Patents by Inventor Qiang (John) Zhang

Qiang (John) Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250110152
    Abstract: A method for characterizing the interaction force between lignin and cellulase is provided. The method includes the following steps: (1) preparation of lignin film: preparing a lignin solution, then dropwise adding the solution onto a silicon wafer, repeatedly spin-coating with a spin coater, and vacuum-drying the prepared lignin film; (2) AFM probe modification: modifying an AFM probe coated with a gold film on the surface with HS-PEG-COOH and then activating the carboxyl group, immersing the AFM probe after the carboxyl group activation in a PBS solution of cellulase for incubation, and after the modification is completed, placing the washed AFM probe in a PBS buffer solution for storage for later use; (3) testing the lignin-cellulase interaction force by using an AFM instrument in a liquid phase environment. AFM is used to quantitatively characterize the interaction between the cellulase and lignin in a liquid environment.
    Type: Application
    Filed: August 31, 2023
    Publication date: April 3, 2025
    Applicant: NANJING FORESTRY UNIVERSITY
    Inventors: Caoxing HUANG, Xiaoxue ZHAO, Qiang YONG, Chenhuan LAI, Yongcan JIN
  • Publication number: 20250112427
    Abstract: A cable connector assembly includes: a mating plug including plural conductive terminals; a circuit board being electrically connected to the mating plug and including: plural terminal pads located at a front of the circuit board and mechanically and electrically connected to the conductive terminals; plural cable pads located at a rear of the circuit board and including plural pairs of high-speed cable pads; and plural conductive traces each connecting a corresponding terminal pad and a corresponding cable pad; and a cable mechanically and electrically connected to the cable pads; wherein the cable includes plural pairs of high-speed wires for transmitting high-speed signals, the conductive traces include plural pairs of high-speed conductive traces connecting the plural pairs of high-speed cable pads and corresponding terminal pads, each pair of high-speed cable pads are connected to a nearest pair of terminal pads.
    Type: Application
    Filed: September 26, 2024
    Publication date: April 3, 2025
    Inventors: TING-CUI WANG, Yang-Tsun Hsu, Chun-Chen Lin, Jun Chen, Wen-Qiang Lan, Fei-Fan Jing
  • Publication number: 20250111816
    Abstract: A pixel circuit, a display substrate, and a display apparatus are provided. The pixel circuit includes a driving sub circuit, a data writing sub circuit, a first light-emitting control sub circuit, a first reset sub circuit, and a bias sub circuit; the first reset sub circuit is connected to a first node and configured to write a first reset voltage to the first node in response to a first reset control signal; and the bias sub circuit is connected to a second node and configured to write a reference voltage to the second node in response to a bias control signal, thereby turning on the driving sub circuit.
    Type: Application
    Filed: December 13, 2024
    Publication date: April 3, 2025
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Xinyu Wei, Kai Zhang, Qiang Fu, Gang Wang, Erlong Song, Hongmei Fan, Kunyan Shi
  • Publication number: 20250112188
    Abstract: Methods of selectively transferring integrated circuit (IC) components between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a release layer and a layer of IC components over the release layer is received, and a second substrate with one or more adhesive areas is received. The layer of IC components may include one or more antennas, interconnects, inductors, capacitors, or transformers. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Georgios C. Dogiamis, Qiang Yu, Adel Elsherbini, Tushar Kanti Talukdar, Thomas L. Sounart
  • Publication number: 20250113402
    Abstract: An electronic device includes a transceiver and processing circuitry that is operatively coupled to the transceiver. The processing circuitry is configured to transmit, via the transceiver and to a second electronic device, a request for a wireless communication session with the second electronic device. The processing circuitry is also configured to communicate, via the transceiver, one or more first wireless signals during the wireless communication session with the second electronic device. Additionally, the processing circuitry is configured, after communicating the one or more first wireless signals, to extend the wireless communication session by transmitting, via the transceiver and to the second electronic device, one or more second wireless signals based on no wireless signals being communicated via the wireless communication session for a duration of time.
