Abstract: A cutting device configured to cut a workpiece includes a base and a cover plate. The cover plate includes a base plate, a pressing member, and an elastic member. A surface of the base plate facing the base defines a receiving groove configured to receive the pressing member. The pressing member defines a number of first cutter slots to allow cutters to pass through to cut the workpiece located between the base and the cover plate. The elastic member includes a connecting portion and an elastic portion. The connecting portion is fixedly coupled to the pressing member and partially extends beyond an edge of the pressing portion. One end of the elastic portion abuts against the base plate, and a second end of the elastic portion is coupled to the connecting portion.

Abstract: A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.

Abstract: A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.