Abstract: The present disclosure provides an installation device for installing a sensor to a component. The installation device includes a first and second clamps connected together for clamping onto the component. A first adjuster is movably assembled to the first and second clamps. A second adjuster is movably assembled to the first adjuster and includes an installing portion for installing the sensor. The first adjuster and the second adjuster can move along different adjusting directions to adjust the direction of the sensor. The sensor installation device has good adaptability and the installing position can be adjusted according to the actual needs. The installation reliability and connection rigidity can be ensured by various ways such as bolt fastening, fastener fixation or adhesion etc., and the vibration signal transmission path is improved. This makes the installation device especially suitable for installation of vibration sensors and ensures vibration sensors optimally collect vibration signals.

Abstract: A cooling bracelet that is adapted to be worn by a user for the purpose of cooling the wrist area of the user so as to lower the users body temperature after a period of exercise. The cooling bracelet is adapted for use in combination with a cooling pack that is mounted in the cooling bracelet. The cooling bracelet includes a middle pad and separate elongated bracelet straps that extend from the middle pad. Respective securing members are disposed at free ends of each elongated bracelet strap. The respective securing members are for fastening the cooling bracelet about the wrist area of the user. The middle pad of the cooling bracelet has a recess for receiving the cooling pack therein, said recess positioned, when the cooling bracelet is fastened about the wrist area of the user, to face the wrist area of the user in order to provide a cooling effect from the cooling pack and against the wrist area of the user.

Abstract: A pressing member is used for downwardly pressing on a chip module. The pressing member has a main body and a central opening going through the main body. The main body has an upper surface and a lower surface opposite to the upper surface. The central opening is provided for a part portion of the chip module going through. The pressing member has a pressing portion protrudes upwardly from the upper surface and provided for an external device pressing downwardly on to make the main body press downwardly on the chip module so as to prevent the chip module from warping.

Abstract: A pressing member is used for downwardly pressing on a chip module. The pressing member has a main body and a central opening going through the main body. The main body has an upper surface and a lower surface opposite to the upper surface. The central opening is provided for a part portion of the chip module going through. The pressing member has a pressing portion protrudes upwardly from the upper surface and provided for an external device pressing downwardly on to make the main body press downwardly on the chip module so as to prevent the chip module from warping.

Abstract: An in vivo method for labelling a protein having an N-terminal cysteine is disclosed. A probe comprising a thioester group and a detectable label is introduced into a cell expressing the N-terminal cysteine protein, allowing for the N-terminal cysteine to cleave the thioester bond and resulting in the label being covalently attached to the N-terminus of the protein by an amide bond.

Abstract: The present invention provides an intein-mediated method of attaching a ligand to a protein for immobilization onto a support functionalized with an affinity receptor. In one embodiment, the ligand is biotin and the affinity receptor is avidin. Biotin is attached to the protein by reacting cysteine-biotin with a fusion protein comprising a cleavable intein and a protein of interest to effect cleavage of the cystein and attachment of biotin to the protein. The present invention further provides a novel protein array and a high throughput method of preparing protein arrays by expressing the protein of interest as an intein fusion protein including a binding domain for purification, attaching a ligand to the fusion protein under condition suitable for cleavage of the intein and attachment of the ligand to the remaining protein and immobilizing the resulting protein-ligand onto a support that has been functionalized with an affinity receptor.