Abstract: Method and apparatus for approximating the average critical area of a layout or layout region, involving summing, over all the object segments of interest, respective critical area contribution values that are dependent upon particular layout parameters of the objects, each of the contribution values being representative of a plurality of defect sizes, and being defined such that for each defect size in the plurality of defect sizes, and for a particular defect type, the contribution values collectively count all critical areas arising due to the object segments of interest only once.

Abstract: An ATCA board compatible hard disk mounting structure is disclosed to include a cover fastened to an ATCA board to hold a hard disk, a bracket fixedly fastened to the front side of the cover, a plurality of electric fans mounted in the bracket, an insulative member mounted in between the cover and the bracket to isolate the cover from the bracket, and a face panel fastened to the bracket and fitted into one PMC slot of an I/O face panel of the ATCA board.

Abstract: Method and apparatus for approximating the average critical area of a layout or layout region, involving summing, over all the object segments of interest, respective critical area contribution values that are dependent upon particular layout parameters of the objects, each of the contribution values being representative of a plurality of defect sizes, and being defined such that for each defect size in the plurality of defect sizes, and for a particular defect type, the contribution values collectively count all critical areas arising due to the object segments of interest only once.

Abstract: An ATCA card assembly, which includes a rear transition module mounted on and electrically connected to a circuit board and having an electric connecting portion at one side, a holder frame mounted on the rear transition module to hold multiple hard disk drives in a stack, and an adapter, which has an adapter board affixed to the circuit board and front mounting lugs of the holder frame to secure the holder frame in place, and electrical connectors extending from the adapter board at different elevations and respectively connected to the electric connecting portion of the rear transition module and the hard disk drives.

Abstract: Method and apparatus for approximating the average critical area of a layout or layout region, involving summing, over all the object segments of interest, respective critical area contribution values that are dependent upon particular layout parameters of the objects, each of the contribution values being representative of a plurality of defect sizes, and being defined such that for each defect size in the plurality of defect sizes, and for a particular defect type, the contribution values collectively count all critical areas arising due to the object segments of interest only once.

Abstract: A double-side scanning mechanism for capturing images of a paper having two pages includes a second transparent element disposed corresponding to an outer side of a first transparent element and parallel to the first transparent element. A paper conveying device conveys a paper to pass between the first and the second transparent elements with a first page facing the first transparent element. The paper is flipped and passes over the outer side of the second transparent element with a second page facing the second transparent element. An image scanning module is disposed corresponding to an inner side of the first transparent element, for capturing the image of the first page when the paper passes between the first and the second transparent elements, and capturing the image of the second page when the paper passes over an outer side of the second transparent element.

Abstract: A paper feeding apparatus including a paper pickup roller assembly, a paper conveying roller assembly, a one-way driving assembly, and a reverse driving assembly is provided. The one-way driving and the reverse driving assembly are connected to a driving device, such as a motor, wherein the one-way driving assembly is engaged with the paper pickup roller assembly only in one direction to drive the paper pickup roller assembly forward as the driving device rotates forward and stop driving the paper pickup roller assembly as the driving device rotates backward, and the reverse driving assembly is provided for driving the paper conveying roller assembly to constantly rotate forward for conveying the paper sheet to move forward no matter whether the driving device rotates forward or backward.

Abstract: An ATCA locking lever mounting arrangement includes a motherboard blade, which has a face panel with a through hole and a grounding plate with two retaining spring arms, and a locking lever, which is pivoted to a motherboard blade for locking the motherboard blade to the machine case of a server system, having a retaining member for insertion through the through hole of the face panel into engagement with the retaining spring arms of the grounding plate and a protruded bearing portion and an actuating portion at two distal ends for stopping at the outside wall or inside wall of the machine case of the server system to limit the turning angle of the locking lever.

Abstract: A method of forming a semiconductor structure comprises providing a semiconductor structure comprising a layer of a dielectric material provided over an electrically conductive feature. An opening is formed in the layer of dielectric material. The opening is located over the electrically conductive feature and has a first lateral dimension. A cavity is formed in the electrically conductive feature. The cavity has a second lateral dimension being greater than the first lateral dimension. The cavity and the opening are filled with an electrically conductive material.

Abstract: The present invention provides an object-feeding system. The feeding system includes an object feeder and a pickup roller. The object feeder includes an object separating ramp and a tray part. The object separating ramp is placed along an object feeding direction. The tray part is for loading at least an object to be fed, and the tray part includes a main body and a protruding portion sticking out from the main body and connected to the object separating ramp, wherein the protruding portion and the main body constitute a hollow part. The pickup roller is for feeding the object by rolling, wherein the hollow and the pickup roller separately locate two sides of the object and the pickup roller locates the hollow place above.

