Patents by Inventor Qiao Chen
Qiao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133857Abstract: A device for on-site detection of soil organic matter, including a pre-processing module, a centrifugal system, a microfluidic chip, and a photoelectric detection module. The pre-processing module is configured to process a soil sample into a soil solution. The centrifugal system is configured to generate a centrifugal force. The microfluidic chip is configured to allow mixing of the soil solution and an extraction solvent for extraction under the centrifugal force to obtain an extract. The photoelectric detection module is configured to detect the extract to determine organic matter content in the soil solution. An on-site detection method and a microfluidic chip are also provided. The microfluidic chip includes a channel layer, a cover layer arranged above the channel layer, and a base plate layer arranged below the channel layer.Type: ApplicationFiled: December 26, 2023Publication date: April 25, 2024Inventors: Rujing WANG, Jiangning CHEN, Xiangyu CHEN, Yongjia CHANG, Qinwen LU, Yang LIU, Yi LIU, Qiao CAO, Xiaoyu ZHANG
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Publication number: 20240125757Abstract: A device for detecting soil nutrients on site, including an extracting grid, an on-site real-time detection assembly and a transfer assembly for transferring a soil extract from the extracting grid to the on-site real-time detection assembly. A soil nutrient detection method using the device and a microfluidic chip are also provided. The microfluidic chip includes a cover plate and a base plate. The base plate includes a soil extract feeding groove, a quantitative feeding groove, a reagent storage groove, and a serpentine groove.Type: ApplicationFiled: December 26, 2023Publication date: April 18, 2024Inventors: Rujing WANG, Yongjia CHANG, Xiangyu CHEN, Qinwen LU, Jiangning CHEN, Qiao CAO, Yang LIU, Xiaoyu ZHANG, Jiahao XIAO, Hongyan GUO, Dapeng WANG
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Patent number: 11959804Abstract: The invention provides a curved-slit imaging spectrometer, wherein a fiber bundle transfers a straight line image of a front objective lens to a curved slit, and the front objective lens doesn't need to have a curved image plane to directly abut the spectrometer, so that the system is less complicated, and the front objective lens and spectrometer have a simple structure. The arc-shaped or approximately arc-shaped curved slit matches the optimum imaging circle of the Offner-type spectrometer, thereby achieving an extra-long slit. The arced slit is 5 to 10 times longer than the straight slit of the classical Offner-type spectrometer. In the case of a compact size, the length of the slit can be greater than 100 mm. Also, the same spectral response function applies in different fields of view while presenting desirable imaging quality.Type: GrantFiled: December 9, 2020Date of Patent: April 16, 2024Assignee: SOOCHOW UNIVERSITYInventors: Jiacheng Zhu, Qiao Pan, Xinhua Chen, Weimin Shen
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Patent number: 11947914Abstract: In embodiments of the present disclosure, there is provided an approach for fact checking based on semantic graphs. According to embodiments of the present disclosure, after obtaining a text to be fact checked, a plurality of evidence sentences related to the text are retrieved from an evidence database. Then, semantic graphs of the text and the evidence sentences are constructed based on the semantic analysis, and a veracity of a statement in the text can be determined based on the semantic graphs. Embodiments of the present disclosure propose a graph-based reasoning approach for fact checking, and use the constructed semantic graphs to facilitate verification of the truthfulness of the text, thereby improving the accuracy for fact checking.Type: GrantFiled: June 30, 2020Date of Patent: April 2, 2024Assignee: Microsoft Technology Licensing, LLCInventors: Duyu Tang, Nan Duan, Ming Zhou, Jiun-Hung Chen, Pengcheng Wang, Ying Qiao
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Patent number: 11942386Abstract: In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.Type: GrantFiled: August 24, 2020Date of Patent: March 26, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Christopher Daniel Manack, Patrick Francis Thompson, Qiao Chen
