Patents by Inventor Qiang ZHUANG
Qiang ZHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230324386Abstract: The invention proposes a testing device and method for detecting infection with or immunity to SARS-Cov-2 of a subject, the method comprising the following steps: (i) contacting a urine sample from the subject with an application area of a testing device comprising a urine sorption material defining a sequence of said application area, a conjugate area and a testing area, the areas being in direct or indirect capillary flow communication with each other, (ii) allowing the urine sample to flow by capillarity from said application area to said conjugate area, said conjugate area comprising a testing conjugate movably held therein, wherein said testing conjugate comprises or consists of a polypeptide having an amino acid sequence that shares sequence identity of at least 90%, preferably at least 95%, with a SARS-CoV-2 protein or fragment thereof, coupled to a first colored marker, (iii) allowing the urine sample to continue to flow by capillarity to the testing area, said testing area comprising a testing sub-arType: ApplicationFiled: June 2, 2021Publication date: October 12, 2023Inventors: Jixian LAN, Guanghua YANG, Qiang ZHUANG
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Patent number: 10136207Abstract: A printed circuit board used as a voice coil includes N board units stacked over one another, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region.Type: GrantFiled: August 1, 2017Date of Patent: November 20, 2018Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) CoInventors: Xian-Qin Hu, Fu-Wei Zhong, Yi-Qiang Zhuang, Chun-Ming Zhou
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Patent number: 10117328Abstract: The present disclosure relates to a flexible circuit board. The flexible circuit board includes a first conductive trace substrate and a third conductive layer, a second conductive post and a third conductive post. The first conductive trace substrate includes a first insulating layer, a first conductive layer and a second conductive layer formed two opposite surfaces of the first insulating layer. The first conductive layer includes a first signal line, the second conductive layer includes a second signal line, and the first signal line is parallel connected with the second signal line.Type: GrantFiled: August 30, 2017Date of Patent: October 30, 2018Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Fu-Wei Zhong, Ming-Jaan Ho, Yi-Qiang Zhuang, Xin Zhang
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Publication number: 20180295434Abstract: A printed circuit board used as a voice coil includes N board units stacked over one another, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region.Type: ApplicationFiled: August 1, 2017Publication date: October 11, 2018Inventors: XIAN-QIN HU, FU-WEI ZHONG, YI-QIANG ZHUANG, CHUN-MING ZHOU
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Patent number: 9992858Abstract: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space.Type: GrantFiled: May 25, 2017Date of Patent: June 5, 2018Assignees: Avary Holding (Shenzhen) Co., Limited, HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTDInventors: Ming-Jaan Ho, Xian-Qin Hu, Yi-Qiang Zhuang, Fu-Wei Zhong
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Publication number: 20170265295Abstract: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space.Type: ApplicationFiled: May 25, 2017Publication date: September 14, 2017Inventors: MING-JAAN HO, XIAN-QIN HU, YI-QIANG ZHUANG, FU-WEI ZHONG
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Patent number: 9706640Abstract: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space. The signal wire is surrounded by air in the space. A method for manufacturing the printed circuit board is also provided.Type: GrantFiled: October 30, 2015Date of Patent: July 11, 2017Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd., GARLIDA TECHNOLOGY CO., LTD.Inventors: Ming-Jaan Ho, Xian-Qin Hu, Yi-Qiang Zhuang, Fu-Wei Zhong
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Publication number: 20170188451Abstract: A flexible circuit board includes a first circuit substrate, a second circuit substrate and a bonding layer. The first circuit substrate includes a first base layer, a first circuit layer, a second circuit layer and metal coating layer. The first circuit layer includes a signal line and at least two grounding lines. The metal coating layer encloses the signal line. The second circuit substrate includes a third circuit layer. The bonding layer is located between and bonding the first circuit substrate and the second circuit substrate. The second circuit layer, the third circuit layer are electrically coupled with the grounding lines by a plurality of electrically conductive holes. The first base layer, the bonding layer and the second circuit substrate cooperatively enclose a hermetic medium layer receiving the signal line. The hermitic medium layer is filled with air. A method for manufacturing the flexible circuit board is also provided.Type: ApplicationFiled: March 23, 2016Publication date: June 29, 2017Inventors: XIAN-QIN HU, FU-YUN SHEN, MING-JAAN HO, YI-QIANG ZHUANG
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Publication number: 20170110244Abstract: A circuit board for radio transceiving includes a flexible base and an inductance unit. The flexible base has a first conductive hole. The inductance unit includes a first inductance coil located at a first side of the flexible base and a second inductance coil located at an opposite side of the flexible base from the first inductance coil. The first inductance coil surrounds the first conductive hole and extends in a spiral direction and turn-by-turn into the first conductive hole. The second inductance coil surrounds the first conductive hole and extends in a spiral direction and turn-by-turn out from the first conductive hole. The first inductance coil and the second inductance coil are electrically connected with each other via the first conductive hole through the flexible base.Type: ApplicationFiled: October 30, 2015Publication date: April 20, 2017Inventors: XIAN-QIN HU, FU-YUN SHEN, MING-JAAN HO, YI-QIANG ZHUANG
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Patent number: 9615445Abstract: A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.Type: GrantFiled: September 18, 2015Date of Patent: April 4, 2017Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., GARUDA TECHNOLOGY CO., LTD., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho, Yi-Qiang Zhuang
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Publication number: 20160381786Abstract: A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.Type: ApplicationFiled: September 18, 2015Publication date: December 29, 2016Inventors: XIAN-QIN HU, FU-YUN SHEN, MING-JAAN HO, YI-QIANG ZHUANG
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Patent number: 9485859Abstract: A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.Type: GrantFiled: September 21, 2015Date of Patent: November 1, 2016Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Zhen Ding Technology Co., Ltd.Inventors: Xian-Qin Hu, Fu-Yun Shen, Jian Luo, Ming-Jaan Ho, Yi-Qiang Zhuang
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Publication number: 20160183357Abstract: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space. The signal wire is surrounded by air in the space. A method for manufacturing the printed circuit board is also provided.Type: ApplicationFiled: October 30, 2015Publication date: June 23, 2016Inventors: Ming-Jaan HO, Xian-Qin HU, Yi-Qiang ZHUANG, Fu-Wei ZHONG
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Patent number: 9277640Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.Type: GrantFiled: December 31, 2014Date of Patent: March 1, 2016Assignees: FuKui Precison Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.Inventors: Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen, Yi-Qiang Zhuang
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Publication number: 20150189738Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.Type: ApplicationFiled: December 31, 2014Publication date: July 2, 2015Inventors: MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN, YI-QIANG ZHUANG