Abstract: A nested multi-stage polyphase filter can comprise: a first filter stage and a second filter stage. The first filter stage can be connected to the second filter stage via first through fourth intermediate connections. The first filter stage and the second filter stage can be laid out in a nested-ring layout. The first through fourth intermediate connections can be laid out so as to not cross over each other.

Abstract: The present disclosure includes systems and methods for sharing bias current. In one embodiment, shared bias current passes through a first level device to one or more second level devices along a bias current path. Multiple active devices may share bias current along a bias current path and process signal along the same or different signal paths. In one embodiment, bias current from one device is split among multiple devices. In another embodiment, bias current is combined from multiple devices into a device. Embodiments may include an interstage circuit along a signal path that improves stability of the circuit.

Abstract: A nested multi-stage polyphase filter can comprise: a first filter stage and a second filter stage. The first filter stage can be connected to the second filter stage via first through fourth intermediate connections. The first filter stage and the second filter stage can be laid out in a nested-ring layout. The first through fourth intermediate connections can be laid out so as to not cross over each other.

Abstract: The present disclosure includes systems and methods for sharing bias current. In one embodiment, shared bias current passes through a first level device to one or more second level devices along a bias current path. Multiple active devices may share bias current along a bias current path and process signal along the same or different signal paths. In one embodiment, bias current from one device is split among multiple devices. In another embodiment, bias current is combined from multiple devices into a device. Embodiments may include an interstage circuit along a signal path that improves stability of the circuit.

Abstract: A device according to various aspects of the present invention generally includes a surface mount device having a top side, a bottom side, a plurality of sidewalls, and a circuit comprising one or more layers. The device includes a first conductive surface covering a portion of one of the sidewalls for providing an input to the circuit, a second conductive surface covering a portion of one of the sidewalls for providing an output from the circuit, and a third conductive surface covering a portion of one of the sidewalls for providing an electrical ground to the circuit. When the surface mount device is mounted to a provided mounting surface, at least one layer of the circuit is orthogonal to the provided mounting surface.

Abstract: A bandpass filter including one or more metal layers, each layer having a first region and a second region. The filter also includes two or more LC resonators and one or more coupling networks for connecting the two or more LC resonators in parallel. The two or more LC resonators are contained within the first region of the one or more layers and the one or more coupling networks are contained in the second region of the one or more layers.

Abstract: The invention provides a grounding strategy for electronic components. In particular, the present provides ground connections in thin-film electronic components by connecting one group of one or more resonators to one ground connection and connecting a second group of one or more resonators to another ground connection.

Abstract: A device according to various aspects of the present invention generally includes a surface mount device having a top side, a bottom side, a plurality of sidewalls, and a circuit comprising one or more layers. The device includes a first conductive surface covering a portion of one of the sidewalls for providing an input to the circuit, a second conductive surface covering a portion of one of the sidewalls for providing an output from the circuit, and a third conductive surface covering a portion of one of the sidewalls for providing an electrical ground to the circuit. When the surface mount device is mounted to a provided mounting surface, at least one layer of the circuit is orthogonal to the provided mounting surface.

Abstract: A filter is delineated that may have an input for receiving an input signal including a plurality of different frequencies and an output for passing an output signal within a first frequency band. The filter may include a circuit coupled between the input of the filter and the output of the filter such that the circuit may add one or more zeros within a second frequency band to increase attenuation of the input signal within the second frequency band. Portions of the filter may be employed to form such a circuit. The filter may be used by an electrical system employing the filter.

Abstract: A bandpass filter includes at least two thin-film layers, a first resonant circuit including a first inductor, and a second resonant circuit including a second inductor. In one embodiment, the first inductor comprises a coil having a counter-clockwise rotation positioned in two or more of the at least two thin-film layers and the second inductor comprises a coil having a clockwise rotation positioned in two or more of the at least two thin-film layer. In this case, the first inductor is coupled to the second inductor in at least one of the at least two thin-film layers when the bandpass filter is energized. In another embodiment, the first inductor has a clockwise rotation and the second has a counter-clockwise rotation positioned. In this case, the first inductor is coupled to the second inductor in at least two of the at least two thin-film layers when the bandpass filter is energized.

Abstract: The invention provides a grounding strategy for electronic components. In particular, the present provides ground connections in thin-film electronic components by connecting one group of one or more resonators to one ground connection and connecting a second group of one or more resonators to another ground connection.