Abstract: A heat dissipating device which is liquid cooled includes a base and at least one heat dissipation fin connected to the base. The base includes a first cavity. The at least one heat dissipation fin comprising a second cavity communicating with the first cavity, the second cavity and the first cavity together form an accommodation cavity for accommodating a working fluid which forcefully applies cooling upon being heated sufficiently to be vaporized.

Abstract: A heat dissipating device which is liquid cooled includes a base and at least one heat dissipation fin connected to the base. The base includes a first cavity. The at least one heat dissipation fin comprising a second cavity communicating with the first cavity, the second cavity and the first cavity together form an accommodation cavity for accommodating a working fluid which forcefully applies cooling upon being heated sufficiently to be vaporized.

Abstract: A liquid-cooled radiator includes liquid-cooled boards, a condenser, a driver, a coolant conduit assembly, and a mounting bracket. The liquid-cooled boards and the condenser are mounted on the mounting bracket. The driver is coupled to the liquid-cooled boards and the condenser through the coolant conduit assembly. The coolant conduit assembly includes a main conduit, a diverting block, and a sub-conduit. The diverting block is mounted to the mounting bracket. The liquid-cooled boards are coupled to the diverting block in parallel through the sub-conduit. The condenser, the driver, and the diverting block are coupled together through the main conduit. The driver drives coolant from the condenser to flow through the diverting block and the sub-conduit to the liquid-cooled boards, flow through the sub-conduit and the diverting block to the main conduit, and then flow from the main conduit to the condenser to be condensed.

Abstract: A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.

Abstract: A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.

Abstract: An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.

Abstract: A heat dissipation device includes a base and a plurality of fins. Two latch parts project from a top surface of the base, the two latch parts cooperatively define a recess therebetween. Each fin defines a tenon at a bottom portion. The tenon has a configuration in complement with that of the recess. The latch parts located between two neighboring fins is punched to make the fins fix on the base.

Abstract: An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.