Patents by Inventor Qi Feng Wei

Qi Feng Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices using a medium having a high heat transfer rate
    Patent number: 7220365
    Abstract: Disclosed is a heat transfer medium having high heat transfer rate, being useful in even wider fields, simple in structure, easy to made, environmentally sound, and capable of rapidly conducting heat and preserving heat in a highly efficient manner. Further disclosed are a heat transfer surface and a heat transfer element utilizing the heat transfer medium. Further disclosed are applications of the heat transfer element.
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: May 22, 2007
    Assignee: New Qu Energy Ltd.
    Inventors: YuZhi Qu, ZhiPeng Qu, Jason Chao, YuFu Li, Peng Chen, JunHua Yan, Hong Yuan Yang, Qi Feng Wei
  • Devices using a medium having a high heat transfer rate
    Publication number: 20030066638
    Abstract: Disclosed is a heat transfer medium having high heat transfer rate, being useful in even wider fields, simple in structure, easy to made, environmentally sound, and capable of rapidly conducting heat and preserving heat in a highly efficient manner. Further disclosed are a heat transfer surface and a heat transfer element utilizing the heat transfer medium. Further disclosed are applications of the heat transfer element.
    Type: Application
    Filed: August 13, 2001
    Publication date: April 10, 2003
    Inventors: YuZhi Qu, ZhiPeng Qu, Jason Chao, YuFu Li, Peng Chen, JunHua Yan, Hong Yuan Yang, Qi Feng Wei