Patents by Inventor Qin-Jia CAI

Qin-Jia CAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging process of electronic component
    Patent number: 10083925
    Abstract: A packaging process of an electronic component includes the following steps. Firstly, a semi-package unit is provided. The semi-package unit includes a first insulation layer and an electronic component. The electronic component is partially embedded within the first insulation layer. The electronic component includes at least one conducting terminal. Then, a metal layer is formed over the surface of the semi-package unit and a part of the metal layer is removed, so that a metal mask is formed on the surface of the semi-package unit and the at least one conducting terminals is exposed. Then, a metal re-distribution layer is formed on the metal mask and the at least one conducting terminal. Then, a part of the metal re-distribution layer and a part of the metal mask are removed, so that at least one contact pad corresponding to the at least one conducting terminal is produced.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: September 25, 2018
    Assignee: Delta Electronics Int'l (Singapore) Pte Ltd
    Inventors: Qin-Jia Cai, Da-Jung Chen
  • PACKAGING PROCESS OF ELECTRONIC COMPONENT
    Publication number: 20180122756
    Abstract: A packaging process of an electronic component includes the following steps. Firstly, a semi-package unit is provided. The semi-package unit includes a first insulation layer and an electronic component. The electronic component is partially embedded within the first insulation layer. The electronic component includes at least one conducting terminal. Then, a metal layer is formed over the surface of the semi-package unit and a part of the metal layer is removed, so that a metal mask is formed on the surface of the semi-package unit and the at least one conducting terminals is exposed. Then, a metal re-distribution layer is formed on the metal mask and the at least one conducting terminal. Then, a part of the metal re-distribution layer and a part of the metal mask are removed, so that at least one contact pad corresponding to the at least one conducting terminal is produced.
    Type: Application
    Filed: December 8, 2017
    Publication date: May 3, 2018
    Inventors: Qin-Jia Cai, Da-Jung Chen
  • Packaging process of electronic component
    Patent number: 9875977
    Abstract: A packaging process of an electronic component includes the following steps. Firstly, a semi-package unit is provided. The semi-package unit includes a first insulation layer and an electronic component. The electronic component is partially embedded within the first insulation layer. The electronic component includes at least one conducting terminal. Then, a metal layer is formed over the surface of the semi-package unit and a part of the metal layer is removed, so that a metal mask is formed on the surface of the semi-package unit and the at least one conducting terminals is exposed. Then, a metal re-distribution layer is formed on the metal mask and the at least one conducting terminal. Then, a part of the metal re-distribution layer and a part of the metal mask are removed, so that at least one contact pad corresponding to the at least one conducting terminal is produced.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: January 23, 2018
    Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
    Inventors: Qin-Jia Cai, Da-Jung Chen
  • PACKAGING PROCESS OF ELECTRONIC COMPONENT
    Publication number: 20160240498
    Abstract: A packaging process of an electronic component includes the following steps. Firstly, a semi-package unit is provided. The semi-package unit includes a first insulation layer and an electronic component. The electronic component is partially embedded within the first insulation layer. The electronic component includes at least one conducting terminal. Then, a metal layer is formed over the surface of the semi-package unit and a part of the metal layer is removed, so that a metal mask is formed on the surface of the semi-package unit and the at least one conducting terminals is exposed. Then, a metal re-distribution layer is formed on the metal mask and the at least one conducting terminal. Then, a part of the metal re-distribution layer and a part of the metal mask are removed, so that at least one contact pad corresponding to the at least one conducting terminal is produced.
    Type: Application
    Filed: February 4, 2016
    Publication date: August 18, 2016
    Inventors: Qin-Jia CAI, Da-Jung CHEN