    Type: Application
    Filed: August 20, 2024
    Publication date: April 3, 2025
    Inventors: Lijie Zhang, Qiang Miao, Zhiwei Wang, Huachao Xiong, Ying Zhang
  • Patent number: 12267635
    Abstract: A manufacturing process for a grille element of a media playback system is provided. In one embodiment a sheet of plastic is thermoformed into a desired shape. Holes may have been drilled into the sheet of plastic prior to being thermoformed. Once thermoformed into the desired shape, a coating is applied and cured via a subsequent heat treatment process that anneals the material to remove additional stresses in the material from thermoforming. Once formed and heat treated, the formed component can be bonded to profile substrates to help maintain the formed desired shape.
    Type: Grant
    Filed: February 17, 2020
    Date of Patent: April 1, 2025
    Assignee: Sonos, Inc.
    Inventors: Wei-Hean Liew, Wulin Xia, Teik Siang Lee, Qiang Wu, Tristan Taylor, Philippe Vossel, Edward Mitchell, Jonathan Oswaks
  • Patent number: 12267264
    Abstract: An apparatus, e.g., a UE, for transmission of information modulated onto RSs using index modulation is disclosed. The UE may receive, from a base station, a configuration of one or more RS resources of an RS resource set. The one or more RS resources may be associated with an index modulation technique including a plurality of UL or DL information bits. The UE may transmit, to the base station, or receive, from the base station, the plurality of UL or DL information bits. The plurality of UL or DL information bits may include at least one of one or more first bits or one or more second bits. At least one of the one or more RS resources may be selected based on at least one of the one or more first bits or the one or more second bits.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: April 1, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Iyab Issam Sakhnini, Tao Luo, Junyi Li, Mahmoud Taherzadeh Boroujeni, Wanshi Chen, Qiang Wu, Jun Ma, Linhai He, Peter Gaal
  • Patent number: 12268097
    Abstract: A memory array device includes an array of memory cells located over a substrate, a memory-level dielectric layer laterally surrounding the array of memory cells, and top-interconnection metal lines laterally extending along a horizontal direction and contacting a respective row of top electrodes within the memory cells. Top electrodes of the memory cells are planarized to provide top surfaces that are coplanar with the top surface of the memory-level dielectric layer. The top-interconnection metal lines do not extend below the horizontal plane including the top surface of the memory-level dielectric layer, and prevent electrical shorts between the top-interconnection metal lines and components of memory cells.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yu-Feng Yin, Tai-Yen Peng, An-Shen Chang, Qiang Fu, Chung-Te Lin, Han-Ting Tsai
  • Patent number: 12267929
    Abstract: A lighting control method is provided for an ambient lighting device having an ambient lamp including at least one lighting strip, which includes a plurality of lamp beads arranged into a display frame. The method includes starting the ambient lamp and a camera; reading preset frame configuration information, and dividing the display frame into a plurality of unit frames according to the frame configuration information; reading an environment reference image captured by the camera, and dividing the environment reference image into a plurality of regional images corresponding to the plurality of unit frames according to the frame configuration information; and generating a lighting color value corresponding to each lamp bead in each unit frame, based on a main color tone of the regional image corresponding to the unit frame, and controlling the corresponding lamp beads covered by the unit frame with the lighting color value to emit light.
    Type: Grant
    Filed: October 25, 2024
    Date of Patent: April 1, 2025
    Assignee: Shenzhen Intellirocks Tech. Co., Ltd.
