Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.

Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.

Abstract: An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board, the heat generating electronic component and a heat pipe therein. The heat pipe includes an evaporating side and a condensing side. The evaporating side thermally contacts the heat generating electronic component, and the condensing side thermally contacts the shell.

Abstract: A vapor chamber includes a heat absorbing plate and a heat dissipating plate attached to the heat absorbing plate. The heat absorbing plate includes a wick structure thereon facing the heat dissipating plate. The wick structure defines a plurality of first grooves and a plurality of second grooves intersecting the first grooves. The heat dissipating plate forms a hermetically sealed container in cooperation with the heat absorbing plate. The hermetically sealed container receives the wick structure therein. Working fluid is sealed inside the container and flows in the first grooves and the second grooves.

Abstract: An exemplary method for sealing a vapor chamber includes, firstly, providing a casing, wherein the casing has an opening. Then a metallic tube is inserted into the opening such that the tube is hermetically engaged in the opening. Next, a pressing mold is provided, wherein the pressing mold includes a positive pole and a negative pole opposite to the positive pole. A free end of the tube is pressed by the positive pole and the negative pole of the pressing mold to form a crimped sealing portion. Then electricity is charged between the positive pole and the negative pole. The electricity passes through the crimped sealing portion and heats an inner face of the crimped sealing portion to weld the crimped sealing portion.

Abstract: A plate-type heat pipe includes a sealed shell containing working liquid therein, and elongated wick structures arranged in the shell in a spaced manner. Channels are formed between the wick structures. The heat pipe has an evaporating section and a condensing section. Two ends of each wick structure are respectively located at the evaporating section and the condensing section. Top and bottom faces of each wick structure respectively contact top and bottom inner faces of the shell.