Abstract: The present disclosure provides a packaging device for an integrated power supply system and a packaging method thereof. The packaging device comprises: a power consumption system die and a power supply system die below the power consumption system die; the power supply system die comprises an active module, a passive module and a rewiring layer, wherein the active module and the reactive module are molded, and the rewiring layer is located above the molded active module and passive module, to connect the active module and the passive module, and a plurality of power supply tracks are disposed in the rewiring layer to abut the power consumption system die; the power consumption system die is abutted with the plurality of power supply tracks; and an external power source supplies power to the power consumption system die through the power supply system die.

Abstract: The present disclosure provides a packaging device for an integrated power supply system and a packaging method thereof. The packaging device comprises: a power consumption system die and a power supply system die below the power consumption system die; the power supply system die comprises an active module, a passive module and a rewiring layer, wherein the active module and the reactive module are molded, and the rewiring layer is located above the molded active module and passive module, to connect the active module and the passive module, and a plurality of power supply tracks are disposed in the rewiring layer to abut the power consumption system die; the power consumption system die is abutted with the plurality of power supply tracks; and an external power source supplies power to the power consumption system die through the power supply system die.

Abstract: The method of fabricating a fan-out package structure comprises: S1, providing a substrate (1), forming an adhesive layer (2) on the substrate's upper surface; S2, forming a redistribution layer (3) on the adhesive layer's upper surface; S3, bonding one first chip (4) to the redistribution layer's upper surface, and constructing at least two first bump structures (5), wherein the first chip and the first bump structures are all electrically connected to the redistribution layer, and top portions of the first bump structures are taller than a top portion of the first chip; S4, forming a plastic encapsulation layer (6) on the upper surface of the redistribution layer, wherein the plastic encapsulation layer embeds the first chip and exposes upper ends of the first bump structures; and S5, removing the substrate and the adhesive layer, and constructing a second bump structure (7) on a lower surface of the redistribution layer.

Abstract: The method of fabricating a fan-out package structure comprises: S1, providing a substrate (1), forming an adhesive layer (2) on the substrate's upper surface; S2, forming a redistribution layer (3) on the adhesive layer's upper surface; S3, bonding one first chip (4) to the redistribution layer's upper surface, and constructing at least two first bump structures (5), wherein the first chip and the first bump structures are all electrically connected to the redistribution layer, and top portions of the first bump structures are taller than a top portion of the first chip; S4, forming a plastic encapsulation layer (6) on the upper surface of the redistribution layer, wherein the plastic encapsulation layer embeds the first chip and exposes upper ends of the first bump structures; and S5, removing the substrate and the adhesive layer, and constructing a second bump structure (7) on a lower surface of the redistribution layer.

Abstract: A device is provided for the detection of multiple analytes in at least one sample. The device contains a solid substrate with a test surface. On the test surface is defined at least one reaction area containing at least one array of discrete test sites. Each of these test sites have a test molecule immobilized on to it, and different test sites may have different test molecules immobilized thereon. A divider is provided for attachment onto the solid substrate. The divider contains a plurality of holes provided on an attachment surface. The attachment surface is complementary to the test surface of the solid device and is adapted for reversible attachment thereto such that when the two parts are attached, each of the holes is adjoined with a portion of the test surface to create a plurality of leak-proof chambers. The test surface within the chamber contains a plurality of test sites exposed within the chambers.