Patents by Inventor Qin Peng

Qin Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250112133
    Abstract: In examples, a method for manufacturing a package comprises coupling first and second semiconductor dies to a first surface of a conductive terminal; applying a dry film to a second surface of the conductive terminal opposite the first surface; removing a portion of the dry film contacting the second surface to form a dry film opening, the dry film opening having a linear, non-curved edge extending along a width of the conductive terminal; etching the second surface through the dry film opening; removing the dry film; plating the second surface; and sawing through the conductive terminal to form the package.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Inventors: Huo Yun DUAN, Tian Sheng CHEN, Hang YAN, Qin PENG, Xiangrui LI
  • Publication number: 20250069999
    Abstract: A semiconductor package includes a semiconductor component and a plurality of leads electrically connected to the semiconductor component. Each of the leads has a first surface, and has a second surface opposite from the first surface, with a solderable metal on the first surface and the second surface. The solderable metal has a first average thickness on the first surfaces, and has a second average thickness on the second surfaces. The second average thickness is 10 percent to 80 percent of the first average thickness. The semiconductor package is formed by concurrently electroplating the solderable metal on the first surfaces and on the second surfaces. The solderable metal is electroplated on the first surfaces with a first average current, and is electroplated on the second surfaces with a second average current. The second average current is 10 percent to 80 percent of the first average current.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Inventors: Huo Yun Duan, Qin Peng, Tian Sheng Chen, Xiangrui Li, Hang Yan
  • Publication number: 20240374682
    Abstract: The present invention relates to the field of biomedicine, and relates to a pharmaceutical use of a hypoxia-inducible lipid droplet-associated protein or a truncated fragment thereof. Specifically, the present invention relates to a use of a hypoxia-inducible lipid droplet-associated protein or a truncated active fragment thereof in the preparation of a drug for treating or preventing hyperlipidemia, hyperlipidemia complications or neurodegenerative diseases, or a use of the hypoxia-inducible lipid droplet-associated protein or the truncated active fragment thereof in the preparation of a drug for reducing the apolipoprotein level, low-density lipoprotein level, or very low-density lipoprotein level in blood or cerebrospinal fluid.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 14, 2024
    Inventors: Yilong Zou, Taotao Shi, Tianshu Wu, Fengxiang Wang, Yang Lu, Zijian Pan, Jingrong Han, Qin Peng, Yixin Wang
  • Patent number: D946286
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: March 22, 2022
    Inventor: Qin Peng