Patents by Inventor Qibin Xing

Qibin Xing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10153407
    Abstract: A packaging method of high color gamut white light quantum dot (QD) light emitting diodes (LEDs). The method includes: a. add an organic solvent to red light QD phosphor powder and blue light QD phosphor powder, respectively; b. perform ultrasonic processing for the solutions; c. prepare a mixed QD solution; d. add mixed packaging glue to the mixed QD solution; e. remove the organic solvent; f. add green light rare earth phosphor powder; g. drip the mixed phosphor glue into an LED stent fixed with ultraviolet chips, and bake and solidify the LED stent to obtain LED beads. The method produces high gamut white light LEDs and greatly improves the color gamut value of LED backlight beads, which reaches above NTSC 92%. With an organic solvent as a connecting bridge, QDs and the packaging glue are mixed uniformly, QD phosphor powder failure resulted from agglomeration is avoided, and quality of high color gamut white light LED beads is significantly improved.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: December 11, 2018
    Assignee: Shenzhen Jufei Optoelectronics Co., Ltd.
    Inventors: Zhikuan Zhang, Qibin Xing, Danpeng Gao, Ni Zhang
  • Publication number: 20180158996
    Abstract: A packaging method of high color gamut white light quantum dot (QD) light emitting diodes (LEDs). The method includes: a. add an organic solvent to red light QD phosphor powder and blue light QD phosphor powder, respectively; b. perform ultrasonic processing for the solutions; c. prepare a mixed QD solution; d. add mixed packaging glue to the mixed QD solution; e. remove the organic solvent; f. add green light rare earth phosphor powder; g. drip the mixed phosphor glue into an LED stent fixed with ultraviolet chips, and bake and solidify the LED stent to obtain LED beads. The method produces high gamut white light LEDs and greatly improves the color gamut value of LED backlight beads, which reaches above NTSC 92%. With an organic solvent as a connecting bridge, QDs and the packaging glue are mixed uniformly, QD phosphor powder failure resulted from agglomeration is avoided, and quality of high color gamut white light LED beads is significantly improved.
    Type: Application
    Filed: December 20, 2016
    Publication date: June 7, 2018
    Applicant: Shenzhen Jufei Optoelectronics Co., Ltd.
    Inventors: Zhikuan Zhang, Qibin Xing, Danpeng Gao, Ni Zhang