Abstract: A micro-molybdenum-type weathering bridge steel plate disclosed by the present invention is characterized in that the steel plate is smelted from the following components by weight: C: 0.05-0.08%, Si: 0.30-0.50%, Mn: 1.25-1.35%, P: 0.010-0.014%, S?0.003%, Nb: 0.020-0.030%, Ti: 0.010-0.020%, V: 0.040-0.050%, Cu: 0.25-0.40%, Ni: 0.25-0.35%, Cr: 0.45-0.55%, Mo: 0.03-0.08%, Alt: 0.020-0.040%, and the balance from Fe and impurities. Less content of molybdenum reduces the production cost of the steel plate, the yield strength of the steel plate is 500-600 MPa, the yield strength ratio is ?0.85, and the maximum thickness of the steel plate can reach 80 mm.

Abstract: A method for generating a path for wire arc additive manufacturing is provided in this disclosure, which relates to the technical field of additive manufacturing, and includes following steps: generating a model in which a three-dimensional model is established according to angle constraint of the wire arc additive manufacturing; layering the model in which the three-dimensional model is layered along a height direction; selecting discrete points in which a plurality of discrete points are selected according to curve curvature for different layers of the model; obtaining coordinates of the discrete points; determining a printing direction; obtaining coordinates of the discrete points and corresponding printing directions; and generating a control program. The method according to the disclosure is simple, has a wide application range, can satisfy printing of complex shapes, and can serve to well form for structures with maximum printing inclination of 60 degrees, thus improving forming effect of printing.

Abstract: Disclosed is 500-MPa low-yield-ratio weather-resistant bridge steel and a manufacturing method therefor; the weather-resistant bridge steel includes the following components in percentage by mass: C: 0.04%-0.09%, Si: 0.15%-0.30%, Mn: 1.40%-1.50%, P: 0.009%-0.015%, S: ?0.002%, Nb: 0.020%-0.050%, Ti: 0.010%-0.020%, V: 0.010%-0.030%, Cu: 0.30%-0.40%, Ni: 0.30%-0.45%, Cr: 0.45%-0.60%, Mo: 0.08%-0.15%, Alt: 0.02%-0.04%, and the balance Fe and inevitable impurities; through scientific component designing and a matched manufacturing method combining controlled rolling and cooling and tempering, the weather-resistant bridge steel has a low yield ratio, high low-temperature toughness and high elongation.

Abstract: The invention disclosures a frame structure optimization method based on 3D printing, comprising following steps: a. inputting the information of force and material property of frame according to design requirement, and building an initial frame model by adopting generative design; b. conducting area reduction optimization for the initial frame model by using an edge contraction algorithm based on quadric error as metric cost, a simplification frame model is obtained; c. arranging point set in cavity of the simplification frame model, connecting each point in the point set, and calculating and retaining the most efficient point of distribution mode and connection mode in the point set based on a multi-objective optimization algorithm, deleting extra points, an optimization frame model is obtained; d. inputting tube radius, transforming the structure in the optimization frame model from the line to the body to obtain 3D printing model of the frame.

Abstract: An integrated electrostatic discharge (ESD) shunting circuit includes a III-V semiconductor layer, and a first drain-less high electron mobility transistor (HEMT) or a metal-semiconductor FET (MESFET) transistor having a first gate and at least a second drain-less HEMT or MESFET having a second gate formed in the substrate. The HEMTs or MESFETs include a donor layer on the semiconductor layer, no drains, and a source including an ohmic contact layer on the donor layer.

Abstract: A method of producing corn starch by enzymatic process involving: soaking the corn; crushing the corn, separating and washing embryo; fine grinding; washing and drying fiber; separating and drying protein; washing, dewatering and drying the starch. An enzyme preparation is added before the step of washing, dewatering and drying the starch; the enzyme preparation is cellulose, or xylanase, or combination of the cellulose and the xylanase; and addition of the enzyme preparation is from 0.001% to 0.08% by weight of the corn. Based on the technology of traditional wet process, the method of the present invention comprises a step of adding enzyme preparation in the process of separating the corn, which improves the effect and the efficiency of mechanical separation, and further improves the purity and yield of the substance separated while also reducing the energy consumption.

Abstract: A method of producing corn starch by enzymatic process involving: soaking the corn; crushing the corn, separating and washing embryo; fine grinding; washing and drying fiber; separating and drying protein; washing, dewatering and drying the starch. An enzyme preparation is added before the step of washing, dewatering and drying the starch; the enzyme preparation is cellulose, or xylanase, or combination of the cellulose and the xylanase; and addition of the enzyme preparation is from 0.001% to 0.08% by weight of the corn. Based on the technology of traditional wet process, the method of the present invention comprises a step of adding enzyme preparation in the process of separating the corn, which improves the effect and the efficiency of mechanical separation, and further improves the purity and yield of the substance separated while also reducing the energy consumption.

Abstract: A method of producing corn starch by enzymatic process involving: soaking the corn; crushing the corn, separating and washing embryo; fine grinding; washing and drying fiber; separating and drying protein; washing, dewatering and drying the starch. An enzyme preparation is added before the step of washing, dewatering and drying the starch; the enzyme preparation is cellulose, or xylanase, or combination of the cellulose and the xylanase; and addition of the enzyme preparation is from 0.001% to 0.08% by weight of the corn. Based on the technology of traditional wet process, the method of the present invention comprises a step of adding enzyme preparation in the process of separating the corn, which improves the effect and the efficiency of mechanical separation, and further improves the purity and yield of the substance separated while also reducing the energy consumption.

