Abstract: Acoustic sensor and manufacturing method. The acoustic sensor includes: a base including a first silicon layer, a first oxide layer and a second silicon layer stacked, and a back cavity; a second oxide layer formed on the base; a piezoelectric unit formed on the second oxide layer and including a first electrode layer, a piezoelectric layer and a second electrode layer stacked; a first slit formed at a middle portion of the second electrode layer and passing the second electrode layer, the piezoelectric layer and the first electrode layer; a second slit formed at a middle portion of the second silicon layer and passing the second silicon layer and the second oxide layer; an additional membrane filled in the first slit and not filled in the second slit. The SPL and structural reliability are effectively improved, and the material type is not limited by dry film type materials.

Abstract: The present invention provides a MEMS piezoelectric speaker including a substrate with a back cavity, a diaphragm, a capacitive system and a flexible film. The diaphragm includes a fixed end, a suspended end. Adjacent suspended ends are at least partially spaced to form a slit. The suspended end includes a support section and a piezoelectric section. Along the thickness direction of the MEMS piezoelectric speaker, a flexible film is at least partially spaced from the diaphragm and the flexible film is spaced from the substrate. This design can improve the sound pressure level of the MEMS piezoelectric speaker in the middle and high frequency, and improve the acoustic performance of the MEMS piezoelectric speaker.

Abstract: An acoustic transducer includes: substrate including first silicon layer, first oxide layer and second silicon layer, back chamber is formed therethrough; second oxide layer on the substrate; piezoelectric unit on the second oxide layer and including first electrode layer, piezoelectric layer and second electrode layer; slit and opening formed in the second electrode layer; metal pad stacked on the first electrode layer at the opening; and additional film layer including first, second and third parts, the first part is in the slit, side wall and bottom wall of the first part form groove, and through slot is formed in the third part to expose metal pad.

Abstract: An acoustic transducer includes: substrate including first silicon layer, first oxide layer and second silicon layer, back chamber is formed therethrough; second oxide layer on the substrate; piezoelectric unit on the second oxide layer and including first electrode layer, piezoelectric layer and second electrode layer; slit and opening formed in the second electrode layer; metal pad stacked on the first electrode layer at the opening; and additional film layer including first and second parts, the first part is lay on the second electrode layer and covers the slit, and the second part is lay on the metal pad, through slot is formed penetrating the second part to expose the metal pad. Compared with the related art, additional film layer is formed by vapor deposition, and the piezoelectric unit can vibrate with maximum displacement and lowest restriction, thereby effectively improving SPL and structural reliability, which is suitable for larger acoustic transducers.

Abstract: The present invention provides a MEMS speaker including a substrate sidewall enclosing a cavity. The substrate sidewall includes a first surface and a second surface, a sounding assembly that is arranged on the first surface of the substrate sidewall and also seals the cavity at the opening of the first surface, and a bracket disposed in the cavity. The sounding assembly includes a first sounding assembly and the second sounding assembly. Each sounding assembly includes a driving part and a flexible diaphragm. The flexible diaphragm closes the gap formed between the free ends of adjacent driving parts and between the free ends of the driving parts and the substrate sidewall. The present invention also provides a manufacturing method of MEMS speaker. The MEMS speakers provided by the present invention have high-quality acoustic performance.

Abstract: The invention provides a MEMS speaker including a substrate enclosing a cavity, a cantilever beam at least partially suspended above the cavity, a piezoelectric actuator away from the cavity, a polymer layer away from the cavity and attached to the cantilever beam and the piezoelectric actuator for completely covering the cantilever beam, the piezoelectric actuator and the cavity, and a piezoelectric composite vibration structure formed by the polymer layer. The cantilever beam includes a first section fixed to the substrate, a second section extending from the first section to the cavity and suspended above the cavity, and a third section extending from the second section away from the first section, an end of the third section away from the second section being suspended; and the piezoelectric actuator is only fixed with the third section.

Abstract: A MEMS speaker is provided, including only a substrate enclosing a cavity, a piezoelectric diaphragm disposed above the substrate and covering the cavity, and a flexible structure layer covering the piezoelectric diaphragm. Both the piezoelectric diaphragm and the flexible structure layer are complete sheet structures, a young modulus of the flexible structure layer is less than a young modulus of the piezoelectric diaphragm, and the young modulus of the flexible structure layer is in a range of 100 MPa to 50 GPa. The MEMS speaker in the present disclosure does away with a harder structure layer and adopts a softer flexible structure layer, which better enhances the displacement and has a more prominent acoustic performance.

