescopically mounted in at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Application
    Filed: July 21, 2006
    Publication date: July 19, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: TAY-JIAN LIU, CHUEN-SHU HOU, CHAO-NIEN TUNG, QIAN-HUA HE