Patents by Inventor Qingchin He

Qingchin He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120145446
    Abstract: An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation.
    Type: Application
    Filed: August 16, 2011
    Publication date: June 14, 2012
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Jie YANG, Qingchin He, Hanmin Zhang