Abstract: An acoustic transducer includes: substrate including first silicon layer, first oxide layer and second silicon layer, back chamber is formed therethrough; second oxide layer on the substrate; piezoelectric unit on the second oxide layer and including first electrode layer, piezoelectric layer and second electrode layer; slit and opening formed in the second electrode layer; metal pad stacked on the first electrode layer at the opening; and additional film layer including first, second and third parts, the first part is in the slit, side wall and bottom wall of the first part form groove, and through slot is formed in the third part to expose metal pad. Compared with the related art, additional film layer is formed by vapor deposition, and the piezoelectric unit can vibrate with maximum displacement and lowest restriction, thereby effectively improving SPL and structural reliability, which is suitable for larger acoustic transducers.

Abstract: Provided is a method for manufacturing a MEMS acoustic sensor. A structural layer and a piezoelectric material layer are stacked on the substrate. Photolithography modeling is performed on the piezoelectric material layer and the structural layer. A polymer layer is stacked on the piezoelectric material layer. The substrate is etched to form a cavity. A first part of a jig is stacked on the polymer layer. The jig, the substrate, the piezoelectric material layer, and the polymer layer are heated. Air is introduced into the cavity and a pressure inside the cavity is controlled. An atmospheric pressure load of the air is maintained and the air is cooled. The pressure inside the cavity is stopped to be controlled and the pressure inside the cavity is reduced, the jig is disassembled, and a wafer is cut to obtain the MEMS acoustic sensor, to effectively improve the accuracy and reliability in processing.

Abstract: An acoustic transducer includes: substrate including first silicon layer, first oxide layer and second silicon layer, back chamber is formed therethrough; second oxide layer on the substrate; piezoelectric unit on the second oxide layer and including first electrode layer, piezoelectric layer and second electrode layer; slit and opening formed in the second electrode layer; metal pad stacked on the first electrode layer at the opening; and additional film layer including first and second parts, the first part is lay on the second electrode layer and covers the slit, and the second part is lay on the metal pad, through slot is formed penetrating the second part to expose the metal pad. Compared with the related art, additional film layer is formed by vapor deposition, and the piezoelectric unit can vibrate with maximum displacement and lowest restriction, thereby effectively improving SPL and structural reliability, which is suitable for larger acoustic transducers.

Abstract: The invention discloses a piezoelectric speaker, including a substrate with a cavity therethrough a supporting structure covering the cavity a first drive structure stacked on the supporting structure, including alternately stacked first electrode layers and first piezoelectric layers a transmission structure stacked on the first drive structure, and a separation slot penetrating the supporting structure and the first drive structure to separate the first drive structure into a first piezoelectric driving part and a second piezoelectric driving part. A rigidity of the transmission structure is less than or equal to a rigidity of the first drive structure, and the rigidity of the first drive structure is less than or equal to a rigidity of the supporting structure. Compared with the prior art, the sound pressure level generated at the same moment is higher.

Abstract: A MEMS loudspeaker manufacturing method and a MEMS loudspeaker are provided. The MEMS loudspeaker manufacturing method includes positioning a printed circuit board (PCB) substrate, inverting a MEMS chip and electrically connecting the PCB substrate to a first side of the PCB substrate having a first groove. filling and solidifying a polymer protection material in the gap between the MEMS chip and the PCB substrate, and combining the MEMS chip and the PCB substrate into a combination component. Since the PCB substrate and the MEMS chip are combined into the combination component through using the polymer protection component made of the polymer protection material, and the polymer protection component is coated with the conducting component, an overall packaging size of the MEMS loudspeaker basically is enabled to be consistent with a size of the MEMS chip, and sensitivity parameters of the MEMS loudspeaker may be significantly improved.

Abstract: One of the main objects of the present invention is to provide a speaker with optimized overall acoustic performance. To achieve the above-mentioned object, the present invention provides a speaker including: a base with an accommodation cavity; a vibration sounding assembly accommodated in the accommodation cavity, including a first diaphragm and a second diaphragm, and a driver fixed to the first diaphragm for driving the first diaphragm and the second diaphragm to vibrate and produce sound. The second diaphragm stacks on the first diaphragm, and a stiffness of the second diaphragm is different from a stiffness of the first diaphragm.

