Patents by Inventor Qiaosheng Pu

Qiaosheng Pu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma assisted method of accurate alignment and pre-bonding for microstructure including glass or quartz chip
    Patent number: 9842749
    Abstract: The plasma-assisted method of precise alignment and pre-bonding for microstructure of glass and quartz microchip belongs to micromachining and bonding technologies of the microchip. The steps of which are as follows: photoresist and chromium layers on glass or quartz microchip are completely removed followed by sufficient cleaning of the surface with nonionic surfactant and quantities of ultra-pure water. Then the surface treatment is proceeded for an equipping surface with high hydrophily with the usage of plasma cleaning device. Under the drying condition, the precise alignment is accomplished through moving substrate and cover plate after being washed with the help of microscope observation. Further on, to achieve precise alignment and pre-bonding of the microstructure of glass and quartz microchip, a minute quantity of ultrapure water is instilled into a limbic crevice for adhesion, and entire water is completely wiped out by vacuum drying following sufficient squeezing.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: December 12, 2017
    Assignee: Beijing University of Technology
    Inventors: Guangsheng Guo, Siyu Wang, Qiaosheng Pu, Xiayan Wang
  • Plasma assisted method of accurate alignment and pre-bonding for microstructure including glass or quartz chip
    Publication number: 20170301564
    Abstract: The plasma-assisted method of precise alignment and pre-bonding for microstructure of glass and quartz microchip belongs to micromachining and bonding technologies of the microchip. The steps of which are as follows: photoresist and chromium layers on glass or quartz microchip are completely removed followed by sufficient cleaning of the surface with nonionic surfactant and quantities of ultra-pure water. Then the surface treatment is proceeded for an equipping surface with high hydrophily with the usage of plasma cleaning device. Under the drying condition, the precise alignment is accomplished through moving substrate and cover plate after being washed with the help of microscope observation. Further on, to achieve precise alignment and pre-bonding of the microstructure of glass and quartz microchip, a minute quantity of ultrapure water is instilled into a limbic crevice for adhesion, and entire water is completely wiped out by vacuum drying following sufficient squeezing.
    Type: Application
    Filed: November 17, 2015
    Publication date: October 19, 2017
    Applicant: Beijing University of Technology
    Inventors: Guangsheng Guo, Siyu Wang, Qiaosheng Pu, Xiayan Wang