Abstract: A method for manufacturing a housing is disclosed. The method includes: roughening a first surface of the housing; placing the housing into a mold and performing an injection molding to form a plastic layer on the first surface and closely bonded to the housing; and defining a plurality of slots by cutting through the housing by means of milling without milling a part or all of the plastic layer, wherein the plastic layer is configured to keep a connecting portion between adjacent slots defined in the housing undeformed during the milling. A mobile terminal is also disclosed.

Abstract: A housing for a mobile terminal, a method for manufacturing the housing, and a mobile terminal having the housing are provided. The housing includes a substrate, at least one slot penetrating through the substrate in a thickness direction of the substrate, and a filling layer received in the at least one slot. The filling layer includes an insulating sub-layer and a printed sub-layer located on the insulating sub-layer.

Abstract: A housing for a mobile terminal, a method for manufacturing the housing, and a mobile terminal having the housing are provided. The housing includes a substrate made of metal, at least one slot penetrating through the substrate in a thickness direction of the substrate, and a filling layer received in the at least one slot. The filling layer includes an insulating sub-layer and a printed sub-layer located on the insulating sub-layer.

Abstract: A housing, a method for manufacturing an antenna, and a mobile terminal having the housing are provided. The housing includes a substrate at least including a metal area, a slot defined in the metal area of the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a paint layer on the insulating layer. The paint layer has a width which is 0.02-0.06 mm larger than that of the insulating layer. An outer surface of the paint layer and an outer surface of the substrate have a same color.

Abstract: A housing for a mobile terminal, a method for manufacturing the housing, and a mobile terminal having the housing are provided. The housing includes a substrate, at least one slot penetrating through the substrate in a thickness direction of the substrate, and a filling layer received in the at least one slot. The filling layer includes an insulating sub-layer and a printed sub-layer located on the insulating sub-layer.

Abstract: A method for manufacturing a housing is disclosed. The method includes: roughening a first surface of the housing; placing the housing into a mold and performing an injection molding to form a plastic layer on the first surface and closely bonded to the housing; and defining a plurality of slots by cutting through the housing by means of milling without milling a part or all of the plastic layer, wherein the plastic layer is configured to keep a connecting portion between adjacent slots defined in the housing undeformed during the milling. A mobile terminal is also disclosed.

Abstract: A housing, a method for manufacturing the housing, and a mobile terminal having the housing include a substrate including a metal area, a slot defined in the metal area of the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a paint layer on the insulating layer.

Abstract: A cover plate, a method of manufacturing the cover plate, and an electronic device having the cover plate are provided. The cover plate includes a substrate, at least one slot defined in the substrate and penetrating through the substrate, and a filling layer received in the slot including an insulating layer and a gel layer located on the insulating layer.

Abstract: A housing for a mobile terminal, a method for manufacturing the housing, and a mobile terminal having the housing are provided. The housing includes a substrate made of metal and a slot penetrating through the substrate. A filling layer is received in the slot and includes a printed sub-layer and an insulating sub-layer from top to bottom. The printed sub-layer has a thickness of 0.1-0.3 mm. The printed sub-layer is formed of a polymer film subjected to a color printing process. After the color printing process, the polymer film is subjected to one or more black/white color printing processes.

Abstract: A housing, a method for manufacturing an antenna, and a mobile terminal having the housing are provided. The housing includes a substrate at least including a metal area, a slot defined in the metal area of the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a paint layer on the insulating layer. The paint layer has a width which is 0.02-0.06 mm larger than that of the insulating layer. An outer surface of the paint layer and an outer surface of the substrate have a same color.

Abstract: A housing for a mobile terminal, a method for manufacturing the housing, and a mobile terminal having the housing are provided. The housing includes a substrate made of metal and a slot penetrating through the substrate. A filling layer is received in the slot and includes a printed sub-layer and an insulating sub-layer from top to bottom. The printed sub-layer has a thickness of 0.1-0.3 mm. The printed sub-layer is formed of a polymer film subjected to a color printing process. After the color printing process, the polymer film is subjected to one or more black/white color printing processes.

Abstract: A cover plate, a method of manufacturing the cover plate, and an electronic device having the cover plate are provided. The cover plate includes a substrate, at least one slot defined in the substrate and penetrating through the substrate, and a filling layer received in the slot including an insulating layer and a gel layer located on the insulating layer.

Abstract: A housing for a mobile terminal, a method for manufacturing the housing, and a mobile terminal having the housing are provided. The housing includes a substrate made of metal, at least one slot penetrating through the substrate in a thickness direction of the substrate, and a filling layer received in the at least one slot. The filling layer includes an insulating sub-layer and a printed sub-layer located on the insulating sub-layer.

Abstract: A housing, a method for manufacturing the housing, and a mobile terminal having the housing include a substrate including a metal area, a slot defined in the metal area of the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a paint layer on the insulating layer.

Abstract: A laminated SMD-type thermistor has a conductive module, a left and a right conductive metal layer. The conductive module includes a core conductive module coated with an insulating layer on the upper and lower surface, and the left and right side. The core conductive module includes at least one conductive unit piled up in sequence, two conductive units are separated by an insulating material layer. The conductive unit includes an upper metal foil, a conductive polymer chip and a lower metal foil which are laminated in sequence from top to bottom. A left and right conductive metal layer are coated on the left and right part of the conductive module respectively, and penetrate the insulating layer partially, to connect with two metal foils of the conductive unit respectively. The laminated SMD-type thermistor can further comprise two plating resistant films coated on the upper and lower surface of the conductive module.

Abstract: A laminated SMD-type thermistor has a conductive module, a left and a right conductive metal layer. The conductive module includes a core conductive module coated with an insulating layer on the upper and lower surface, and the left and right side. The core conductive module includes at least one conductive unit piled up in sequence, two conductive units are separated by an insulating material layer. The conductive unit includes an upper metal foil, a conductive polymer chip and a lower metal foil which are laminated in sequence from top to bottom. A left and right conductive metal layer are coated on the left and right part of the conductive module respectively, and penetrate the insulating layer partially, to connect with two metal foils of the conductive unit respectively. The laminated SMD-type thermistor can further comprise two plating resistant films coated on the upper and lower surface of the conductive module.