Abstract: A fastener used in a blade server to secure a thermal module and a motherboard to a metal face panel, including a cushion member set between the metal face panel and the motherboard, an elastically compressible and electrically insulative spacer member set between the motherboard and the thermal module, a lock member fastened to the cushion member and the spacer member to lock the motherboard to the metal face panel, a locating member fastening the thermal module to the spacer member, and a spring member mounted on the locating member to keep the thermal module in close contact with a chip at the motherboard. The spacer member automatically adjusts the tightness between the thermal module and the chip at the motherboard, and isolates the digital grounding loop formed in the locating member and the thermal module from the analog grounding loop formed in the lock member and the metal face panel.

Abstract: A dimension of a conductive material in a semiconductor wafer is determined by a computer that treats as identical (a) volume of the conductive material which is proportional to an effective surface area of sidewalls of an insulative trench and (b) volume of the conductive material derived from geometry based on a predetermined amount by which width of a conductive trench (if present) in the conductive material differs from width of the insulative trench. In some embodiments, the computer computes the effective surface area as the product of trench depth and a layout parameter, either or both of which may be partially or wholly empirically determined from a test wafer containing several topographies. The computer computes the dimension assuming one topography and validates the assumption if a predetermined condition is met. If the condition is not met, the computer re-computes the dimension, assuming another topography.

Abstract: A diskdrive bracket mounting structure includes a bracket, a hexagonal copper column set at the bottom side of the bracket, a master cushion mounted in a mounting through hole of the bracket and sandwiched between the bracket and the hexagonal copper column, a supplementary cushion supported on the top side of the bracket around a part of the master cushion, and a P-head screw inserted through a through hole of the supplementary cushion and a through hole of the master cushion and threaded into a screw hole of the hexagonal copper column to affix the bracket to the hexagonal copper column, allowing the diskdrive bracket mounting structure to provide both the function of classis ground as well as the function of digital ground.

Abstract: One embodiment of the present invention provides a system that reduces random yield loss. During operation, the system can receive a design layout. The system may also receive weighting factors that are associated with the particle densities in the metal regions and the empty regions. Next, the system can determine local critical-area-ratios and optimization potentials for a set of wire-segments. The system can then select a wire segment, and compare its local critical-area-ratio with a global critical-area-ratio. Next, the system can use the result of the comparison to determine a layout optimization. The system can then apply the layout optimization to the wire segment to obtain an improved layout.

Abstract: One embodiment of the present invention provides a system that predicts manufacturing yield for a die within a semiconductor wafer. During operation, the system first receives a physical layout of the die. Next, the system partitions the die into an array of tiles. The system then computes systematic variations for a quality indicative value to describe a process parameter across the array of tiles based on the physical layout of the die. Next, the system applies a random variation for the quality indicative parameter to each tile in the array of tiles. Finally, the system obtains the manufacturing yield for the die based on both the systematic variations and the random variations.

Abstract: A dimension of a conductive material in a semiconductor wafer is determined by a computer that treats as identical (a) volume of the conductive material which is proportional to an effective surface area of sidewalls of an insulative trench and (b) volume of the conductive material derived from geometry based on a predetermined amount by which width of a conductive trench (if present) in the conductive material differs from width of the insulative trench. In some embodiments, the computer computes the effective surface area as the product of trench depth and a layout parameter, either or both of which may be partially or wholly empirically determined from a test wafer containing several topographies. The computer computes the dimension assuming one topography and validates the assumption if a predetermined condition is met. If the condition is not met, the computer re-computes the dimension, assuming another topography.

Abstract: An ATCA board compatible hard disk mounting structure is disclosed to include a cover fastened to an ATCA board to hold a hard disk, a bracket fixedly fastened to the front side of the cover, a plurality of electric fans mounted in the bracket, an insulative member mounted in between the cover and the bracket to isolate the cover from the bracket, and a face panel fastened to the bracket and fitted into one PMC slot of an I/O face panel of the ATCA board.

Abstract: Method and apparatus for approximating the average critical area of a layout or layout region, involving summing, over all the object segments of interest, respective critical area contribution values that are dependent upon particular layout parameters of the objects, each of the contribution values being representative of a plurality of defect sizes, and being defined such that for each defect size in the plurality of defect sizes, and for a particular defect type, the contribution values collectively count all critical areas arising due to the object segments of interest only once.