Patents by Inventor Qimin MEI
Qimin MEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230328350Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.Type: ApplicationFiled: May 31, 2023Publication date: October 12, 2023Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Chenxiang XU
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Publication number: 20230300442Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.Type: ApplicationFiled: May 30, 2023Publication date: September 21, 2023Applicant: Ningbo Sunny Opotech Co., Ltd.Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Feifan CHEN, Qimin MEI, Liang DING, Heng JIANG
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Patent number: 11758253Abstract: This invention provides a camera module having a chamfer, a photosensitive assembly, a preparation method, and an electronic device. The photosensitive assembly of the camera module having the chamfer includes: a photosensitive element; a circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and wherein the circuit board has a circuit board chamfer; and a molded body having a light window and a molded body chamfer, wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a chamfer portion suitable for forming a chamfer structure of the camera module, and wherein the molded body is molded on the circuit board and encapsulates the photosensitive element, so that the camera module may be installed at a corner of the electronic device, thereby increasing the screen-to-body ratio.Type: GrantFiled: April 12, 2019Date of Patent: September 12, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Bojie Zhao, Dongli Yuan, Zhen Huang, QiMin Mei, Zhenyu Chen
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Patent number: 11758255Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: May 23, 2022Date of Patent: September 12, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
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Patent number: 11743569Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.Type: GrantFiled: March 3, 2022Date of Patent: August 29, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding, Heng Jiang
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Publication number: 20230247274Abstract: A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.Type: ApplicationFiled: April 11, 2023Publication date: August 3, 2023Applicant: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu WANG, Shoujie WANG, Nan GUO, Liang DING, Bojie ZHAO, Feifan CHEN, Chunmei LIU, Qimin MEI
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Patent number: 11706514Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.Type: GrantFiled: November 9, 2022Date of Patent: July 18, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Chenxiang Xu
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Patent number: 11706516Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.Type: GrantFiled: July 1, 2020Date of Patent: July 18, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding, Heng Jiang
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Patent number: 11659263Abstract: A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.Type: GrantFiled: March 22, 2018Date of Patent: May 23, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Shoujie Wang, Nan Guo, Liang Ding, Bojie Zhao, Feifan Chen, Chunmei Liu, Qimin Mei
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Publication number: 20230060371Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.Type: ApplicationFiled: November 9, 2022Publication date: March 2, 2023Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Chenxiang XU
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Publication number: 20220360694Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: May 23, 2022Publication date: November 10, 2022Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Zongchun YANG, Chenxiang XU
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Publication number: 20220345602Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.Type: ApplicationFiled: July 1, 2020Publication date: October 27, 2022Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko Tanaka, Feifan CHEN, Qimin MEI, Liang DING, Heng JIANG
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Patent number: 11412116Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: March 9, 2021Date of Patent: August 9, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
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Patent number: 11412117Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: March 9, 2021Date of Patent: August 9, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
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Publication number: 20220224808Abstract: A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.Type: ApplicationFiled: March 22, 2018Publication date: July 14, 2022Inventors: Mingzhu WANG, Shoujie WANG, Nan GUO, Liang DING, Bojie ZHAO, Feifan CHEN, Chunmei LIU, Qimin MEI
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Publication number: 20220191368Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.Type: ApplicationFiled: March 3, 2022Publication date: June 16, 2022Applicant: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Feifan CHEN, Qimin MEI, Liang DING, Heng JIANG
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Patent number: 11303789Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.Type: GrantFiled: June 22, 2020Date of Patent: April 12, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding, Heng Jiang
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Publication number: 20210321025Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.Type: ApplicationFiled: July 10, 2019Publication date: October 14, 2021Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Chenxiang XU
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Publication number: 20210289112Abstract: A molded assembly, a camera module, a jointed board of molded assembly, and a manufacturing method are provided. The molded assembly includes a circuit board and a molded portion, wherein the circuit board has a molding region, a mounting region and at least two pad regions, the molding region surrounds the mounting region, the pad regions are arranged at corners of the circuit board and located outside corresponding corners of the molding region so as to electrically connect to an actuator, and the pad region has an avoidance boundary, and an angle formed by the avoidance boundary is greater than 90 degrees; wherein the molded portion embeds the molding region, surrounds the mounting region, and has a light window, and the molded portion avoids the pad regions along the avoidance boundary so as to reduce defective rate during production.Type: ApplicationFiled: June 28, 2019Publication date: September 16, 2021Inventors: Zhewen MEI, Qimin MEI, Bojie ZHAO
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Publication number: 20210250477Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: March 9, 2021Publication date: August 12, 2021Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Zongchun YANG, Chenxiang XU