Patents by Inventor Qiang Lei
Qiang Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11608502Abstract: The invention belongs to the field of genetic engineering technology and application thereof, and in order to solve the problems of lack of high efficient TMV-resistant RNAi nano-preparation at present, complicated preparation process of medicament, poor stability and delivery efficiency of dsRNA, the invention provides an RNAi nano-preparation, preparation method thereof and application thereof in TMV prevention and control. The RNAi nano-preparation is prepared from dsRNA and chitosan nano materials, wherein, dsRNA is a highly TMV-resistant RdRP3 gene with a length of 313 bp obtained from screening, with nucleotide sequence shown in SEQ ID NO.1, and the volume ratio of the chitosan to 1 ?g/?l dsRNA is 10:(1-6).Type: GrantFiled: August 20, 2020Date of Patent: March 21, 2023Assignees: TOBACCO RESEARCH INSTITUTE OF CHINESE ACADEMY OF AGRICULTURAL SCIENCES, SICHUAN BRANCH OF CHINA TOBACCO, LIANGSHAN BRANCH OF SICHUAN TOBACCOInventors: Jinguang Yang, Fenglong Wang, Xiang Xu, Ying Li, Liyun Song, Lili Shen, Qiang Lei, Changchun Feng, Bin Li, Yong Wang, Dongyang Liu, Lianqiang Jiang
-
Patent number: 11375718Abstract: The present invention belongs to the technical field of application of microbial secondary metabolites, and particularly relates to novel use of prodigiosin in resisting potato virus Y. Application of prodigiosin in preparing a medicine for preventing and controlling potato virus Y. The medicine for preventing and controlling the potyvirus is a liquid or solid preparation containing prodigiosin. It is clarified that PVY promotes its own replication and infection by recruiting host factor Hsp70 in the process of infecting the host, realizing virus infection and spread. Hsp70 plays an important role in the infection and replication of plant viruses. Based on the above results, it is further clarified that prodigiosin treatment can significantly increase the ubiquitination level of the plant host, promote the ubiquitination of HSP70 protein of the host, degrade or inhibit the expression of Hsp70 protein, activate the natural immune activity of the host plant.Type: GrantFiled: September 25, 2020Date of Patent: July 5, 2022Assignees: Liangshan Branch of Sichuan Tobacco, Sichuan Branch of China Tobacco, Tobacco Resarch Inst. of Chi. Acad. of Agr. SciInventors: Jinguang Yang, Fenglong Wang, Xiang Xu, Ying Li, Liyun Song, Lili Shen, Qiang Lei, Changchun Feng, Bin Li, Yong Wang, Dongyang Liu, Lianqiang Jiang
-
Patent number: 11282798Abstract: Structures for a corner area of a chip and methods of fabricating a structure for a corner area of a chip. A chip includes an active circuit region, an integrated circuit in the active circuit region, and a corner area. The corner area includes dummy structures that provide dummy fill.Type: GrantFiled: February 20, 2020Date of Patent: March 22, 2022Assignee: GlobalFoundries U.S. Inc.Inventors: Qiang Lei, Bo Bai
-
Publication number: 20210400965Abstract: The present invention belongs to the technical field of application of microbial secondary metabolites, and particularly relates to novel use of prodigiosin in resisting potato virus Y. Application of prodigiosin in preparing a medicine for preventing and controlling potato virus Y. The medicine for preventing and controlling the potyvirus is a liquid or solid preparation containing prodigiosin. It is clarified that PVY promotes its own replication and infection by recruiting host factor Hsp70 in the process of infecting the host, realizing virus infection and spread. Hsp70 plays an important role in the infection and replication of plant viruses. Based on the above results, it is further clarified that prodigiosin treatment can significantly increase the ubiquitination level of the plant host, promote the ubiquitination of HSP70 protein of the host, degrade or inhibit the expression of Hsp70 protein, activate the natural immune activity of the host plant.Type: ApplicationFiled: September 25, 2020Publication date: December 30, 2021Inventors: Jinguang YANG, Fenglong WANG, Xiang XU, Ying Li, Liyun Song, Lili SHEN, Qiang LEI, Changchun FENG, Bin LI, Yong WANG, Dongyang LIU, Lianqiang JIANG
-
Publication number: 20210363529Abstract: The invention belongs to the field of genetic engineering technology and application thereof, and in order to solve the problems of lack of high efficient TMV-resistant RNAi nano-preparation at present, complicated preparation process of medicament, poor stability and delivery efficiency of dsRNA, the invention provides an RNAi nano-preparation, preparation method thereof and application thereof in TMV prevention and control. The RNAi nano-preparation is prepared from dsRNA and chitosan nano materials, wherein, dsRNA is a highly TMV-resistant RdRP3 gene with a length of 313 bp obtained from screening, with nucleotide sequence shown in SEQ ID NO.1, and the volume ratio of the chitosan to 1 ?g/?l dsRNA is 10:(1-6).Type: ApplicationFiled: August 20, 2020Publication date: November 25, 2021Inventors: Jinguang YANG, Fenglong WANG, Xiang XU, Ying LI, Liyun SONG, Lili SHEN, Qiang LEI, Changchun FENG, Bin LI, Yong WANG, Dongyang LIU, Lianqiang JIANG
-