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Patent number: 11931892Abstract: A robotic system includes a support structure, a motor mount assembly, first and second parallel chains, a serial translation assembly, a sensor and a control module. The motor mount assembly includes rotary motors, where the rotary motors include a first rotary motor and a second rotary motor. The first and second parallel chains are connected to the movable platform, the rotary motors and the motor mount assembly. The serial translation assembly is connected to the supporting structure and the motor mount assembly and includes a linear actuator and a third rotary motor. The sensor is connected to the movable platform and detects force applied by a human operator on the movable platform and generates a signal indicative of the force applied. The control module controls the rotary motors and the third rotary motor based on the signal to assist the human operator in moving the movable platform.Type: GrantFiled: December 17, 2021Date of Patent: March 19, 2024Assignees: GM GLOBAL TECHNOLOGY OPERATIONS LLC, Shanghai JiaoTong UniversityInventors: Qiao Sun, Xianbao Chen, Jing Sun, Feng Gao, Dalong Gao, Ningjian Huang
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Patent number: 11881333Abstract: Disclosed are a ground terminal and an electronic device. The ground terminal includes a core body, a first bonding layer, a second bonding layer, a metal support plate, a third bonding layer, a fourth bonding layer, and a metal work piece. The metal support plate is attached to a lower part of the core body. The metal work piece includes a contact layer, a side layer, an upper welding layer, a wrapping layer, and a lower welding layer. The contact layer is attached to an upper part of the core body, the side layer is located on one side of the core body, the upper welding layer is connected to the metal support plate, the wrapping layer wraps an end portion of the metal support plate, the upper and lower welding layers are connected to a top end of the wrapping layer and the metal support plate, respectively.Type: GrantFiled: May 22, 2023Date of Patent: January 23, 2024Assignee: Shenzhen Johan Material Technology Co., Ltd.Inventors: Mujiu Chen, Jingyun Liu, Qiao Chen
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Patent number: 11855024Abstract: In some examples a wafer chip scale package (WCSP) includes a semiconductor die having a device side in which a circuit is formed, and a redistribution layer (RDL) coupled to the device side that is positioned within an insulating member. In addition, the WCSP includes a scribe seal circumscribing the circuit along the device side, wherein the RDL abuts the scribe seal. Further, the WCSP includes a conductive member coupled to the RDL. The conductive member is configured to receive a solder member, and the insulating member does not extend along the device side of the semiconductor die between the conductive member and a portion of an outer perimeter of the WCSP closest to the conductive member.Type: GrantFiled: August 31, 2021Date of Patent: December 26, 2023Assignee: Texas Instruments IncorporatedInventors: Qiao Chen, Vivek Swaminathan Sridharan, Christopher Daniel Manack, Patrick Francis Thompson, Jonathan Andrew Montoya, Salvatore Frank Pavone
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Patent number: 11727325Abstract: Systems, methods, and techniques to efficiently analyze and navigate through decision logic using an execution graph are provided. The method includes executing decision logic in response to receiving a data file. The method further includes generating, in response to the executing, an execution graph. The execution graph includes a plurality of nodes corresponding to a plurality of decision entities of the decision logic. The method further includes displaying the execution graph on a user interface. The method further includes displaying, in response to receiving a selection of a node of the plurality of nodes, information associated with the selected node.Type: GrantFiled: August 1, 2018Date of Patent: August 15, 2023Assignee: Fair Isaac CorporationInventors: Jean-Luc M. Marcé, Balachandar Rangarajulu Sriramulu, Imran Ali, Qiao Chen
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Patent number: 11646509Abstract: A grounding elastic contact and an electronic device including the same. The grounding elastic contact includes an elastic core, and a double-sided polyethylene terephthalate (PET) tape, a polyimide (PI) film, and a conductive layer, where the PI film is laminated and bonded on an outer side of the double-sided PET tape; a middle region of the double-sided PET tape is attached to an upper surface of the elastic core; after passing through left and right sides of the elastic core respectively, two ends of the double-sided PET tape are laminated on a lower surface of the elastic core; the conductive layer includes one end bonded on the upper surface of the elastic core, and the other end passing through the left side of the elastic core; the double-sided PET tape includes a PET backing and an adhesive coated on two sides of the PET backing.Type: GrantFiled: July 6, 2022Date of Patent: May 9, 2023Assignee: Shenzhen Johan Material Technology Co., Ltd.Inventors: Mujiu Chen, Fang Chen, Qiao Chen, Jingyun Liu
