Abstract: A speaker structure includes a base, a diaphragm, a drive part, a first transmission part, and a second transmission part; the drive part including a first drive portion and a second drive portion, the first drive portion extending from the first end towards the second end, at least a segment of the first drive portion being disposed above the cavity, the second drive portion extending from the second end towards the first end, at least a segment of the second drive portion being disposed above the cavity, the segments of the first drive portion and the second drive portion disposed above the cavity being set in a crosswise configuration, the first transmission part being in direct contact with the first drive portion and the diaphragm, respectively, the second transmission part being in direct contact with the second drive portion and the diaphragm, respectively.

Abstract: Provided are a MEMS controller and a MEMS device. The MEMS controller includes: at least one control unit including: two adjacent first anchor structures with a gap formed therebetween; cantilever beam structures respectively corresponding to the two first anchor structure, a first end of each of the cantilever beam structures being located at a top surface of a corresponding first anchor structure, and second ends of two adjacent cantilever beam structures directly facing each other and forming a second gap therebetween; and a diaphragm covering top surfaces of two second anchor point structures; and an encapsulation structure including a bottom plate, a side plate and a top plate connected in sequence. The bottom plate is provided with a first flow channel port, penetrating through the bottom plate, corresponding to the control unit and connected to the first gap of the corresponding control unit.

Abstract: Provided are a MEMS controller and a MEMS device, including: at least one control unit including: two adjacent anchor structures with a first gap therebetween; and cantilever beam structures respectively corresponding to the two anchor structure, a first end of each cantilever beam structure being located at a top surface of the anchor structure corresponding thereto, and second ends of two adjacent cantilever beam structures directly facing each other and forming a second gap therebetween; and an encapsulation structure including a bottom plate, a side plate and a top plate connected in sequence, the bottom plate directly facing the top plate. The bottom plate is located at the bottom surface of the anchor structure and provided with a first flow channel port. The top plate is spaced from the top surfaces of the two cantilever beam structures and provided with a second flow channel port.

Abstract: A speaker module includes a first MEMS speaker and a second MEMS speaker disposed at two opposite surfaces of a circuit board and mounted in a flipped manner; the first MEMS speaker including a first diaphragm structure electrically connected to a first electrode connection point and is controlled by the circuit board to vibrate; the second MEMS speaker including a second diaphragm structure electrically connected to a second electrode connection point and is controlled by the circuit board to vibrate.

Abstract: Provided is a speaker, including: a diaphragm structure including first and second diaphragms, the first diaphragm is configured to push air to vibrate to generate initial sound wave, and a signal of which is modulated based on a signal within an audible sound frequency band; and a cover plate structure enclosing with the diaphragm structure to form sound-generating cavity, the cover plate structure has a sound outlet hole connecting the sound-generating cavity with outside, the initial sound wave in the sound-generating cavity is transmitted to the outside through the at least one sound outlet hole to form a sound signal, the second diaphragm and the cover plate structure generate an acoustic environmental impedance used to modulate the initial sound wave to change sound pressure of the sound signal. The speaker can modulate and output a sound signal covering the audible sound frequency band based on the acoustic environmental impedance.

Abstract: Embodiments of the present disclosure relate to the field of semiconductor technology, and provide a semiconductor structure and a production method thereof. The method for producing semiconductor structures includes: providing a substrate; forming an initial photoresist layer on the substrate, and patterning the initial photoresist layer to form a photoresist layer, where a plurality of positioning openings passing through the photoresist layer are defined on the photoresist layer; forming an initial target layer on a surface of the photoresist layer away from the substrate, where the initial target layer fills in the plurality of positioning openings; removing portions of the initial target layer protruding from the surface of the photoresist layer away from the substrate, where portions of the initial target layer filling in the plurality of positioning openings form a target layer; and removing the photoresist layer.

Abstract: The present disclosure discloses a MEMS speaker including a substrate with a cavity and a sounding assembly connected with the substrate, the substrate comprising an outer surface away from the cavity and connected with the sounding assembly, a top surface opposite to the outer surface and a side surface respectively connected with the outer surface and the top surface; a printed circuit board with a through hole and connected with the outer surface of the substrate; a first shell connected with the top surface of the substrate; and a damping mesh covering the through hole and connected with the printed circuit board; wherein sounds emitted by the sounding assembly transmit outward through the through hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.

