Abstract: A display module includes a structure. The display module includes a display panel, a flexible circuit board and an adhesive structure. The display panel has a light exit side and a backlight side opposite to the light exit side. The flexible circuit board includes a main body portion, a neck portion and a connection portion. The neck portion is located between the main body portion and the connection portion. An end of the main body portion away from the neck portion is connected to an edge of the display panel. The connection portion, the neck portion and at least part of the main body portion are located on the backlight side of the display panel. The adhesive structure is located between the main body portion and the display panel, and at least part of the adhesive structure is located in an edge area of the main body portion proximate to the neck portion.

Abstract: A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.

Abstract: A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.