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Publication number: 20230093996Abstract: A grounding elastic contact and an electronic device including the same. The grounding elastic contact includes an elastic core, and a double-sided polyethylene terephthalate (PET) tape, a polyimide (PI) film, and a conductive layer, where the PI film is laminated and bonded on an outer side of the double-sided PET tape; a middle region of the double-sided PET tape is attached to an upper surface of the elastic core; after passing through left and right sides of the elastic core respectively, two ends of the double-sided PET tape are laminated on a lower surface of the elastic core; the conductive layer includes one end bonded on the upper surface of the elastic core, and the other end passing through the left side of the elastic core; the double-sided PET tape includes a PET backing and an adhesive coated on two sides of the PET backing.Type: ApplicationFiled: July 6, 2022Publication date: March 30, 2023Inventors: Mujiu Chen, Fang Chen, Qiao Chen, Jingyun Liu
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Patent number: 11615606Abstract: A tree crown extraction method based on UAV multi-source remote sensing includes: obtaining a visible light image and LIDAR point clouds, taking a digital orthophoto map (DOM) and the LIDAR point clouds as data sources, using a method of watershed segmentation and object-oriented multi-scale segmentation to extract single tree crown information under different canopy densities. The object-oriented multi-scale segmentation method is used to extract crown and non-crown areas, and a tree crown distribution range is extracted with the crown area as a mask; a preliminary segmentation result of single tree crown is obtained by the watershed segmentation method based on a canopy height model; a brightness value of DOM is taken as a feature, the crown area of the DOM is performed secondary segmentation based on a crown boundary to obtain an optimized single tree crown boundary information, which greatly increases the accuracy of remote sensing tree crown extraction.Type: GrantFiled: August 8, 2022Date of Patent: March 28, 2023Assignee: INSTITUTE OF FOREST RESOURCE INFORMATION TECHNIQUES CAFInventors: Qiao Chen, Yongfu Chen, Juan Wang, Zhiyang Xu
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Publication number: 20230065075Abstract: In some examples a wafer chip scale package (WCSP) includes a semiconductor die having a device side in which a circuit is formed, and a redistribution layer (RDL) coupled to the device side that is positioned within an insulating member. In addition, the WCSP includes a scribe seal circumscribing the circuit along the device side, wherein the RDL abuts the scribe seal. Further, the WCSP includes a conductive member coupled to the RDL. The conductive member is configured to receive a solder member, and the insulating member does not extend along the device side of the semiconductor die between the conductive member and a portion of an outer perimeter of the WCSP closest to the conductive member.Type: ApplicationFiled: August 31, 2021Publication date: March 2, 2023Inventors: Qiao CHEN, Vivek Swaminathan SRIDHARAN, Christopher Daniel MANACK, Patrick Francis THOMPSON, Jonathan Andrew MONTOYA, Salvatore Frank PAVONE
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Publication number: 20230039554Abstract: A tree crown extraction method based on UAV multi-source remote sensing includes: obtaining a visible light image and LIDAR point clouds, taking a digital orthophoto map (DOM) and the LIDAR point clouds as data sources, using a method of watershed segmentation and object-oriented multi-scale segmentation to extract single tree crown information under different canopy densities. The object-oriented multi-scale segmentation method is used to extract crown and non-crown areas, and a tree crown distribution range is extracted with the crown area as a mask; a preliminary segmentation result of single tree crown is obtained by the watershed segmentation method based on a canopy height model; a brightness value of DOM is taken as a feature, the crown area of the DOM is performed secondary segmentation based on a crown boundary to obtain an optimized single tree crown boundary information, which greatly increases the accuracy of remote sensing tree crown extraction.Type: ApplicationFiled: August 8, 2022Publication date: February 9, 2023Inventors: QIAO CHEN, YONGFU CHEN, JUAN WANG, ZHIYANG XU
