Patents by Inventor Qiangqiang Yan

Qiangqiang Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132905
    Abstract: The present disclosure provides use of sweetpotato IbSAP15 gene in regulating leaf shape and flower shape of sweetpotato. Compared with the control, Ipomoea batatas cv. Xuzishu 8, IbSAP15-overexpressing lines have more deeply incised blades, dehiscent corollas, and higher ornamental value. In the present disclosure, overexpression of the sweetpotato IbSAP15 gene in sweetpotato can deepen leaf incisions, make trumpet-shaped corollas dehiscent, and change leaf shape and flower shape of sweetpotato. The present disclosure is suitable for developing sweetpotato germplasms with different leaf shape and flower shape and promotes ornamental flowering/foliage sweetpotato breeding.
    Type: Application
    Filed: November 17, 2022
    Publication date: April 25, 2024
    Applicant: XUZHOU INSTITUTE OF AGRICULTURAL SCIENCES
    Inventors: Yaju LIU, Hao XIE, Qiang LI, Yungang ZHANG, Hui YAN, Meng KOU, Wei TANG, Xin WANG, Qiangqiang YANG, Xiaoxiao WANG, Ranqiu LI
  • Patent number: 11781050
    Abstract: An aqueous dispersion of a silicone pressure sensitive adhesive base can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive. The aqueous dispersion of the silicone pressure sensitive adhesive base includes a bis-hydroxyl-terminated polydiorganosiloxane; a polyorganosilicate resin; cumene; a surfactant; and water. A curing agent such as a peroxide compound or an aminosilane may be combined with the aqueous disperison of the silicone pressure sensitive adhesive base to form a silicone pressure sensitive adhesive composition. A pressure sensitive adhesive article may be formed by a method including coating a surface of a substrate with the silicone pressure sensitive adhesive composition, removing water, and curing the silicon pressure sensitive adhesive composition to form a silicone pressure sensitive adhesive on the surface of the substrate.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: October 10, 2023
    Assignees: DOW GLOBAL TECHNOLOGIES LLC, Dow Silicones Corporation
    Inventors: Qiangqiang Yan, Yunlong Guo, Wenjie Chen, Li Ding, Hongyu Chen, Cheng Shen, Ruihua Lu, Yan Zhou, Zhihua Liu
  • Publication number: 20230193096
    Abstract: An aqueous dispersion of a silicone pressure sensitive adhesive base can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive.
    Type: Application
    Filed: July 21, 2021
    Publication date: June 22, 2023
    Inventors: Qiangqiang Yan, Yunlong Guo, Wenjie Chen, Li Ding, Hongyu Chen, Cheng Shen, Ruihua Lu, Yan Zhou, Zhihua Liu
  • Publication number: 20230138123
    Abstract: A method for preparing a curable silicone pressure sensitive adhesive emulsion includes preparing a dispersion of benzoyl peroxide and a phenoxy-functional alcohol and thereafter combining the dispersion with the other starting materials of the emulsion.
    Type: Application
    Filed: May 27, 2020
    Publication date: May 4, 2023
    Inventors: Qiangqiang Yan, Yunlong Guo, Wenjie Chen, Li Ding, Peng Gao, Yan Zhou, Zhihua Liu