    Inventors: Qiang Li, Wenlong Wu
  • Patent number: 12267646
    Abstract: An acoustic transducer includes: substrate including first silicon layer, first oxide layer and second silicon layer, back chamber is formed therethrough; second oxide layer on the substrate; piezoelectric unit on the second oxide layer and including first electrode layer, piezoelectric layer and second electrode layer; slit and opening formed in the second electrode layer; metal pad stacked on the first electrode layer at the opening; and additional film layer including first, second and third parts, the first part is in the slit, side wall and bottom wall of the first part form groove, and through slot is formed in the third part to expose metal pad.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 1, 2025
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: KianHeng Goh, Chungmin Li, Qiang Dan, Kahkeen Lai
  • Patent number: 12267125
    Abstract: The embodiments of the present disclosure provide a near-field communication control method, device, and display device. The near-field communication control device is applied to a display device. The display device includes a display panel, a near-field communication coil and a display control circuit, wherein the display panel includes a plurality of display periods, and each display period includes a field blanking phase and an effective display phase, the near-field communication control device includes: a first receiving circuit configured to receive a synchronization signal output from the display control circuit, wherein the display panel displays an image during the effective display phase under the control of the synchronization signal; and a driving circuit configured to output a driving signal to the near-field communication coil during the field blanking phase, according to the synchronization signal.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: April 1, 2025
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Qian Chen, Hongqiang Luo, Xiaofeng Luo, Yang Yang, Qiang Wang
  • Patent number: 12263016
    Abstract: A hospital bed may include a bed frame, a first bed board and an auxiliary component. The first bed board is connected to the bed frame. The auxiliary component may include a connecting frame, a first moving and supporting mechanism and a second bed board. The connecting frame is detachably connected to the first bed board. The first moving and supporting mechanism is connected to the connecting frame. The second bed board is connected to the first moving and supporting mechanism and can carry an object along the bearing direction. The second bed board is arranged on one side of the first bed board along the bearing direction. The first moving and supporting mechanism can drive the second bed board to move relative to the first bed board along an adjustment direction, where the adjustment direction is perpendicular to the bearing direction.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: April 1, 2025
    Assignee: Siemens Healthineers AG
    Inventors: Chao Ming He, Ting Qiang Xue, Bin Kuang
  • Patent number: 12263876
    Abstract: An extended collapsible wagon including a handle, a first supporting frame, and a second supporting frame. The first supporting frame and the second supporting frame are connected with a pair of connecting members. Each connecting member comprises three scissor hinge structures. A folding base frame is provided below the receiving space defined between the first and second supporting frames and the pair of connecting members, to provide a sturdy support structure for the flexible container. The folding base frame includes first and second base frame panels located below respective one of two adjacent scissor hinge structures and a third base frame panel having two sub-panels pivotally connected to fold below the third scissor hinge structure. The first base frame is pivotally connected to the second base frame panel, and the second base frame is pivotally connected to the third base frame, so as to form the foldable base frame.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: April 1, 2025
    Assignee: MAXTON ENGINEERING LTD.
    Inventor: Shou Qiang Zhu
  • Patent number: 12264160
    Abstract: The invention relates to pharmaceutical compositions comprising compounds of Formula Q: wherein W is —N(CH3)—, and Y is —C(O)—, in free base or pharmaceutically acceptable salt form, and methods of use in the treatment of diseases involving 5-HT2A receptor, serotonin transporter (SERT) pathway and/or the dopamine D2 receptor pathway, and methods of treating conditions of the central nervous system therewith.
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: April 1, 2025
    Assignee: INTRA-CELLULAR THERAPIES, INC.
    Inventors: Peng Li, Qiang Zhang, Robert Davis, Lawrence P. Wennogle
  • Patent number: 12266840
    Abstract: Waveguide interconnects for semiconductor packages are disclosed. An example semiconductor package includes a first semiconductor die, a second semiconductor die, and a substrate positioned between the first and second dies. The substrate includes a waveguide interconnect to provide a communication channel to carry an electromagnetic signal. The waveguide interconnect is defined by a plurality of through substrate vias (TSVs). The TSVs in a pattern around the at least the portion of the substrate to define a boundary of the communication channel.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: April 1, 2025
    Assignee: Intel Corporation
    Inventors: Georgios Dogiamis, Johanna Swan, Adel Elsherbini, Shawna Liff, Beomseok Choi, Qiang Yu
  • Patent number: 12266206
    Abstract: A hand acupoint positioning method, device, acupuncture robot and storage medium, which comprises: obtaining reflex zones of a hand image and topology relationship of hand acupoints; splicing the reflex zones, the topology relationship and the hand image to obtain a hand splicing image; inputing the hand splicing image into an acupoint recognition model to obtain the hand acupoints. The invention uses reflex zones as auxiliary information and topology relationship as priority knowledge. More context information can be added to the hand acupoint positioning process, which improves the positioning accuracy of the hand acupoints.
