Abstract: In a land grid array connector for electrically connecting a chip module to a printed circuit board, comprising: an insulative housing and a plurality of contacts, the housing including side walls and a central portion surrounded by the side walls, the central portion having a first mounting face toward the chip module, a second mounting face toward the printed circuit board, and a plurality of grooves receiving the contacts, at least two of the side walls each including a spring arm extending into the central portion, the improvement wherein a protrusion is disposed on at least one of the spring arm and the associated side wall.

Abstract: An LGA connector contact (30) includes a base (31), and a pair of spring arms (32) extending from the base. One of the spring arms includes an extending section (320), a connecting section (321), and a contacting section (322) adapted for engaging a contact pad of an IC package. The contacting section has an exterior side and an interior side, with a recess (323) on the exterior side of the contacting section around a middle portion of the contacting section so as to define at least a pair of contact regions (324) adjacent the recess. The LGA contacting portion is configured to have its contact regions electrically engage with un-oxidized portions of the IC package, thereby achieving an effective electrical connection between the LGA connector contact and the corresponding IC package pad.

Abstract: An LGA connector contact (30) includes a base (31), and a pair of spring arms (32) extending from the base. Each of the spring arms includes an extending section (320), a connecting section (321), and a contacting section (322) adapted for engaging a circuit board's contact pad. The contacting section has an exterior side and an interior side with a recess (323) on the exterior side of the contacting section around a middle portion of the contacting section so as to define at least a pair of contact regions (324) adjacent the recess. The LGA contacting portion is configured to have its contact regions electrically engage with an un-oxidized portion of the circuit board's contact pad, thereby achieving an effective electrical connection between the LGA connector contact and the corresponding circuit board pad.

Abstract: In a land grid array connector for electrically connecting a chip module to a printed circuit board, comprising: an insulative housing and a plurality of contacts, the housing including side walls and a central portion surrounded by the side walls, the central portion having a first mounting face toward the chip module, a second mounting face toward the printed circuit board, and a plurality of grooves receiving the contacts, at least two of the side walls each including a spring arm extending into the central portion, the improvement wherein a protrusion is disposed on at least one of the spring arm and the associated side wall.

Abstract: An LGA connector contact (30) includes a base (31), and a pair of spring arms (32) extending from the base. Each of the spring arms includes an extending section (320), a connecting section (321), and a contacting section (322) adapted for engaging a circuit board's contact pad. The contacting section has an exterior side and an interior side with a recess (323) on the exterior side of the contacting section around a middle portion of the contacting section so as to define at least a pair of contact regions (324) adjacent the recess. The LGA contacting portion is configured to have its contact regions electrically engage with an un-oxidized portion of the circuit board's contact pad, thereby achieving an effective electrical connection between the LGA connector contact and the corresponding circuit board pad.