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Patent number: 11341851Abstract: A method for displaying a smooth movement of a vehicle on a map may include obtaining a route, a last real-time location of the vehicle, and a last uploading time point. The method may also include obtaining driving data of one or more neighboring vehicles and determining a predicted location of the vehicle at a prediction generating time point. The method may further include displaying a smooth movement of the vehicle from the last real-time location to the predicted location on a map. A method for displaying a driving path of a vehicle on a map may include obtaining a request for displaying a driving path of a vehicle, location information of the vehicle, and scene related information associated with the driving path. The method may further include verifying the location information based on the scene related information and displaying the driving path of the vehicle on a map.Type: GrantFiled: August 6, 2020Date of Patent: May 24, 2022Assignee: BEIJING DIDI INFINITY TECHNOLOGY AND DEVELOPMENT CO., LTD.Inventors: Qiao Chen, Yingchuan Xu, Kegang Wang, Pengxuan Li, Chao Liu, Chao Ye, Qian Mu, Yong Qiao, Zhenlin Yang
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Publication number: 20220059423Abstract: In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor die via a conductive terminal extending through the mold compound.Type: ApplicationFiled: August 24, 2020Publication date: February 24, 2022Inventors: Christopher Daniel MANACK, Patrick Francis THOMPSON, Qiao CHEN
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Publication number: 20210395536Abstract: A graphene anti-corrosion coating is described that comprises an epoxy resin and graphene subjected to surface modification, where the addition amount of the graphene is 0.01-0.2 wt % of the total mass of coating solid. By performing surface treatment on the graphene, the dispersity of the graphene in the coating is improved, and the compactness of the coating is enhanced.Type: ApplicationFiled: November 28, 2019Publication date: December 23, 2021Applicant: Toray Industries, Inc.Inventors: Ke Wang, Yang Yang, Qiao Chen, Manabu Kawasaki
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Publication number: 20210210440Abstract: An integrated circuit (IC) die includes a substrate with circuitry configured for at least one function including metal interconnect levels thereon including a top metal interconnect level and a bottom metal interconnect level, with a passivation layer on the top metal interconnect level. A scribe street is around a periphery of the IC die, the scribe street including a scribe seal utilizing at least two of the plurality of metal interconnect levels, an inner metal meander stop ring including at least the top metal interconnect level located outside the scribe seal, wherein the scribe seal and the inner metal meander stop ring are separated by a first separation gap. An outer metal meander stop ring including at least the top metal interconnect level is located outside the inner metal stop ring, wherein the outer stop ring and the inner stop ring are separated by a second separation gap.Type: ApplicationFiled: January 8, 2020Publication date: July 8, 2021Inventors: Christopher Daniel Manack, Qiao Chen, Michael Todd Wyant, Matthew John Sherbin, Patrick Francis Thompson
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Patent number: 10947159Abstract: Provided are a granulated blast-furnace slag activator and a method of manufacturing the same. The granulated blast-furnace slag activator includes, in percent by weight, the following raw materials: 62% to 95% of gypsum and 5% to 38% of high belite sulfoaluminate cement clinker. Also provided is a method of manufacturing cement by mixing the granulated blast-furnace slag activator with granulated blast-furnace slag at a certain ratio.Type: GrantFiled: March 21, 2019Date of Patent: March 16, 2021Assignee: TANGSHAN POLAR BEAR BUILDING MATERIALS CO., LTD.Inventors: Jian Zhou, Zhifeng Chen, Zhenqiu Zhang, Zhongxi Ge, Shujuan Zhang, Qiao Chen, Chengjian Liu
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Publication number: 20200365024Abstract: A method for displaying a smooth movement of a vehicle on a map may include obtaining a route, a last real-time location of the vehicle, and a last uploading time point. The method may also include obtaining driving data of one or more neighboring vehicles and determining a predicted location of the vehicle at a prediction generating time point. The method may further include displaying a smooth movement of the vehicle from the last real-time location to the predicted location on a map. A method for displaying a driving path of a vehicle on a map may include obtaining a request for displaying a driving path of a vehicle, location information of the vehicle, and scene related information associated with the driving path. The method may further include verifying the location information based on the scene related information and displaying the driving path of the vehicle on a map.Type: ApplicationFiled: August 6, 2020Publication date: November 19, 2020Applicant: BEIJING DIDI INFINITY TECHNOLOGY AND DEVELOPMENT CO., LTD.Inventors: Qiao CHEN, Yingchuan XU, Kegang WANG, Pengxuan LI, Chao LIU, Chao YE, Qian MU, Yong QIAO, Zhenlin YANG