Patents by Inventor Qinggao ZHOU

Qinggao ZHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10186616
    Abstract: The present disclosure provides a thin film transistor, a method for manufacturing the same, a thin film transistor assembly, an array substrate and a display apparatus. The thin film transistor comprises: a substrate; a gate electrode, a gate insulation portion, a semiconductor portion, a source electrode and a drain electrode, the gate insulation portion separating the semiconductor portion from the gate electrode, and the source electrode and the drain electrode being connected to the semiconductor portion, wherein a projection of the gate electrode onto the substrate and that of the semiconductor portion onto the substrate are not overlapped with each other.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: January 22, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Qinggao Zhou, Peng Li, Zhong Feng, Panpan Meng, Zuhong Liu, Daeoh Oh, Zhi Hou
  • Publication number: 20170194482
    Abstract: The present disclosure provides a thin film transistor, a method for manufacturing the same, a thin film transistor assembly, an array substrate and a display apparatus. The thin film transistor comprises: a substrate; a gate electrode, a gate insulation portion, a semiconductor portion, a source electrode and a drain electrode, the gate insulation portion separating the semiconductor portion from the gate electrode, and the source electrode and the drain electrode being connected to the semiconductor portion, wherein a projection of the gate electrode onto the substrate and that of the semiconductor portion onto the substrate are not overlapped with each other.
    Type: Application
    Filed: May 22, 2015
    Publication date: July 6, 2017
    Inventors: Qinggao Zhou, Peng Li, Zhong Feng, Panpan Meng, Zuhong Liu, Daeoh Oh, Zhi Hou
  • Patent number: 9685133
    Abstract: There are provided with a strobe driving circuit, a strobe driving method, an array substrate and a display apparatus. The strobe driving circuit includes: a first driving unit for receiving a timing control signal, generating a first strobe driving signal based on the power signal under the control of the timing control signal; a first energy storing unit, storing energy based on the first strobe driving signal; a second driving unit connected to the first energy storing unit, for generating a second strobe driving signal based on the energy stored by the first energy storing unit under the control of the timing control signal. In the technical solution according to the embodiments of the application, the number of required bonding pads is reduced, so that the complexity of semiconductor manufacturing process and the difficulty of the manufacturing procedure are reduced.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: June 20, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Qinggao Zhou, Peng Li, Zhong Feng, Panpan Meng, Zuhong Liu, Daeoh Oh, Zhi Hou
  • Publication number: 20160035270
    Abstract: There are provided with a strobe driving circuit, a strobe driving method, an array substrate and a display apparatus. The strobe driving circuit includes: a first driving unit for receiving a timing control signal, generating a first strobe driving signal based on the power signal under the control of the timing control signal; a first energy storing unit, storing energy based on the first strobe driving signal; a second driving unit connected to the first energy storing unit, for generating a second strobe driving signal based on the energy stored by the first energy storing unit under the control of the timing control signal. In the technical solution according to the embodiments of the application, the number of required bonding pads is reduced, so that the complexity of semiconductor manufacturing process and the difficulty of the manufacturing procedure are reduced.
    Type: Application
    Filed: January 5, 2015
    Publication date: February 4, 2016
    Inventors: Qinggao ZHOU, Peng LI, Zhong FENG, Panpan MENG, Zuhong LIU, Daeoh OH, Zhi HOU