Patent number: 11127833Abstract: A method of manufacturing a semiconductor device includes providing a substrate, forming a gate structure including a metal gate on the substrate, forming an interlayer dielectric layer on the gate structure, forming a first contact hole extending through the interlayer dielectric layer to expose a surface of the metal gate, and removing a portion of the metal gate using a wet etching process to form a second contact hole having a cross-sectional size larger than a cross-sectional size of the first contact hole.Type: GrantFiled: November 25, 2019Date of Patent: September 21, 2021Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) CorporationInventors: Lin Chen, Qiang Lei
-
Publication number: 20210265286Abstract: Structures for a corner area of a chip and methods of fabricating a structure for a corner area of a chip. A chip includes an active circuit region, an integrated circuit in the active circuit region, and a corner area. The corner area includes dummy structures that provide dummy fill.Type: ApplicationFiled: February 20, 2020Publication date: August 26, 2021Inventors: Qiang Lei, Bo Bai
-
Publication number: 20200098884Abstract: A method of manufacturing a semiconductor device includes providing a substrate, forming a gate structure including a metal gate on the substrate, forming an interlayer dielectric layer on the gate structure, forming a first contact hole extending through the interlayer dielectric layer to expose a surface of the metal gate, and removing a portion of the metal gate using a wet etching process to form a second contact hole having a cross-sectional size larger than a cross-sectional size of the first contact hole.Type: ApplicationFiled: November 25, 2019Publication date: March 26, 2020Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) CorporationInventors: Lin Chen, Qiang Lei
-
Patent number: 10510858Abstract: A semiconductor device includes a substrate, a gate structure having a metal gate on the substrate, and a contact member extending into the metal gate. The contact member includes a first region on the metal gate and a second region on the first region. The first region has a cross-sectional size larger than a cross-sectional size of the second region. The semiconductor device has a reduced contact resistance between the contact member and the metal gate.Type: GrantFiled: February 23, 2018Date of Patent: December 17, 2019Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATIONInventors: Lin Chen, Qiang Lei
-
Publication number: 20190313339Abstract: Provided are a WIFI power supply switching method, circuit and apparatus, and a storage medium. The method includes: when it is detected that a terminal is disconnected from an external power supply circuit, detecting a main current from a battery to a main board of the terminal and determining whether the main current goes beyond a first pre-set threshold value, wherein the battery supplies power for a WIFI PA of a first frequency band and a WIFI PA of a second frequency band in the terminal; and when it is determined that the main current goes beyond the first pre-set threshold value, ending the power supply of the battery for the WIFI PA of the first frequency band.Type: ApplicationFiled: February 8, 2017Publication date: October 10, 2019Inventor: Qiang LEI
-
Publication number: 20180337247Abstract: A semiconductor device includes a substrate, a gate structure having a metal gate on the substrate, and a contact member extending into the metal gate. The contact member includes a first region on the metal gate and a second region on the first region. The first region has a cross-sectional size larger than a cross-sectional size of the second region. The semiconductor device has a reduced contact resistance between the contact member and the metal gate.Type: ApplicationFiled: February 23, 2018Publication date: November 22, 2018Inventors: LIN CHEN, Qiang Lei
-
Patent number: 8833968Abstract: An LED illuminating device includes a base, an LED substrate mounted on the base, at least one LED on the substrate and an envelope fixed on the base. The envelope includes a plurality of transmission regions and a plurality of reflective regions. The lights beams emitted by the LED reaches the envelope. A first portion of the light beams reaching transmission regions can pass therethough. A second portion of the light beams are internally reflected in multiple times by the reflective regions until they finally escape to outside through the transmission regions. The direction of the light beams can reach various locations of each of the transmission regions at various angles.Type: GrantFiled: April 16, 2012Date of Patent: September 16, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Te-Yuan Kung, Jun-Jie Cui, Qi-Qiang Lei, Zhao-Yu Wang, Tsang-Chiang Yang, Wen-Hsiang Lu
-
Publication number: 20130170202Abstract: An LED illuminating device includes a base, an LED substrate mounted on the base, at least one LED on the substrate and an envelope fixed on the base. The envelope includes a plurality of transmission regions and a plurality of reflective regions. The lights beams emitted by the LED reaches the envelope. A first portion of the light beams reaching transmission regions can pass therethough. A second portion of the light beams are internally reflected in multiple times by the reflective regions until they finally escape to outside through the transmission regions. The direction of the light beams can reach various locations of each of the transmission regions at various angles.Type: ApplicationFiled: April 16, 2012Publication date: July 4, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD .Inventors: TE-YUAN KUNG, JUN-JIE CUI, QI-QIANG LEI, ZHAO-YU WANG, TSANG-CHIANG YANG, WEN-HSIANG LU