Patents by Inventor Qinghung Lin

Qinghung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SURFACE TREATMENT OF INTER-LAYER DIELECTRIC
    Publication number: 20070222081
    Abstract: When an interconnect structure is built on porous ultra low k (ULK) material, the bottom of the trench and/or via is usually damaged by a following metallization process which may be suitable for dense higher dielectric materials. Embodiment of the present invention may provide a method of forming an interconnect structure on an inter-layer dielectric (ILD) material. The method includes steps of treating an exposed area of said ILD material to create a densified area, and metallizing said densified area.
    Type: Application
    Filed: March 23, 2006
    Publication date: September 27, 2007
    Applicant: International business machine corporation
    Inventors: Shyng-Tsong Chen, Qinghung Lin, Kelly Malone, Sanjay Mehta, Terry Spooner, Chih-Chao Yang