Abstract: Disclosed is an electromagnetic shielding film, comprising a release film layer, an insulation layer, a black insulation shielding layer, a metal layer, a conductive paste layer and a protective film layer which are sequentially connected. The conductive paste layer further comprises an electromagnetic wave absorbent. The electromagnetic wave absorbent is a mixture of one or more of carbon nanotubes, graphene and ferrite.

Abstract: The present invention provides an electromagnetic wave shielding film, comprising at least one electromagnetic shielding layer, one side of the electromagnetic shielding layer being an adhesive layer, and the other side an insulating layer. At least one side of the insulating layer is rough with a roughness of 2-10 ?m. The thickness of the insulating layer is 1-10 ?m. The thickness of the electromagnetic shielding layer is 10-5000 nm. The present invention also provides a method for preparing an electromagnetic wave shielding film, which includes roughening an insulating layer or adding inorganic particles to the material of the insulating layer to form an insulating layer with a roughened surface, forming an electromagnetic shielding layer on the roughened surface, and forming an adhesive layer on the surface of the electromagnetic shielding layer. The present invention significantly reduces the grounding resistance when the electromagnetic shielding film is applied.

Abstract: Disclosed is an electromagnetic shielding film, comprising a release film layer, an insulation layer, a black insulation shielding layer, a metal layer, a conductive paste layer and a protective film layer which are sequentially connected. The conductive paste layer further comprises an electromagnetic wave absorbent. The electromagnetic wave absorbent is a mixture of one or more of carbon nanotubes, graphene and ferrite.