Patents by Inventor Qing Lui

Qing Lui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inter-chip communication
    Patent number: 7612443
    Abstract: The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: November 3, 2009
    Assignee: University of Notre Dame Du Lac
    Inventors: Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Lui