Abstract: A semiconductor structure includes: a logic device including a first power line and a second power line located on a same wiring layer, extending along a first direction and arranged in parallel along a second direction, the first direction and the second direction intersecting with each other and being parallel to a plane where the wiring layer is located; and a switch driving device, the switch driving device and the logic device being arranged in parallel along the first direction, the switch driving device including a first input line and a first output line located on the same wiring layer as the first power line, extending along the first direction and arranged in parallel along the second direction, the first output line being connected with the first power line or the second power line.

Abstract: A drilling device and a drilling construction method for an electric power iron tower foundation are provided. The drilling device includes a hydraulic drilling unit, a multi-way connector, a compressed air conduit, a plurality of air compressor units, an air duct, a dust removal unit and an operation bench. The hydraulic drilling unit is capable of moving among a plurality of drilling platforms and among a plurality of hole positions on the plurality of drilling platforms and performing a drilling operation. The plurality of air compressor units are disposed in a fixing and mounting region that is between the plurality of drilling platforms, where compressed air outputted by the plurality of air compressor units flows jointly through the multi-way connector and then is transmitted to the hydraulic drilling unit through the compressed air conduit.

Abstract: Disclosed herein is a decontaminant aqueous solution for decontaminating diisocyanate drum, including 20-97 wt % of at least one alcohol or derivative thereof, based on the total weight of decontaminant aqueous solution, and an alkaline source in an amount effective to provide the solution a pH of at least 8. Further disclosed herein is a method for decontaminating diisocyanate residues in an emptied drum with the decontaminant aqueous solution.

Abstract: A low-cost lead-free dezincification corrosion-resistant brass alloy for casting. The brass alloy contains: 60-65 wt. % of Cu, 0.05-0.25 wt. % of Pb, 0.05-0.8 wt. % of Al, 0-0.1 wt. % of Sn, and 0.05-0.16 wt. % of As, with the balance being Zn and inevitable impurities. Moreover, the equivalent weight of zinc X meets the requirements of the following formula: 35%<X<39.5%, and X=(B+?CiKi/(A+B+?CiKi); in the formula, X is the equivalent weight of zinc in the complex brass, A is the copper content (%), B is the actual zinc content (%), Ci is the content (%) of the other alloy elements, and CiKi is the corresponding equivalent weight of zinc of various elements.

Abstract: A low-cost lead-free dezincification corrosion-resistant brass alloy for casting. The brass alloy contains: 60-65 wt. % of Cu, 0.05-0.25 wt. % of Pb, 0.05-0.8 wt. % of Al, 0-0.1 wt. % of Sn, and 0.05-0.16 wt. % of As, with the balance being Zn and inevitable impurities. Moreover, the equivalent weight of zinc X meets the requirements of the following formula: 35%<X<39.5%, and X=(B+?CiKi/(A+B+?CiKi); in the formula, X is the equivalent weight of zinc in the complex brass, A is the copper content (%), B is the actual zinc content (%), Ci is the content (%) of the other alloy elements, and CiKi is the corresponding equivalent weight of zinc of various elements.

Abstract: The present invention provides an environment-friendly manganese brass alloy, which comprises 55˜65 wt % of Cu, 1.0˜6.5 wt % of Mn, 0.2˜3.0 wt % of Al, 0˜3.0 wt % of Fe, 0.3˜2.0 wt % of Sn, 0.01˜0.3 wt % of Mg, 0˜0.3 wt % of Bi and/or 0˜0.2 wt % of Pb, the balance being Zn and unavoidable impurities. The alloys not only have superior mechanical properties, castability, cutability and corrosion resistance, especially stress corrosion resistance properties, but also have the advantages of low manufacturing costs and simple manufacturing process etc, which is suitable for making components through forging, casting, cutting and other manufacturing methods, especially suitable for making water tap bodies and valves through forging, casting and cutting processes.

Abstract: The present invention provides an environment-friendly manganese brass alloy, which comprises 55˜65 wt % of Cu, 1.0˜6.5 wt % of Mn, 0.2˜3.0 wt % of Al, 0˜3.0 wt % of Fe, 0.3˜2.0 wt % of Sn, 0.01˜0.3 wt % of Mg, 0˜0.3 wt % of Bi and/or 0˜0.2 wt % of Pb, the balance being Zn and unavoidable impurities. The alloys not only have superior mechanical properties, castability, cutability and corrosion resistance, especially stress corrosion resistance properties, but also have the advantages of low manufacturing costs and simple manufacturing process etc, which is suitable for making components through forging, casting, cutting and other manufacturing methods, especially suitable for making water tap bodies and valves through forging, casting and cutting processes.

Abstract: A semiconductor work piece processing reactor is described and which includes a processing chamber defining a deposition region; a pedestal which supports and moves a semiconductor work piece to be processed within the deposition region of the processing chamber; and a gas distribution assembly mounted within the processing chamber and which defines first and second reactive gas passageways which are separated from each other, and which deliver two reactant gases to a semiconductor work piece which is positioned near the gas distribution assembly.

Abstract: A semiconductor work piece processing reactor is described and which includes a processing chamber defining a deposition region; a pedestal which supports and moves a semiconductor work piece to be processed within the deposition region of the processing chamber; and a gas distribution assembly mounted within the processing chamber and which defines first and second reactive gas passageways which are separated from each other, and which deliver two reactant gases to a semiconductor work piece which is positioned near the gas distribution assembly.

Abstract: An assembly and method for delivering a reactant material onto a substrate is described and which includes a delivery member which has a first surface, and an opposite second surface, and wherein the second surface is positioned adjacent to a substrate, and wherein an elongated substantially continuous channel is formed in the second surface of the delivery member, and which is coupled in fluid flowing relation relative to a source of reactant material, and wherein the elongated substantially continuous channel delivers the reactant material onto the substrate.