Abstract: A multichannel manifold cold plate with microchannels for cooling electronics. A main inlet is on a side of the microchannels opposite the cold plate and includes inlet channels with nozzles adjacent the microchannels. A main outlet is on a side of the microchannels opposite the cold plate and includes outlet channels with nozzles adjacent the microchannels. The inlet channels are interleaved with the outlet channels. In operation, the main inlet delivers a cooling fluid to the cold plate microchannels via the inlet channels and nozzles, and the main outlet receives the cooling fluid from the microchannels via the outlet channels and nozzles. This configuration provides a cooling fluid distribution pattern for efficient cooling of the electronics.

Abstract: A surface-treating article, comprising a circular substrate (100) comprising a first major surface, an abrasive disposed on the first major surface, the abrasive having a first concentration at a first radius (110) measured from the center of the substrate, the abrasive having a second concentration not equal to the first concentration at a second radius (120) measured from the center of the substrate, wherein the first radius (110) and the second radius (120) are different lengths.

Abstract: A temperature-sensing apparatus for sensing the temperature of an electrical conductor (31), comprising a sensor frame (210) including a frame body (2101) and a channel (2102) adapted to accommodate the electrical conductor (31). At least a portion of a temperature sensor is received in a chamber (2103) of the sensor frame (210). At least a portion of a thermal contact member is disposed between the electrical conductor (31) and the temperature sensor and configured to enhance thermal-contact therebetween. At least a portion of the thermal contact member is radially pressable against the electrical conductor (31).

Abstract: Disclosed is a solar cell module, which comprises: a plurality of solar cells; a light transmitting element disposed on the light receiving side of the plurality of solar cells; a front encapsulant layer between the plurality of solar cells and the light transmitting element; a plurality of tabbing ribbons disposed on the light receiving surfaces of the plurality of solar cells for connecting the plurality of solar cells; and a light redirecting film disposed upon the on-the-cell portion of at least one said tabbing ribbon; the light redirecting film comprises an optical structure layer facing the light transmitting element, for reflecting light toward the interface between the light transmitting element and the air, which light is subsequently totally internally reflected back to the surfaces of the solar cells, wherein the thickness of the light redirecting film is between 20 ?m and 115 ?m, and the gram weight of the front encapsulant layer is between 400 g/m2 and 500 g/m2.

Abstract: A surface-treating article, comprising a circular substrate (100) comprising a first major surface, an abrasive disposed on the first major surface, the abrasive having a first concentration at a first radius (110) measured from the center of the substrate, the abrasive having a second concentration not equal to the first concentration at a second radius (120) measured from the center of the substrate, wherein the first radius (110) and the second radius (120) are different lengths.

Abstract: A temperature-sensing apparatus for sensing the temperature of an electrical conductor (31), comprising a sensor frame (210) including a frame body (2101) and a channel (2102) adapted to accommodate the electrical conductor (31). At least a portion of a temperature sensor is received in a chamber (2103) of the sensor frame (210). At least a portion of a thermal contact member is disposed between the electrical conductor (31) and the temperature sensor and configured to enhance thermal-contact therebetween. At least a portion of the thermal contact member is radially pressable against the electrical conductor (31).

Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.

Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.

Abstract: There is provided a vacuum insulation panel envelope having a substrate, a low thermal conductivity organic layer and a low thermal conductivity inorganic stack. The low thermal conductivity inorganic stack will include low thermal conductivity non-metallic inorganic materials and/or low thermal conductivity metallic materials.

Abstract: Described herein is a membrane separation module and articles and methods thereof, wherein the membrane separation module has a series of repeating layers, each layer comprising (a) a selectively permeable membrane; and (b) at least one support layer, wherein the support layer comprises a plurality of flow channels and a plurality of rails extending from the support layer, wherein the sides of two adjacent rails form a flow channel, wherein the plurality of rails on the support layer comprise a thermoplastic polymer at the distal end of at least a portion of the plurality of rails, and wherein the distal end of the plurality of rails contacts the selectively permeable membrane to form a bonded stack.

Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.

Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.