Patents by Inventor Qingguo Gong

Qingguo Gong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10433441
    Abstract: A housing, a method for manufacturing the housing, and a mobile terminal having the housing include a substrate including a metal area, a slot defined in the metal area of the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a paint layer on the insulating layer.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: October 1, 2019
    Assignee: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
    Inventors: Jing Li, Guangming Yang, Qingguo Gong
  • Patent number: 10414103
    Abstract: A cover plate, a method of manufacturing the cover plate, and an electronic device having the cover plate are provided. The cover plate includes a substrate, at least one slot defined in the substrate and penetrating through the substrate, and a filling layer received in the slot including an insulating layer and a gel layer located on the insulating layer.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: September 17, 2019
    Assignee: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
    Inventors: Jing Li, Guangming Yang, Qingguo Gong
  • Patent number: 10382601
    Abstract: A housing for a mobile terminal, a method for manufacturing the housing, and a mobile terminal having the housing are provided. The housing includes a substrate made of metal and a slot penetrating through the substrate. A filling layer is received in the slot and includes a printed sub-layer and an insulating sub-layer from top to bottom. The printed sub-layer has a thickness of 0.1-0.3 mm. The printed sub-layer is formed of a polymer film subjected to a color printing process. After the color printing process, the polymer film is subjected to one or more black/white color printing processes.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: August 13, 2019
    Assignee: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
    Inventors: Jing Li, Guangming Yang, Qingguo Gong
  • Publication number: 20180270973
    Abstract: A housing, a method for manufacturing an antenna, and a mobile terminal having the housing are provided. The housing includes a substrate at least including a metal area, a slot defined in the metal area of the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a paint layer on the insulating layer. The paint layer has a width which is 0.02-0.06 mm larger than that of the insulating layer. An outer surface of the paint layer and an outer surface of the substrate have a same color.
    Type: Application
    Filed: May 24, 2018
    Publication date: September 20, 2018
    Inventors: Jing Li, Guangming Yang, Qingguo Gong
  • Publication number: 20180124221
    Abstract: A housing for a mobile terminal, a method for manufacturing the housing, and a mobile terminal having the housing are provided. The housing includes a substrate made of metal and a slot penetrating through the substrate. A filling layer is received in the slot and includes a printed sub-layer and an insulating sub-layer from top to bottom. The printed sub-layer has a thickness of 0.1-0.3 mm. The printed sub-layer is formed of a polymer film subjected to a color printing process. After the color printing process, the polymer film is subjected to one or more black/white color printing processes.
    Type: Application
    Filed: December 28, 2017
    Publication date: May 3, 2018
    Inventors: Jing Li, Guangming Yang, Qingguo Gong
  • Publication number: 20180042130
    Abstract: A housing, a method for manufacturing the housing, and a mobile terminal having the housing include a substrate including a metal area, a slot defined in the metal area of the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a paint layer on the insulating layer.
    Type: Application
    Filed: July 13, 2017
    Publication date: February 8, 2018
    Inventors: Jing Li, Guangming Yang, Qingguo Gong
  • Publication number: 20180036961
    Abstract: A cover plate, a method of manufacturing the cover plate, and an electronic device having the cover plate are provided. The cover plate includes a substrate, at least one slot defined in the substrate and penetrating through the substrate, and a filling layer received in the slot including an insulating layer and a gel layer located on the insulating layer.
    Type: Application
    Filed: August 3, 2017
    Publication date: February 8, 2018
    Inventors: Jing Li, Guangming Yang, Qingguo Gong
  • Publication number: 20180041616
    Abstract: A housing for a mobile terminal, a method for manufacturing the housing, and a mobile terminal having the housing are provided. The housing includes a substrate made of metal, at least one slot penetrating through the substrate in a thickness direction of the substrate, and a filling layer received in the at least one slot. The filling layer includes an insulating sub-layer and a printed sub-layer located on the insulating sub-layer.
    Type: Application
    Filed: August 3, 2017
    Publication date: February 8, 2018
    Inventors: Jing Li, Guangming Yang, Qingguo Gong
  • Patent number: 8451084
    Abstract: A laminated SMD-type thermistor has a conductive module, a left and a right conductive metal layer. The conductive module includes a core conductive module coated with an insulating layer on the upper and lower surface, and the left and right side. The core conductive module includes at least one conductive unit piled up in sequence, two conductive units are separated by an insulating material layer. The conductive unit includes an upper metal foil, a conductive polymer chip and a lower metal foil which are laminated in sequence from top to bottom. A left and right conductive metal layer are coated on the left and right part of the conductive module respectively, and penetrate the insulating layer partially, to connect with two metal foils of the conductive unit respectively. The laminated SMD-type thermistor can further comprise two plating resistant films coated on the upper and lower surface of the conductive module.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: May 28, 2013
    Assignee: Shanghai Keter Polymer Material Co., Ltd.
    Inventors: Jinhua Huang, Pengxing Wang, Qingguo Gong, Yuzheng Shi, Jiangquan Liao
  • Publication number: 20110273264
    Abstract: A laminated SMD-type thermistor has a conductive module, a left and a right conductive metal layer. The conductive module includes a core conductive module coated with an insulating layer on the upper and lower surface, and the left and right side. The core conductive module includes at least one conductive unit piled up in sequence, two conductive units are separated by an insulating material layer. The conductive unit includes an upper metal foil, a conductive polymer chip and a lower metal foil which are laminated in sequence from top to bottom. A left and right conductive metal layer are coated on the left and right part of the conductive module respectively, and penetrate the insulating layer partially, to connect with two metal foils of the conductive unit respectively. The laminated SMD-type thermistor can further comprise two plating resistant films coated on the upper and lower surface of the conductive module.
    Type: Application
    Filed: June 29, 2009
    Publication date: November 10, 2011
    Applicant: SHANGHAI KETER POLYMER MATERIAL CO., LTD.
    Inventors: Jinhua Huang, Pengxing Wang, Qingguo Gong, Yuzheng Shi, Jiangquan Liao