Abstract: Disclosed herein is a dual-active bridge converter and methods of operating the same. The dual-active bridge converter can include a transformer, a DC-AC converter, an AC-DC converter, and/or a control device. The DC-AC converter can be coupled to a first DC bus and a primary side of the transformer. The AC-DC converter can be coupled to a secondary side of the transformer and a second DC bus. The control device can send a first PWM signal to the DC-AC converter and a second PWM signal to the AC-DC converter. The first and second PWM signals can initiate the output voltage at zero, add jump edges at odd-numbered current harmonics, or make a phase of the input voltage trail a phase of the output voltage of the DC-AC converter. The control device can adjust the PWM signals for transformer current regulation or pulse overlap control.

Abstract: The apparatus may be provided to improve a PAPR in at least one of a single-carrier FDM signal or DFT-s-OFDM. The apparatus may be configured to encode a set of information bits with a channel encoder; generate, based on a set of encoded bits from the channel encoder, a set of amplitude symbols using a distribution matching function; generate a set of modulated symbols based on the set of amplitude symbols; and transmit, to a second device, a signal based on the set of modulated symbols. An apparatus may be configured to receive, from a first device, a signal based on a set of modulated symbols and derive a set of encoded bits based on the received set of modulated symbols using a distribution matching function.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive information indicating a condition for a conditional handover, and an indication to communicate on a source cell after transmitting a message on a target cell, associated with the conditional handover, and before receiving an additional message on the target cell. The UE may transmit the message on the target cell responsive to the condition for the conditional handover being satisfied. Numerous other aspects are described.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a wireless communication device may obtain, at an access stratum (AS) layer, an indication of an inter-satellite link (ISL) activation that is to take place at an activation time. The wireless communication device may receive communications. The wireless communication device may buffer the communications in a buffer at the AS layer. The wireless communication device may release the communications from the buffer to an upper protocol layer at a rate of release that is to change between a transition start time and the activation time. Numerous other aspects are described.

Abstract: Methods, systems, and devices for wireless communication at a user equipment (UE) are described. A UE may operate by asynchronously transmitting code division multiple access (CDMA) uplink signals to a network entity. The UE may transmit the CDMA signals via an uplink channel that may be shared with orthogonal frequency multiplexing (OFDM) signaling transmitted by one or more other UEs. The UE may indicate to the network entity a capability for communicating with CDMA waveforms and may use CDMA waveforms based on transmitting the indication. The UE may also receive one or more parameters associated with using the CDMA waveforms, and may use CDMA waveforms based on the one or more parameters. The uplink channel may be a random access channel (RACH) and may support RACH transmissions, or may be a data channel and support data transmissions.

Abstract: Embodiments provide a core network selection method, an apparatus, and a system. The method includes the following steps: obtaining first dedicated core network (DCN) information from an access network device, where the first DCN information includes information about at least one DCN that can be accessed by the access network device. The method also includes selecting a to-be-accessed DCN from the at least one DCN according to the first DCN information, and sending information about the to-be-accessed DCN to the access network device, so that the access network device determines a core network device according to the information about the to-be-accessed DCN.

Abstract: A ripple control method for a modular cascaded power conversion device is provided. The method obtains, according to a grid voltage vector of three-phase AC power, a second-order fluctuating voltage superposition vector representing the total amount of second-order fluctuating voltages on respective floating DC sides of the three phases; determines a single-phase power control amount of each phase to be transferred from the floating DC sides to a low-voltage DC side; determines a single-module power control amount of each power module to be transferred to a low-voltage DC side thereof; and generates a single-module control signal for controlling the power module, so as to transfer a second-order fluctuating voltage on a floating DC side of the power module to the low-voltage DC side thereof. A modular cascaded power conversion device is also provided.

Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may release a connection with a first network entity and determine a first virtual coverage area of the UE based on a geographic location of the UE associated with the release of the connection. The UE may obtain a message that includes area information. The area information may be indicative of one or more second virtual coverage areas, which the UE may use in determining whether to monitor for a paging early indication (PEI). Based on the first virtual coverage area and the one or more second virtual coverage areas may monitor for a paging message, such as the PEI or downlink control information (DCI) associated with a paging occasion.

Abstract: A solderless battery pack is provided that includes a battery port, a protective plate, an upper end plate, a lower end plate, cell groups and a cell locking mechanism. The cell groups are arranged between the upper end plate and the lower end plate and include a cell installation bracket, cells and a PCB busbar. The cell locking mechanism includes a metal upper pressing plate, a metal lower pressing plate and a fastening long bolt that passes through the metal upper pressing plate, the metal lower pressing plate, the upper end plate, the lower end plate and the cell groups.

Abstract: A packaging structure includes: a substrate provided with a through-cavity penetrating up and down, and a metal heat sink on a front surface of the substrate; a bonding chip mounting area and a first passive element mounting area on the front surface, and a flip chip mounting area, a second passive element mounting area and a pin lead mounting area are provided on a back surface of the substrate; a first sealing ring located at the periphery of the bonding chip mounting area and the first passive element mounting area; a first cover plate packaged on the first sealing ring; a second sealing ring located at the periphery of the flip chip mounting area and the second passive element mounting area with the pin lead mounting area being located at the periphery of the second sealing ring; and a second cover plate packaged on the second sealing ring.

Abstract: A packaging structure includes: a substrate provided with a through-cavity penetrating up and down, and a metal heat sink on a front surface of the substrate; a bonding chip mounting area and a first passive element mounting area on the front surface, and a flip chip mounting area, a second passive element mounting area and a pin lead mounting area are provided on a back surface of the substrate; a first sealing ring located at the periphery of the bonding chip mounting area and the first passive element mounting area; a first cover plate packaged on the first sealing ring; a second sealing ring located at the periphery of the flip chip mounting area and the second passive element mounting area with the pin lead mounting area being located at the periphery of the second sealing ring; and a second cover plate packaged on the second sealing ring.