Patents by Inventor Qiang Hua Pan

Qiang Hua Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE
    Publication number: 20080054420
    Abstract: In one embodiment, a semiconductor package includes a lead frame having a lead portion and pad portion that are offset with respect to each other. The lead portion includes a deep formed impression. An up-bent portion connects the lead portion to the pad portion.
    Type: Application
    Filed: August 23, 2006
    Publication date: March 6, 2008
    Inventors: Guan Keng Quah, Hou Boon Tan, Qiang Hua Pan