Abstract: The present invention provides a speaker device having a support structure with a support body provided with a sound chamber and an annular sound hole. The speaker device further includes an ultrasonic sound emitting unit for emitting symmetrical ultrasonic waves, and a demodulation structure with a diaphragm and multiple fixed parts. The diaphragm is spaced apart from the sound hole. The ultrasonic waves emitted by the ultrasonic sound emitting unit drive the demodulation structure to vibrate, adjusting the size of the gap. Compared with the prior art, the speaker device of the present invention has high sound wave demodulation efficiency, good improvement in vibration system amplitude, and excellent acoustic performance.

Abstract: The present disclosure provides a MEMS speaker including a supporting member, a diaphragm used for emitting an amplitude-modulated ultrasonic wave, and an acoustic valve. The supporting member includes a supporting body and an acoustic hole, the acoustic valve includes a valve body fixed with a peripheral side of the supporting body and located in the acoustic hole and a variable section valve hole permeating from one end of the valve body to the other end thereof, the diaphragm is fixed with an inner peripheral side of the supporting body and located in the acoustic hole, the variable section valve hole allows the amplitude-modulated ultrasonic wave passing through the variable section valve hole to produce a modulated acoustic wave. Compared with the related art, the MEMS speaker could enhance the efficiency and amplitude of acoustic wave demodulation, and the acoustic performance could be enhanced.

Abstract: An embodiment of the present disclosure provides an earphone, which includes a housing with a cavity, a first speaker housed in the cavity for producing low-frequency sounds, a second speaker for producing mid to high frequency sounds, and a sound damping mesh. The housing includes a sound outlet penetrating therethrough, and the cavity is connected with the outside through the sound outlet. The second speaker is fixed to the sound damping mesh. The sound damping mesh completely separates the first speaker from the second speaker. The low-frequency sound emitted by the first speaker is transmitted to the sound outlet through the sound damping mesh.

Abstract: The present invention discloses a micro-electromechanical system (MEMS) loudspeaker, which includes a supporting structure, a diaphragm and a barrier plate. The supporting structure includes a supporting body and a sound hole penetrating from one end of the supporting body to the other end. The diaphragm is fixed on an inner circumferential side of the supporting body and located in the sound hole. The diaphragm is configured to vibrate and generate amplitude-modulated ultrasonic waves. The barrier plate is covered and fixed to one end of the supporting body. Due to the distance between the barrier plate and the diaphragm, the amplitude-modulated ultrasonic waves are demodulated to obtain modulated sound waves. Thereby improving the sound wave demodulation efficiency and amplitude of the MEMS loudspeaker and further improving the acoustic performance of the MEMS loudspeaker.

Abstract: Acoustic sensor and manufacturing method. The acoustic sensor includes: a base including a first silicon layer, a first oxide layer and a second silicon layer stacked, and a back cavity; a second oxide layer formed on the base; a piezoelectric unit formed on the second oxide layer and including a first electrode layer, a piezoelectric layer and a second electrode layer stacked; a first slit formed at a middle portion of the second electrode layer and passing the second electrode layer, the piezoelectric layer and the first electrode layer; a second slit formed at a middle portion of the second silicon layer and passing the second silicon layer and the second oxide layer; an additional membrane filled in the first slit and not filled in the second slit. The SPL and structural reliability are effectively improved, and the material type is not limited by dry film type materials.

Abstract: A Micro-Electro-Mechanical System (MEMS) speaker is provided including only a substrate enclosing a cavity, a piezoelectric diaphragm disposed above the substrate and covering the cavity, and a flexible structure layer covering the piezoelectric diaphragm. Both the piezoelectric diaphragm and the flexible structure layer are complete sheet structures, a young modulus of the flexible structure layer is less than a young modulus of the piezoelectric diaphragm, and the young modulus of the flexible structure layer is in a range of 100 MPa to 50 GPa. The MEMS speaker in the present disclosure does away with a harder structure layer and adopts a softer flexible structure layer, which better enhances the displacement and has a more prominent acoustic performance.

