Patents by Inventor Qiangwei Cui

Qiangwei Cui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210296394
    Abstract: An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region, a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, m the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
    Type: Application
    Filed: June 15, 2020
    Publication date: September 23, 2021
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ke MENG, Qiangwei CUI, Chao LIU, Lili WANG, Chuhang WANG, Yutian CHU, Linhui GONG
  • Publication number: 20210167045
    Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
    Type: Application
    Filed: April 30, 2020
    Publication date: June 3, 2021
    Inventors: Ke MENG, Chao LIU, Qiangwei CUI, Chuhang WANG, Lili WANG, Linhui GONG, Yutian CHU, Fan YANG
  • Publication number: 20210159208
    Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
    Type: Application
    Filed: March 26, 2020
    Publication date: May 27, 2021
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lili WANG, Haiwei SUN, Zhenxing TANG, Feng QU, Jing LIU, Chao LIU, Chuhang WANG, Qiangwei CUI, Ke MENG, Linhui GONG
  • Publication number: 20210088828
    Abstract: The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
    Type: Application
    Filed: June 5, 2020
    Publication date: March 25, 2021
    Inventors: Qiangwei Cui, Lili Wang, Ke Meng, Chao Liu, Chuhang Wang, Linhui Gong, Zhaohui Li, Donghui Wang