Abstract: An embodiment of the present disclosure provides an earphone, which includes a housing with a cavity, a first speaker housed in the cavity for producing low-frequency sounds, a second speaker, and a sound damping mesh for producing mid to high frequency sounds. The housing includes a sound outlet penetrating therethrough, and the cavity is connected with the outside through the sound outlet. The second speaker is fixed to the sound damping mesh. The sound damping mesh completely separates the first speaker from the second speaker. The low-frequency sound emitted by the first speaker is to transmitted to the sound outlet through the sound damping mesh. Compared with the related art, the acoustic performance of the earphone of the present disclosure is good.

Abstract: The present invention provides a micro electromechanical system (MEMS), which includes: a base with a cavity, a vibration structure includes a structural layer, a piezoelectric composite layer and a flexible layer; the structural layer includes a structural slab, a structural fixing portion and a plurality of structural springs; the piezoelectric composite layer includes a piezoelectric film, a first electrode layer and a second electrode layer; the stress of the piezoelectric composite layer can be released through the elastic actions of the structural springs. In addition, the rigidity of the overall structure is ensured and will not be too low. Therefore, the sound pressure level of the MEMS piezoelectric loudspeaker is improved, and the THD is reduced to improve the performance of the MEMS piezoelectric loudspeaker.

Abstract: A sound production device includes a substrate having a cavity and a plurality of cantilever diaphragms fixed on the substrate. Each of the plurality of the cantilever diaphragms includes a fixed end fixed on the substrate and a free end extending from the fixed end to a position suspended above the cavity. The free end includes a first surface and a second surface oppositely arranged. The free end and the substrate or other free ends are spaced to form a gap. The sound production device further includes a first dielectric elastomer actuator, a second dielectric elastomer actuator, and a flexible connector. The sound production device of the present disclosures adopts dielectric elastomer actuators on both of the upper and lower sides of the cantilever diaphragms to together act on the cantilever diaphragms, thereby improving the linearity of the sound production device.

Abstract: The present disclosure discloses a MEMS speaker including a housing with a receiving space; a MEMS speaker chip with an inner cavity, accommodated in the receiving space and connected with the housing, the MEMS speaker chip dividing the receiving space into a first cavity and a second cavity communicating with the inner cavity; a sound hole communicating with the first cavity or the second cavity; and a damping mesh connected to the housing and covering the sound hole; wherein sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.

Abstract: A MEMS speaker includes a substrate, a vibration sounding portion and a baffle plate with a through hole. The baffle plate, the substrate and the vibration sounding portion form a sounding inner cavity, and a volume of the sounding inner cavity can adjust a resonant frequency of the sounding inner cavity, so that the resonance frequency of the sounding inner cavity resonate with a preset frequency of the MEMS speaker. A speaker assembly structure further provided includes a speaker, a fixing portion, and a baffle plate, the speaker and the baffle plate together enclose and form a sounding inner cavity, the fixing portion and the speaker are fixedly connected together and form a sealing structure. A sound pressure level of the MEMS speaker and the speaker assembly structure is high and harmonic distortion of the MEMS speaker and the speaker assembly structure is small.

Abstract: The invention provides a MEMS speaker including a substrate enclosing a cavity, a cantilever beam at least partially suspended above the cavity, a piezoelectric actuator away from the cavity, a polymer layer away from the cavity and attached to the cantilever beam and the piezoelectric actuator for completely covering the cantilever beam, the piezoelectric actuator and the cavity, and a piezoelectric composite vibration structure formed by the polymer layer. The cantilever beam includes a first section fixed to the substrate, a second section extending from the first section to the cavity and suspended above the cavity, and a third section extending from the second section away from the first section, an end of the third section away from the second section being suspended; and the piezoelectric actuator is only fixed with the third section.

Abstract: The present disclosure discloses a MEMS speaker including a housing with a receiving space; a MEMS speaker chip with an inner cavity, accommodated in the receiving space and connected with the housing, the MEMS speaker chip dividing the receiving space into a first cavity and a second cavity communicating with the inner cavity; a sound hole communicating with the first cavity or the second cavity; and a damping mesh connected to the housing and covering the sound hole; wherein sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.