Abstract: The present disclosure discloses a speaker including at least one ultrasound unit, including: a bottom ultrasound component, a plurality of displacement assemblies. The displacement assembly includes a displacement component mounted on the bottom ultrasound component, and a resonance component. The resonance component including at least one Helmholtz resonance chamber is configured to resonate by way of vibration of the displacement component for changing a volume of each of the at least one Helmholtz resonance chamber. An ultrasonic signal emitted by the bottom ultrasound component is demodulated to a low frequency signal in the at least one Helmholtz resonance chamber. The low frequency signal is transmitted to outside through the sound output channel.

Abstract: A bone conduction microphone is disclosed. The bone conduction microphone includes a substrate having a cavity with two end openings, a backplate disposed above the substrate, a vibration structure disposed between the backplate and the substrate, and a limiter for limiting a maximum displacement of the vibration structure. The vibration structure includes a diaphragm disposed between the backplate and the substrate and arranged at intervals with the backplate and the substrate respectively and a mass block suspended by the diaphragm and inserted into the cavity through one end opening of the cavity. The bone conduction microphone improves the reliability.

Abstract: The present invention provides a speaker device having a support structure with a support body provided with a sound chamber and an annular sound hole. The speaker device further includes an ultrasonic sound emitting unit for emitting symmetrical ultrasonic waves, and a demodulation structure with a diaphragm and multiple fixed parts. The diaphragm is spaced apart from the sound hole. The ultrasonic waves emitted by the ultrasonic sound emitting unit drive the demodulation structure to vibrate, adjusting the size of the gap. Compared with the prior art, the speaker device of the present invention has high sound wave demodulation efficiency, good improvement in vibration system amplitude, and excellent acoustic performance.

Abstract: The present disclosure provides a MEMS speaker including a supporting member, a diaphragm used for emitting an amplitude-modulated ultrasonic wave, and an acoustic valve. The supporting member includes a supporting body and an acoustic hole, the acoustic valve includes a valve body fixed with a peripheral side of the supporting body and located in the acoustic hole and a variable section valve hole permeating from one end of the valve body to the other end thereof, the diaphragm is fixed with an inner peripheral side of the supporting body and located in the acoustic hole, the variable section valve hole allows the amplitude-modulated ultrasonic wave passing through the variable section valve hole to produce a modulated acoustic wave. Compared with the related art, the MEMS speaker could enhance the efficiency and amplitude of acoustic wave demodulation, and the acoustic performance could be enhanced.

Abstract: Provided is a method for manufacturing a MEMS acoustic sensor. A structural layer and a piezoelectric material layer are stacked on the substrate. Photolithography modeling is performed on the piezoelectric material layer and the structural layer. A polymer layer is stacked on the piezoelectric material layer. The substrate is etched to form a cavity. A first part of a jig is stacked on the polymer layer. The jig, the substrate, the piezoelectric material layer, and the polymer layer are heated. Air is introduced into the cavity and a pressure inside the cavity is controlled. An atmospheric pressure load of the air is maintained and the air is cooled. The pressure inside the cavity is stopped to be controlled and the pressure inside the cavity is reduced, the jig is disassembled, and a wafer is cut to obtain the MEMS acoustic sensor, to effectively improve the accuracy and reliability in processing.

Abstract: The present invention provides a MEMS piezoelectric speaker including a substrate with a back cavity, a diaphragm, a capacitive system and a flexible film. The diaphragm includes a fixed end, a suspended end. Adjacent suspended ends are at least partially spaced to form a slit. The suspended end includes a support section and a piezoelectric section. Along the thickness direction of the MEMS piezoelectric speaker, a flexible film is at least partially spaced from the diaphragm and the flexible film is spaced from the substrate. This design can improve the sound pressure level of the MEMS piezoelectric speaker in the middle and high frequency, and improve the acoustic performance of the MEMS piezoelectric speaker.

Abstract: Acoustic sensor and manufacturing method. The acoustic sensor includes: a base including a first silicon layer, a first oxide layer and a second silicon layer stacked, and a back cavity; a second oxide layer formed on the base; a piezoelectric unit formed on the second oxide layer and including a first electrode layer, a piezoelectric layer and a second electrode layer stacked; a first slit formed at a middle portion of the second electrode layer and passing the second electrode layer, the piezoelectric layer and the first electrode layer; a second slit formed at a middle portion of the second silicon layer and passing the second silicon layer and the second oxide layer; an additional membrane filled in the first slit and not filled in the second slit. The SPL and structural reliability are effectively improved, and the material type is not limited by dry film type materials.