    Type: Grant
    Filed: October 9, 2024
    Date of Patent: April 1, 2025
    Assignee: JIANGHAN UNIVERSITY
    Inventors: Qiang He, Yi Zheng, Hongxing Zhang, Qian Tu
  • Publication number: 20250101163
    Abstract: The invention provides a carbon dioxide-based polyurethane elastomer with damping and anti-fatigue aging properties and its preparation method. It is obtained from Component A and Component B; Component A includes: PTMG-1000 45˜60 parts, carbon dioxide-based polyol 25˜30 parts, poly-DOPO-ITA-pentanediol ester 10˜20 parts, BDO 3˜5 parts, water 0.3˜0.5 parts, N-methylimidazole 0.5˜0.8 parts, bis(2-dimethylaminoethyl) ether 0.1˜0.2 parts, needle-shaped nano-titanium dioxide 0.5 parts, hindered phenol 0.2˜0.5 parts, dibutyltin dilaurate 0.1˜0.3 parts, strontium chloride 0.005˜0.01 parts, rhodium chloride 0.02˜0.03 parts, foaming agent 0.2˜0.5 parts; Component B includes: carbon dioxide-based polyol 50˜55 parts, MDI-50 45˜50 parts, organic zinc 0.01˜0.02 parts, organic bismuth 0.01˜0.02 parts.
    Type: Application
    Filed: November 8, 2023
    Publication date: March 27, 2025
    Inventors: Quanxiao Dong, Peng Qiu, Xueliang Cui, Yubao Guo, Xingxu Bao, Songran Liu, Ruixue Niu, Simeng Yan, Yitong Shen, Huihui Xu, Songqi Zhang, Yuanqing Zhang, Junheng Xiao, Xianhong Wang, Hongming Zhang, Haitao Liu, Weibin Liu, Fengxiang Gao, Yanlei Dong, Zirui Li, Huan Zhang, Yanshan Li, Chengliang Li, Minxiao Zhang, Tiantian Song, Zhi Liu, Yongwang Wei, Xiaoru Liu, Linheng Bao, Lifen Li, Ruolin Jiang, Xiaozhao Yu, Cheng Qiu, Li Zhang, Kuan Liu, Yuqing Wen, Hang Zhao, Liting Dong, Qiang Zhao, Ning Zhang, Hongsong Guan, Ling Gao, Huitong Pei
  • Publication number: 20250106980
    Abstract: The embodiments of the present application relate to the technical field of integrated circuit packaging. Provided are a packaging structure and an integrated circuit board. The packaging structure includes: a substrate having a plurality of first conductive layers and a plurality of second conductive layers, where the first conductive layers and the second conductive layers have different electric property types; a redistribution structure including redistribution layers at a plurality of layers and arranged at intervals, wherein the redistribution layers located at the same layer have the same electric property type, and the redistribution layers located at adjacent layers have different electric property types; and a plurality of conductive bumps electrically connected to the first conductive layers or the second conductive layers through the redistribution structure.
    Type: Application
    Filed: February 25, 2022
    Publication date: March 27, 2025
    Inventors: Qiang JIANG, Leqi LI, Zongwei WANG, Jian PANG, Tuobei SUN
  • Patent number: D1068216
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: April 1, 2025
    Assignee: KINREEN TECHNOLOGY (SHENZHEN) CO., LTD.
    Inventors: Qiang Zhang, Bin Yi, Bing Hao, Meihua Gong, Fubao Cheng
  • Patent number: D1069139
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: April 1, 2025
    Assignee: KINREEN TECHNOLOGY (SHENZHEN) CO., LTD.
    Inventors: Qiang Zhang, Bin Yi, Bing Hao, Meihua Gong, Fubao Cheng