Patents by Inventor Qian Ying

Qian Ying has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11610367
    Abstract: A three-dimensional model processing method, an electronic device, and a storage medium are provided, which are related to fields of deep learning, augmented reality, and the like. The specific implementation includes: generating a target virtual three-dimensional model based on a target model template; generating a target picture based on graphic and textual information and a preset network; and determining a superposition processing result of the target virtual three-dimensional model based on the target virtual three-dimensional model and the target picture.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: March 21, 2023
    Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD
    Inventors: Qian Ying, Chen Zhao, Li Xu
  • Publication number: 20220044476
    Abstract: A three-dimensional model processing method, an electronic device, and a storage medium are provided, which are related to fields of deep learning, augmented reality, and the like. The specific implementation includes: generating a target virtual three-dimensional model based on a target model template; generating a target picture based on graphic and textual information and a preset network; and determining a superposition processing result of the target virtual three-dimensional model based on the target virtual three-dimensional model and the target picture.
    Type: Application
    Filed: October 20, 2021
    Publication date: February 10, 2022
    Inventors: Qian YING, Chen ZHAO, Li XU
  • Patent number: 11160173
    Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 26, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Measurement Specialties (Chengdu) Ltd., TE Connectivity Services GmbH
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Lin Ye, Yong Yan, Roberto Francisco-Yi Lu, Qinglong Zeng
  • Patent number: 11141807
    Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: October 12, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Servies GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co, Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto-Francisco Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 11064614
    Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: July 13, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 11051408
    Abstract: A fixing device adapted to fix at least one needle-shaped member comprises a fixing base and a fixing mechanism. The fixing base has at least one positioning groove disposed at a front end of the fixing base. The needle-shaped member is adapted to be positioned in the positioning groove. The fixing mechanism has at least one pressing protrusion at a front end of the fixing mechanism. The pressing protrusion is adapted to press and hold the needle-shaped member in the positioning groove.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: June 29, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd. TE, Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
  • Patent number: 11000912
    Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: May 11, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co. Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 10957084
    Abstract: The present disclosure provides an image processing method. The method includes: detecting at least one first feature object of an image to be processed, to obtain a name and position of each first feature object in the image; according to the name and position of the first feature object, and a preset strategy for loading a dynamic effect, selecting, from the at least one first feature object, a feature object to which a dynamic effect is to be loaded, as a second feature object; and according to the preset strategy for loading a dynamic effect, rendering the second feature object with an Augmented Reality (AR) dynamic effect, and obtaining an image with the AR dynamic effect. The present disclosure further provides an image processing apparatus, a device and a computer readable storage medium.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: March 23, 2021
    Assignee: Baidu Online Network Technology (Beijing) Co., Ltd.
    Inventors: Zhongqin Wu, Yingchao Li, Chen Zhao, Nan Wei, Qian Ying
  • Patent number: 10933460
    Abstract: A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 2, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd, Shenzhen AMI Technology Co., Ltd.
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
  • Patent number: 10807178
    Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device has at least one first positioning groove adapted to position at least one first elongated member and fixes the at least one first elongated member. The second fixing device has at least one second positioning groove adapted to position at least one second elongated member and fixes the at least one second elongated member. Each first positioning groove is aligned with a corresponding second positioning groove so that the first elongated member fixed in the first positioning groove is axially aligned with the second elongated member fixed in the corresponding second positioning groove.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 20, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Lin Ye, Yong Yan, Roberto Francisco-Yi Lu, Qinglong Zeng
  • Patent number: 10773341
    Abstract: A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: September 15, 2020
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., Measurement Specialities (Chengdai) Ltd, TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd.
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
  • Publication number: 20200094339
    Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
    Type: Application
    Filed: November 15, 2019
    Publication date: March 26, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto-Francisco Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20200091692
    Abstract: An assembly system includes a feeding mechanism configured to feed a heat shrinkable tube, a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube, a robot adapted to grip the segment of heat shrinkable tube, and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 19, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20200015359
    Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 9, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20200009783
    Abstract: An assembly system includes a feeding mechanism adapted to feed a heat shrinkable tube, a cutting mechanism, a clamping mechanism, a robot, and a vision system. The cutting mechanism is adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism. The clamping mechanism is adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube with the cutting mechanism. The robot is adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube. The vision system is adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire of an electrical device.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 9, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd., Measurement Specialities (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying
  • Patent number: 10497276
    Abstract: The present disclosure discloses a display method and apparatus. A specific implementation of the method comprises: acquiring an experimental environment image; presenting, on the experimental instrument image using an augmented reality approach, a status image indicating an experimental status of an experimental instrument when performing the target experiment; in response to detecting a gesture operation of a user, determining experiment effect information of an experiment operation based on a corresponding relation between the gesture operation and the experiment operation of the target experiment, wherein the experiment effect information comprises an experiment effect image; and displaying, using the augmented reality approach, the experiment effect image in the experimental environment image having presented the status image. This implementation may superpose a virtual status image and an experiment effect image on a reality environment image, thereby enhancing the display fidelity.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: December 3, 2019
    Assignee: BAIDU ONLINE NETWORK TECHNOLOGY (BEIJING) CO., LTD.
    Inventors: Zhongqin Wu, Hui Qiao, Yingchao Li, Qian Ying, Chen Zhao
  • Publication number: 20190358722
    Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20190188916
    Abstract: A method and apparatus for augmenting reality are disclosed. A specific embodiment of the method includes: recognizing an object in an image collected by a camera of a user terminal, and determining a space occupied by the recognized object in a world coordinate system; determining a position in the world coordinate system corresponding to an augmented reality tag of the recognized object, and determining a superimposition position in the collected image corresponding to the position in the world coordinate system corresponding to an augmented reality tag of the recognized object, the position in the world coordinate system corresponding to the augmented reality tag being associated with the space occupied by the recognized object in the world coordinate system; and superimposing, in an augmented reality, the augmented reality tag at the superimposition position. The direct association relationship between the superimposed information and the object in the real world is established.
    Type: Application
    Filed: September 18, 2018
    Publication date: June 20, 2019
    Inventors: Xiaoyin Zhang, Zhongqin Wu, Yingchao Li, Li Xu, Miao Yao, Yongjie Zhang, Qian Ying, Yuan Gao
  • Publication number: 20190147632
    Abstract: The present disclosure provides an image processing method. The method includes: detecting at least one first feature object of an image to be processed, to obtain a name and position of each first feature object in the image; according to the name and position of the first feature object, and a preset strategy for loading a dynamic effect, selecting, from the at least one first feature object, a feature object to which a dynamic effect is to be loaded, as a second feature object; and according to the preset strategy for loading a dynamic effect, rendering the second feature object with an Augmented Reality (AR) dynamic effect, and obtaining an image with the AR dynamic effect. The present disclosure further provides an image processing apparatus, a device and a computer readable storage medium.
    Type: Application
    Filed: August 23, 2018
    Publication date: May 16, 2019
    Applicant: Baidu Online Network Technology (Beijing) Co., Ltd .
    Inventors: Zhongqin Wu, Yingchao Li, Chen Zhao, Nan Wei, Qian Ying
  • Publication number: 20190009326
    Abstract: A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.
    Type: Application
    Filed: July 3, 2018
    Publication date: January 10, 2019
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co. Ltd
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu