Abstract: The present disclosure relates to the field of touch technology, and provides a touch display module including a substrate, a transparent conductive layer, a moisture barrier layer, and a display element. The transparent conductive layer is disposed on the substrate. The moisture barrier layer extends laterally on the transparent conductive layer and covers the transparent conductive layer, and the moisture barrier layer includes inorganic materials. The display element is disposed on the moisture barrier layer. The touch display module of the present disclosure can avoid or slow down the water vapor/humidity intrusion from the environment, thereby meeting the specification requirements for improving product reliability test.

Abstract: A display system comprising a steerable display having a monocular field of view of at least 1 degree, positioned within a scannable field of view of at least 20 degrees, the steerable display positioned for a user. In one embodiment, the steerable display is positioned for the user's fovea.

Abstract: A transformer simulation system and a measurement method for setting value simulation are disclosed. The transformer simulation system includes an oil tank, a heating device, a pump body, a first oil pipe, a second oil pipe and a first flow sensor. The heating device is disposed in the oil tank. The oil tank is provided with a first inlet and a first outlet, the first outlet is connected to the first oil pipe, and the first inlet is connected to the second oil pipe. An end of the first oil pipe away from the oil tank is a first mounting end for being connected to an oil inlet of a gas relay, and an end of the second oil pipe away from the oil tank is a second mounting end for being connected to an oil outlet of the gas relay. The pump body is connected to the first oil pipe or the second oil pipe, and the first flow sensor is disposed in the first oil pipe.

Abstract: A semi-resonant actuator assembly includes a resonating body comprising a piezoelectric plate having a first length, a first width, and a first thickness, and an inactive plate having a second length substantially equal the first length, a second width substantially equal to the first width, and second thickness. A thickness of the resonating body is provided by a sum of the first thickness of the active piezoelectric plate and the second thickness of the inactive plate.

Abstract: In a described example, an electrical apparatus includes: a metal layer formed over a non-device side of a semiconductor device die, the semiconductor device die having devices formed on a device side of the semiconductor device die opposite the non-device side; a first side of the metal layer bonded to a die mount pad on a package substrate; a second side of the metal layer formed over a roughened surface on the non-device side of the semiconductor device die, the roughened surface having an average surface roughness (Ra) between 40 nm and 500 nm; bond pads on the semiconductor device die electrically coupled to conductive leads on the package substrate; and mold compound covering at least a portion of the semiconductor device die and at least a portion of the conductive leads.

Abstract: An actuator assembly includes one or more conductive coils each positioned in a movable supporting frame configured to be coupled to a load. A pair of permanent magnets are located on each side of each of the coils to provide opposite polarity magnetic fields to each of the coils. A drive circuit is coupled to the each of coils and configured to supply a drive current to each of the conductive coils. A controller is coupled to each of the coils through the drive circuit and is configured to independently control the drive current supplied to each of the coils to provide movement of the supporting frame to provide a force to the load, based on the opposite polarity fields and the drive current, wherein the movement of the supporting frame is in proportion to an amplitude and polarity of the drive current.

Abstract: A state space controller includes an integral part configured to integrate a control deviation, wherein the control deviation indicates a difference between a digital value of a gradient coil current and a reference current; a delay compensator configured to generate a digital control amount according to the integrated control deviation by the integral part, and generated a pulse-width modulation drive signal according to the digital control amount, and includes a subtractor of which a non-inverting input terminal is connected to an output terminal of the integral part, a delayer configured to delay the digital control amount by one calculation cycle, and a first feedback loop configured to delay the digital control amount by one calculation cycle and multiply a first compensation coefficient to obtain a first compensation amount, wherein the first compensation amount is input into a first inverting input terminal of the subtractor.

Abstract: A magnetic resonance imaging (MRI) method is provided. The method includes: a first echo signal and a second echo signal generated from each of channels of a MRI device are acquired by performing a pre-scanning according to an imaging sequence; a correction displacement with which an imaging phase consistency is maximum is determined by shifting a signal curve of the second echo signal for each of the channels for a plurality of times; a one-order phase correction value and a zero-order phase correction value for the channels are determined under the imaging sequence according to the correction displacement; a formal scanning is performed according to the imaging sequence to obtain scanning data; and a phase correction is performed on the scanning data according to the one-order phase correction value and the zero-order phase correction value to obtain target scanning data for reconstructing an image.

Abstract: The disclosure provides a method of making an iron matrix composite. A Fe—Ni—P composite powder having a particle size of one to two micrometers and a Fe—N powder having a particle size of 100 to 250 nanometers are used as the raw material. The size and axial displacement of pressing heads of a graphite mold are controlled to realize the control of the porosity of porous iron. The composite produced comprises two surface layers of a Fe—Ni—P alloy and an intermediate layer of porous iron having a porosity of 14 to 39%. The method enables a reduced weight of the Fe—Ni—P alloy and enables shock absorption and damping properties to be imparted to the composite. In addition, an optional subsequent deep cryogenic treatment allows the Fe—Ni—P alloy to be subjected to phase transition from a metastable gamma-phase to an alpha-phase, thereby substantially improving the hardness and strength thereof.

Abstract: The disclosure provides a method of making an iron matrix composite. A Fe—Ni—P composite powder having a particle size of one to two micrometers and a Fe—N powder having a particle size of 100 to 250 nanometers are used as the raw material. The size and axial displacement of pressing heads of a graphite mold are controlled to realize the control of the porosity of porous iron. The composite produced comprises two surface layers of a Fe—Ni—P alloy and an intermediate layer of porous iron having a porosity of 14 to 39%. The method enables a reduced weight of the Fe—Ni—P alloy and enables shock absorption and damping properties to be imparted to the composite. In addition, an optional subsequent deep cryogenic treatment allows the Fe—Ni—P alloy to be subjected to phase transition from a metastable gamma-phase to an alpha-phase, thereby substantially improving the hardness and strength thereof.

Abstract: Methods, systems, and computer-readable storage mediums for correcting time in a nuclear magnetic resonance device are provided. In one aspect, a method includes obtaining respective transmission time delays of three gradient pulse signals that are generated by a three-dimensional gradient subsystem of the nuclear magnetic resonance device and include a slice-selection gradient signal, a phase-encoding gradient signal, and a frequency-encoding gradient signal, determining a time correction value according to the obtained respective transmission time delays of the three gradient pulse signals, and correcting a respective output time of each of the three gradient pulse signals, an output time of a radio-frequency (RF) pulse signal generated by a RF transmitting subsystem of the nuclear magnetic resonance device, and a reception time of a magnetic resonance signal received by a RF receiving subsystem in a scanning cycle according to the determined time correction value.

Abstract: A conductive terminal adapted to be mounted in an insulation housing of a connector includes a mating portion disposed at a front of the conductive terminal and adapted to engage a mating terminal of a mating connector, a crimping portion disposed at a rear of the conductive terminal and adapted to be crimped onto a wire, and a pressing portion disposed at a rear end of the crimping portion and extending outward. The conductive terminal is adapted to be held in the insulation housing by pushing the pressing portion.

Abstract: A drive circuit of a radio-frequency (RF) transmitting coil and a magnetic resonance imaging (MRI) device are provided. According to an example, the drive circuit includes a controller, a digital-to-analogue converter (DAC) coupled with the controller, a RF amplifier coupled with the DAC, a power divider coupled with the RF amplifier, and a plurality of phase shifters respectively coupled with at least three output ports of the power divider.

Abstract: In some embodiments, a method of forming an integrated circuit includes providing a semiconductor substrate having an electronic circuit formed on a front side, and having a first material layer located over a second side of the substrate and a second material layer located between the first material layer and the second side. At least a portion of the first material layer is removed using a first chemical etching process, thereby exposing the second material layer. At least a portion of the second material layer is removed using a second chemical etching process. A portion of the substrate is then mechanically removed from the second side.

Abstract: A conductive terminal adapted to be mounted in an insulation housing of a connector includes a mating portion disposed at a front of the conductive terminal and adapted to engage a mating terminal of a mating connector, a crimping portion disposed at a rear of the conductive terminal and adapted to be crimped onto a wire, and a pressing portion disposed at a rear end of the crimping portion and extending outward. The conductive terminal is adapted to be held in the insulation housing by pushing the pressing portion.

Abstract: In some embodiments, a method of forming an integrated circuit includes providing a semiconductor substrate having an electronic circuit formed on a front side, and having a first material layer located over a second side of the substrate and a second material layer located between the first material layer and the second side. At least a portion of the first material layer is removed using a first chemical etching process, thereby exposing the second material layer. At least a portion of the second material layer is removed using a second chemical etching process. A portion of the substrate is then mechanically removed from the second side.

Abstract: A two-axis angular pointing device includes a pivot bearing configured to support a payload. A first actuator is positioned to contact the payload at a first drive point. A second actuator is positioned to contact the payload at a second drive point. The first actuator is configured to generate a first movement of the payload in a direction substantially orthogonal to a plane defined by a center of the pivot bearing, the first drive point, and the second drive point to cause the payload to rotate around a first rotation axis. The second actuator is configured to generate a second movement of the payload at the second drive point in the direction substantially orthogonal to the plane to cause the payload to rotate around a second rotation axis. A method of making a two-axis angular pointing device is also disclosed.

Abstract: In some embodiments, a method includes wet-etching a first film layer of a plurality of film layers stacked on a semiconductor substrate, the wet-etching of the first film layer performed using a first chemical, where the first film layer is an outermost film layer stacked on the semiconductor substrate. The method further includes wet-etching a second film layer of the plurality of film layers using a second chemical. The method also includes using a mechanical grinding wheel to grind the semiconductor substrate to reduce a thickness of the semiconductor substrate.

Abstract: In some embodiments, a method includes wet-etching a first film layer of a plurality of film layers stacked on a semiconductor substrate, the wet-etching of the first film layer performed using a first chemical, where the first film layer is an outermost film layer stacked on the semiconductor substrate. The method further includes wet-etching a second film layer of the plurality of film layers using a second chemical. The method also includes using a mechanical grinding wheel to grind the semiconductor substrate to reduce a thickness of the semiconductor substrate.

Abstract: A chemical solution cleaning process for removing backside contamination prior to metallization involves selective chemistries of a mixture containing NH4OH and H2O2 that may be diluted to specific concentrations depending upon the topside metal and passivation of a semiconductor wafer, which is applied after removing a topside protection material to protect the topside circuitry.