Patents by Inventor Qiaowang CHEN

Qiaowang CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11319618
    Abstract: The disclosure relates to a method for preparing Ti(C,N)-based superhard metal composite materials, with Ti(C,N) powder and (W,Mo,Ta)(C,N) powder as main raw materials and Co powder as binding phase for preparation, thereby obtaining a material in which a microstructure is a double-core rim structure that has both a black core rim and a white core rim. The material has a complete and evenly distributed double-core rim structure. In the condition that the ensured hardness of the material is not reduced and even slightly increased, the toughness of the material is significantly improved, wherein the fracture toughness of the material is in the range of 11.3 to 12.5 MPa·m1/2.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: May 3, 2022
    Assignee: CHONGQING UNIVERSITY OF ARTS AND SCIENCES
    Inventors: Ying Deng, Shan Jiang, Yanhua Zhang, Taibin Wu, Qiaowang Chen, Hui Yan, Ling Deng, Hui Chen
  • Publication number: 20210002745
    Abstract: The disclosure relates to a method for preparing Ti(C,N)-based superhard metal composite materials, with Ti(C,N) powder and (W,Mo,Ta)(C,N) powder as main raw materials and Co powder as binding phase for preparation, thereby obtaining a material in which a microstructure is a double-core rim structure that has both a black core rim and a white core rim. The material has a complete and evenly distributed double-core rim structure. In the condition that the ensured hardness of the material is not reduced and even slightly increased, the toughness of the material is significantly improved, wherein the fracture toughness of the material is in the range of 11.3 to 12.5 MPa·m1/2.
    Type: Application
    Filed: December 24, 2019
    Publication date: January 7, 2021
    Applicant: CHONGQING UNIVERSITY OF ARTS AND SCIENCES
    Inventors: Ying DENG, Shan JIANG, Yanhua ZHANG, Taibin WU, Qiaowang CHEN, Hui YAN, Ling DENG, Hui CHEN