Patents by Inventor Qijing LIN

Qijing LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11171276
    Abstract: A thin-film thermocouple probe includes a columnar substrate, a tungsten-26% rhenium film and an indium oxide (In2O3) film. A side surface of the columnar substrate is provided with a first straight groove and a second straight groove. The tungsten-26% rhenium film is arranged on a front end surface of the columnar substrate and in the first straight groove. The indium oxide film is arranged on the front end surface of the columnar substrate and in the second straight groove. The indium oxide film on the front end surface of the columnar substrate is connected to the tungsten-26% rhenium film on the front end surface of the columnar substrate. A first metal lead wire is connected to the tungsten-26% rhenium film, and a second metal lead wire is connected to the indium oxide film. A method of preparing the thin-film thermocouple probe is provided.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: November 9, 2021
    Assignee: Xi'an Jiaotong University
    Inventors: Bian Tian, Zhongkai Zhang, Yan Liu, Zhaojun Liu, Jiangjiang Liu, Cunfeng Wang, Peng Shi, Qijing Lin, Zhuangde Jiang
  • Publication number: 20210234081
    Abstract: A thin-film thermocouple probe includes a columnar substrate, a tungsten-26% rhenium film and an indium oxide (In2O3) film. A side surface of the columnar substrate is provided with a first straight groove and a second straight groove. The tungsten-26% rhenium film is arranged on a front end surface of the columnar substrate and in the first straight groove. The indium oxide film is arranged on the front end surface of the columnar substrate and in the second straight groove. The indium oxide film on the front end surface of the columnar substrate is connected to the tungsten-26% rhenium film on the front end surface of the columnar substrate. A first metal lead wire is connected to the tungsten-26% rhenium film, and a second metal lead wire is connected to the indium oxide film. A method of preparing the thin-film thermocouple probe is provided.
    Type: Application
    Filed: December 10, 2020
    Publication date: July 29, 2021
    Inventors: Bian TIAN, Zhongkai ZHANG, Yan LIU, Zhaojun LIU, Jiangjiang LIU, Cunfeng WANG, Peng SHI, Qijing LIN, Zhuangde JIANG