Abstract: A method of assembling a multi-die package is achieved. A heat spreader is disposed on a printed circuit substrate. At least one integrated circuit die is disposed on a top side of the heat spreader and at least one other integrated circuit die is disposed on a bottom side of the heat spreader wherein the dies are connected to the substrate by wire bonds. Thermal solder balls are electrically connected to solderable pads of the heat spreader through the open holes of the substrate, so as to couple the heat spreader to function as a ground plane. Some of the ground pads of the dies can be bonded onto the heat spreader and the others bonded onto the substrate. Alternatively, all of the dies could only be connected to the substrate by wire bonding, and not connected to the heat spreader.

Abstract: A method of producing corn starch by enzymatic process involving: soaking the corn; crushing the corn, separating and washing embryo; fine grinding; washing and drying fiber; separating and drying protein; washing, dewatering and drying the starch. An enzyme preparation is added before the step of washing, dewatering and drying the starch; the enzyme preparation is cellulose, or xylanase, or combination of the cellulose and the xylanase; and addition of the enzyme preparation is from 0.001% to 0.08% by weight of the corn. Based on the technology of traditional wet process, the method of the present invention comprises a step of adding enzyme preparation in the process of separating the corn, which improves the effect and the efficiency of mechanical separation, and further improves the purity and yield of the substance separated while also reducing the energy consumption.

Abstract: An integrated electrostatic discharge (ESD) shunting circuit includes a III-V semiconductor layer, and a first drain-less high electron mobility transistor (HEMT) or a metal-semiconductor FET (MESFET) transistor having a first gate and at least a second drain-less HEMT or MESFET having a second gate formed in the substrate. The HEMTs or MESFETs include a donor layer on the semiconductor layer, no drains, and a source including an ohmic contact layer on the donor layer.

Abstract: A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained.

Abstract: A method of assembling a multi-die package is achieved. A heat spreader is disposed on a printed circuit substrate. At least one integrated circuit die is disposed on a top side of the heat spreader and at least one other integrated circuit die is disposed on a bottom side of the heat spreader wherein the dies are connected to the substrate by wire bonds. Thermal solder balls are electrically connected to solderable pads of the heat spreader through the open holes of the substrate, so as to couple the heat spreader to function as a ground plane. Some of the ground pads of the dies can be bonded onto the heat spreader and the others bonded onto the substrate. Alternatively, all of the dies could only be connected to the substrate by wire bonding, and not connected to the heat spreader.

Abstract: A multi-die package comprises a heat spreader disposed on a printed circuit substrate, at least one integrated circuit die disposed on a top side of the heat spreader and at least one other integrated circuit die disposed on a bottom side of the heat spreader wherein the dies are connected to the substrate by wire bonds. Thermal solder balls are electrically connected to solderable pads of the heat spreader through the open holes of the substrate, so as to couple the heat spreader to function as a ground plane. Some of the ground pads of the dies can be bonded onto the heat spreader and the others bonded onto the substrate. Alternatively, all of the dies could only be connected to the substrate by wire bonding, and not connected to the heat spreader.

Abstract: A method of forming a semiconductor package including providing a substrate having a through hole formed therein. A tape is attached to a surface of the substrate such that the through hole is covered by the tape. An integrated circuit (IC) die is attached to the tape. The IC die is electrically connected to the substrate via a plurality of electrical connections. The IC die and the electrical connections are encapsulated and the tape is removed from the substrate.

Abstract: An electrical connector has an insulative housing, a plurality of terminals and a metal shell. The insulative housing has a base and an extension. The terminals are mounted in the base. The metal shell covers the insulative housing to define a card space between the insulative housing and the metal shell and has a top plate and two lateral plates. The top plate has a plurality of pressing tabs formed on and protruding from the top plate towards the top of the insulative housing to tightly abut against a card that is inserted into the card space. The pressing tabs prevent the card from moving or falling out of the card space.

Abstract: A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate by wire bonding through an open slot in the stiffener. The die is not wire bonded to the stiffener. Solder balls are attached on a bottom side of the substrate and electrically connected to ground bond fingers of the substrate, and also are directly attached to solderable pads on the bottom side of the stiffener through open holes or plated through-holes on the substrate, so as to have the stiffener function as a ground plane and as a heat sink for power dissipation.

Abstract: A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained.

Abstract: A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate by wire bonding through an open slot in the stiffener. The die is not wire bonded to the stiffener. Solder balls are attached on a bottom side of the substrate and electrically connected to ground bond fingers of the substrate, and also are directly attached to solderable pads on the bottom side of the stiffener through open holes or plated through-holes on the substrate, so as to have the stiffener function as a ground plane and as a heat sink for power dissipation.

Abstract: A multi-die package comprises a heat spreader disposed on a printed circuit substrate, at least one integrated circuit die disposed on a top side of the heat spreader and at least one other integrated circuit die disposed on a bottom side of the heat spreader wherein the dies are connected to the substrate by wire bonds. Thermal solder balls are electrically connected to solderable pads of the heat spreader through the open holes of the substrate, so as to couple the heat spreader to function as a ground plane. Some of the ground pads of the dies can be bonded onto the heat spreader and the others bonded onto the substrate. Alternatively, all of the dies could only be connected to the substrate by wire bonding, and not connected to the heat spreader.